Integrated circuit packaging

Electronic Chemicals and Materials Market worth $77.8 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Thursday, March 7, 2024
Semiconductor, Chip on board, Acetic acid, Polychlorinated biphenyl, Silicon, PPB, Miniaturization, Health, Internet of things, Growth, ICS, Electronics, Plant, BASF, PPT, Printed circuit board, Space research, Linde plc, Integrated circuit packaging, Integrated circuit, Fujifilm, Air Liquide, Air Products, PCB, Tablet, Merck Group

Additionally, the trend towards miniaturization of electronic devices and the need for high-performance, reliable PCBs are contributing to the growth of the electronic chemicals and materials market.

Key Points: 
  • Additionally, the trend towards miniaturization of electronic devices and the need for high-performance, reliable PCBs are contributing to the growth of the electronic chemicals and materials market.
  • Semiconductor application segment of the electronic chemicals and materials market is expected to register the highest CAGR during the forecast period.
  • The semiconductor application segment within the electronic chemicals and materials market is anticipated to experience the highest Compound Annual Growth Rate (CAGR) throughout the forecast period.
  • North America accounts for the 2nd largest share in terms of the value of the electronic chemicals and materials market.

Electronic Chemicals and Materials Market worth $77.8 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Thursday, March 7, 2024
Semiconductor, Chip on board, Acetic acid, Polychlorinated biphenyl, Silicon, PPB, Miniaturization, Health, Internet of things, Growth, ICS, Electronics, Plant, BASF, PPT, Printed circuit board, Space research, Linde plc, Integrated circuit packaging, Integrated circuit, Fujifilm, Air Liquide, Air Products, PCB, Tablet, Merck Group

Additionally, the trend towards miniaturization of electronic devices and the need for high-performance, reliable PCBs are contributing to the growth of the electronic chemicals and materials market.

Key Points: 
  • Additionally, the trend towards miniaturization of electronic devices and the need for high-performance, reliable PCBs are contributing to the growth of the electronic chemicals and materials market.
  • Semiconductor application segment of the electronic chemicals and materials market is expected to register the highest CAGR during the forecast period.
  • The semiconductor application segment within the electronic chemicals and materials market is anticipated to experience the highest Compound Annual Growth Rate (CAGR) throughout the forecast period.
  • North America accounts for the 2nd largest share in terms of the value of the electronic chemicals and materials market.

Cadence Custom Design Migration Flow Accelerates Adoption of TSMC N3E and N2 Process Technologies

Retrieved on: 
Tuesday, April 25, 2023
Electronic Design Automation, Semiconductor, Consumer Electronics, Technology, Software, Internet, Hardware, Custom, Kurdistan, Cadence Design Systems, CDNS, Virtuoso, Integrated circuit packaging, SOC, PCB, TSMC, Printed circuit board, Cadence

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of a node-to-node design migration flow based on the Cadence® Virtuoso® Design Platform compatible with all TSMC advanced nodes, including the latest N3E and N2 process technologies.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of a node-to-node design migration flow based on the Cadence® Virtuoso® Design Platform compatible with all TSMC advanced nodes, including the latest N3E and N2 process technologies.
  • This new generative design migration flow was jointly developed by Cadence and TSMC to provide a simplified and automated approach to migrate custom and analog IC designs among TSMC’s process technologies.
  • The Virtuoso Design Platform automatically migrates schematic cells, parameters, pins and wiring from one TSMC process node to another.
  • “Our Virtuoso Design Platform’s proven node-to-node generative design migration technology can shave weeks off the time required to migrate a complex IC design between nodes, which is critical in the highly competitive chip design market.”
    The Cadence Virtuoso Design Platform supports the Cadence Intelligent System Design™ strategy, enabling system-on-chip (SoC) design excellence.

Cadence’s New Flow Automates Custom/Analog Design Migration on TSMC Advanced Technologies

Retrieved on: 
Wednesday, October 26, 2022
Electronic Design Automation, Semiconductor, Consumer Electronics, Technology, Mobile, Wireless, Software, Hardware, Layout, Custom, Fortune, PCB, Integrated circuit packaging, Hyperscale computing, Kurdistan, Intelligent system, Â, Cadence Design Systems, Nasdaq, Technology, Virtuoso, SOC, IP, CDNS, Environment, TSMC, Printed circuit board, Video game console, Cadence

Cadence Design Systems, Inc. (Nasdaq: CDNS) collaborated with TSMC to develop a node-to-node design migration flow built upon the Cadence Virtuoso design platform for custom/analog IC blocks that use TSMCs advanced process technologies.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) collaborated with TSMC to develop a node-to-node design migration flow built upon the Cadence Virtuoso design platform for custom/analog IC blocks that use TSMCs advanced process technologies.
  • The Cadence and TSMC R&D teams worked together to ensure the Virtuoso Schematic Editor and Layout Editor automatically migrate a source design on TSMC N5 and N4 process technologies to a new design on TSMC N3E process technology.
  • Early analog design IP trials of the new migration flow showed that design time on common analog blocks was more than 2.5X faster compared with manual migration.
  • The Cadence Virtuoso design platform supports the Cadence Intelligent System Design strategy, enabling system-on-chip (SoC) design excellence.

