Integrated circuit design

Avatar Integrated Systems Continues to Tackle Advanced Process Node Design Challenges With New Aprisa release

Retrieved on: 
Monday, May 18, 2020

Avatar introduced Sibling Routing and PowerFirst technologies in the Aprisa 19.1 release in 2019 .

Key Points: 
  • Avatar introduced Sibling Routing and PowerFirst technologies in the Aprisa 19.1 release in 2019 .
  • Aprisa 19.1 rel.3 demonstrates Avatars dedication to helping designers overcome some of the most daunting challenges in IC design today.
  • In addition to the technology advancements to the companys flagship product Aprisa, Avatar has also been granted three new U.S. patents during Q1 2020.
  • New feature to improving IR-drop at advanced nodes,
    Avatar Integrated Systems is a leading software company in the Electronic Design Automation (EDA) industry focused on Physical Design Implementation.

Synopsys Introduces 3DIC Compiler, Industry's First Unified Platform to Accelerate Multi-die System Design and Integration

Retrieved on: 
Tuesday, April 28, 2020

With 3DIC Compiler, IC design and packaging teams are enabled to achieve unparalleled levels of multi-die integration, co-design and faster time to convergence.

Key Points: 
  • With 3DIC Compiler, IC design and packaging teams are enabled to achieve unparalleled levels of multi-die integration, co-design and faster time to convergence.
  • "Synopsys' 3DIC Complier with its unified platform is an industry disruptor in how advanced multi-die packages are designed, as it has redefined the conventional tool boundaries across the full design workflow for 2.5D/3D multi-die solutions."
  • An increasing number of factors are driving system design teams to leverage multi-die integration to address new applications such as artificial intelligence and high-performance computing.
  • Synopsys' 3DIC Compiler is built on an IC design data model enabling scalability in capacity and performance with more modern 3DIC structures.

Faraday Delivers System-Level ESD Protection Service to Reduce ASIC Time-to-Market

Retrieved on: 
Tuesday, March 17, 2020

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its system-level ESD (electrostatic discharge) protection service.

Key Points: 
  • Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its system-level ESD (electrostatic discharge) protection service.
  • Faraday has successfully deployed this service in many ASIC projects, including factory automation applications, further shortening production lead times.
  • Faraday not only provides common chip-level ESD protection service, but also offers the system-level service that further helps customers eliminate system-level electrostatic problems and achieve a smooth path to mass production, said Jim Wang, vice president of operations at Faraday.
  • Faraday Technology Corporation (TWSE: 3035) is a leading ASIC design service and IP provider, certificated to ISO 9001 and ISO 26262.

Si2 Launches Special Interest Group for AI and ML in Electronic Design Automation

Retrieved on: 
Tuesday, February 25, 2020

Silicon Integration Initiative has launched a special interest group to focus on the growing needs and opportunities in artificial intelligence and machine learning for electronic design automation.

Key Points: 
  • Silicon Integration Initiative has launched a special interest group to focus on the growing needs and opportunities in artificial intelligence and machine learning for electronic design automation.
  • The group will identify current solutions and technology gaps in AI and ML strategies for EDA digital design.
  • AI and ML are changing semiconductor design and improving performance and time to market, said Leigh Anne Clevenger, Si2 design automation data scientist.
  • High manufacturing costs and the growing complexity of chip development are spurring disruptive technologies such as AI and ML, Clevenger explained.

Real Intent Ranks #3 in “Best of 2019” Electronic Design Automation Tools

SUNNYVALE, Calif., Feb. 20, 2020 (GLOBE NEWSWIRE) -- Real Intent, Inc., today announced that semiconductor users ranked Real Intents static sign-off tools #3 in the Electronic Design Automation (EDA) Tool Report by DeepChip.com, where hundreds of users review their top EDA products.

Key Points: 
  • SUNNYVALE, Calif., Feb. 20, 2020 (GLOBE NEWSWIRE) -- Real Intent, Inc., today announced that semiconductor users ranked Real Intents static sign-off tools #3 in the Electronic Design Automation (EDA) Tool Report by DeepChip.com, where hundreds of users review their top EDA products.
  • This is the second year in a row that Real Intent has ranked in the top 3.
  • Real Intent wasranked #3for its tools for its:1)Static sign-off toolsfor multimode & single-modeclock domain crossing, reset domain crossing, structural linting,and2) Formal linting tool.
  • Real Intent provides intent-driven static signoff EDA software tools to accelerate early functional verification and advanced sign-off of digital designs.

New Version of Si2 oaScript Expands IC Design Capabilities into the Cloud and AI

Retrieved on: 
Thursday, February 20, 2020

Design partitioning and multi-threaded parallel execution are key features of the updated scripting interface to OpenAccess, the industrys most widely used IC design database.

Key Points: 
  • Design partitioning and multi-threaded parallel execution are key features of the updated scripting interface to OpenAccess, the industrys most widely used IC design database.
  • oaScript Version 4.0developed by programming experts in the Silicon Integration Initiative oaScript Working Groupleverages the powerful enhancements available to OpenAccess in its most recent Data Model 6 upgrade.
  • Marshall Tiner, Si2 director of Production Standards, stated, oaScript 4.0 supports the new DM6 design partitioning capability, oaPartitions.
  • oaPartitions allows an application to rapidly load design instances, shapes, or vias from a given partition without loading an entire design.

The Design Automation Conference to Showcase an AI Hardware Pavilion, Broadening the 2020 Exhibition Lineup

Retrieved on: 
Thursday, February 13, 2020

The Design Automation Conference (DAC) , the premier conference devoted to the design and automation of electronic circuits and systems, will this year showcase a dedicated Pavilion centered on