System in Package (SiP) Technology Market to Reach $34.2 Bn, Globally, by 2030 at 9.7% CAGR: Allied Market Research

Retrieved on: 
Tuesday, June 21, 2022
CAGR, Memory, Internet, Application-specific integrated circuit, Defense, Electronics, SIP, Efficiency, IOT, Adoption, Research, Data, COVID-19, Growth, 3D, Wire, Consumer electronics, Integrated circuit packaging, Industrial, ICS, Video game console, Animal, Technology

PORTLAND, Ore., June 21, 2022 /PRNewswire/ -- Allied Market Research published a report, titled, "System in Package (SiP) Technology Market by Packaging Technology (2D IC Packaging, 2.5D IC Packaging, 3D IC Packaging), by Packaging Method (Wire Bond, Flip Chip), by End User (Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace and Defense, Others): Global Opportunity Analysis and Industry Forecast, 2020-2030." According to the report, the global system in package (sip) technology market generated $14.8 billion in 2020, and is expected to reach $34.2 billion by 2030, witnessing a CAGR of 9.7% from 2021 to 2030.

Key Points: 
  • The emergence of 5G network connected devices and increase in the number of the internet of things (IoT) devices drive the growth of the global system in package (SiP) technology market.
  • According to the report, the global system in package (sip) technology market generated $14.8 billion in 2020, and is expected to reach $34.2 billion by 2030, witnessing a CAGR of 9.7% from 2021 to 2030.
  • However, the high level of integration leading to thermal issues poses challenges in adoption, which, in turn, hinders the market growth.
  • This created hindrances in the market growth for global system in package (SiP) technology.

System in Package (SiP) Technology Market to Reach $34.2 Bn, Globally, by 2030 at 9.7% CAGR: Allied Market Research

Retrieved on: 
Tuesday, June 21, 2022
CAGR, Memory, Internet, Application-specific integrated circuit, Defense, Electronics, SIP, Efficiency, IOT, Adoption, Research, Data, COVID-19, Growth, 3D, Wire, Consumer electronics, Integrated circuit packaging, Industrial, ICS, Video game console, Animal, Technology

PORTLAND, Ore., June 21, 2022 /PRNewswire/ -- Allied Market Research published a report, titled, "System in Package (SiP) Technology Market by Packaging Technology (2D IC Packaging, 2.5D IC Packaging, 3D IC Packaging), by Packaging Method (Wire Bond, Flip Chip), by End User (Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace and Defense, Others): Global Opportunity Analysis and Industry Forecast, 2020-2030." According to the report, the global system in package (sip) technology market generated $14.8 billion in 2020, and is expected to reach $34.2 billion by 2030, witnessing a CAGR of 9.7% from 2021 to 2030.

Key Points: 
  • The emergence of 5G network connected devices and increase in the number of the internet of things (IoT) devices drive the growth of the global system in package (SiP) technology market.
  • According to the report, the global system in package (sip) technology market generated $14.8 billion in 2020, and is expected to reach $34.2 billion by 2030, witnessing a CAGR of 9.7% from 2021 to 2030.
  • However, the high level of integration leading to thermal issues poses challenges in adoption, which, in turn, hinders the market growth.
  • This created hindrances in the market growth for global system in package (SiP) technology.

TOYOTA GAZOO Racing Premieres GRMN Yaris in Japan

Retrieved on: 
Friday, January 14, 2022
GR, Makuhari Messe, Overalls, Super Taikyu Series, Comparison, Tokyo Auto Salon, Integrated circuit packaging, TGR, GRMN, LSD, Program, Yaris, Taxicab, Rail transport

TOKYO, Jan 14, 2022 - (JCN Newswire) - TOYOTA GAZOO Racing (TGR) premiered the "GRMN(1) Yaris"(2) at Tokyo Auto Salon 2022(3) on January 14.

Key Points: 
  • TOKYO, Jan 14, 2022 - (JCN Newswire) - TOYOTA GAZOO Racing (TGR) premiered the "GRMN(1) Yaris"(2) at Tokyo Auto Salon 2022(3) on January 14.
  • The GRMN Yaris is a fully tuned model of the GR Yaris that has gone through rigorous refinement with professional drivers.
  • The development of the GRMN Yaris began from Morizo's desire to "deliver cars to customers that evolve quickly and can be tailored to individuals like in the field of motorsports."
  • (2) "GRMN Yaris" is used for marketing purposes; the name used in vehicle registration, etc.

Optomec Receives $2 Million Order for 6 Production 3D Electronics Printers

Retrieved on: 
Thursday, January 13, 2022
Electronic Design Automation, Semiconductor, Chemicals, Plastics, Technology, Manufacturing, Hardware, 3D printing, Ernest K. Warburton (US Air Force), High-pass filter, HD2, Biomedical engineering, Raytheon Technologies, Additive, Samsung, Lite-On, Inc., Printing, Printed electronics, GE, Solution, Electronics, United States Air Force, Industry, NASA, LENS, Integrated circuit packaging, Multimedia, Lockheed, PCB, Printed circuit board, United States Army, United States Navy

Optomec Inc. today announced that one of its existing production customers recently purchased another six (6) Aerosol Jet 3D Electronics Printers, bringing its total count to 20 systems.

Key Points: 
  • Optomec Inc. today announced that one of its existing production customers recently purchased another six (6) Aerosol Jet 3D Electronics Printers, bringing its total count to 20 systems.
  • View the full release here: https://www.businesswire.com/news/home/20220113005747/en/
    Semiconductor Packaging examples showing Printed 3D Interconnects for 3D stacked die (l), mmWave (c), and flex circuit (r).
  • Optomecs patented Aerosol Jet 3D Electronics Printers are an Additive Electronics solution uniquely capable of directly printing high resolution conductive circuitry, with feature sizes as small as 10 microns.
  • Production applications include direct printing of 3D Antenna, 3D Sensors, Medical Electronics, Semiconductor Packaging and Display Assembly.

Optomec Reports $2 Million in Orders from Leading Media and Technology OEM

Retrieved on: 
Monday, November 1, 2021
Other Manufacturing, Hardware, Electronic Design Automation, Consumer Electronics, Technology, Semiconductor, Manufacturing, Mobile, Wireless, Georgia Tech, NASA, University, Virtual reality, Digital product design, Industry, AR, Printed electronics, 3D printing, Display device, E-textiles, 3D, Electronics, Software, University of Cambridge, View, CGMS-A, Biomedical engineering, LENS, Samsung, Ernest K. Warburton (US Air Force), Inc., Â, Continuous glucose monitor, Raytheon Technologies, Brain–computer interface, Multimedia, Wearable, GE, Lockheed, Solution, Lite-On, Additive, United States Air Force, Printing, Integrated circuit packaging, Sandia National Laboratories

Optomec Inc., the leading supplier of 3D Additive Electronics manufacturing solutions today announced the receipt of orders totaling approximately $2 Million from a premier supplier of digital connectivity solutions.

Key Points: 
  • Optomec Inc., the leading supplier of 3D Additive Electronics manufacturing solutions today announced the receipt of orders totaling approximately $2 Million from a premier supplier of digital connectivity solutions.
  • The recent orders include the delivery of three (3) Aerosol Jet 3D Electronics Printers, together with related Software and Digital Products, plus professional services to support their application development.
  • The customer is leveraging Optomecs patented Aerosol Jet process for the development and ultimate production of a variety of next generation Wearable devices.
  • LENS is a registered trademark of Sandia National Labs; Aerosol Jet is a registered trademark of Optomec, Inc.
    View source version on businesswire.com: https://www.businesswire.com/news/home/20211101005906/en/

Optomec Receives 5 Machine Order for 3D Printed Electronics Production at OEM

Retrieved on: 
Thursday, September 9, 2021
Automotive Manufacturing, Consumer Electronics, Aerospace, Technology, Manufacturing, Other Technology, Other Manufacturing, Steel, Packaging, Hardware, Electronic Design Automation

View the full release here: https://www.businesswire.com/news/home/20210909005827/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20210909005827/en/
    Semiconductor Packaging examples showing Printed 3D Interconnects for 3D stacked die (l), mmWave (c), and flex circuit (r).
  • They have been using Optomecs patented Aerosol Jet 3D Printed Electronics solution in production since 2018 for advanced semiconductor packaging applications in a proprietary mobile device end-product.
  • This most recent multi-system 3D Additive Electronics order is further testimony to the production viability of Optomecs solutions, said David Ramahi, Optomec CEO.
  • Production applications include direct printing of 3D Antenna, 3D Sensors, Medical Electronics, Semiconductor Packaging and Display Assembly.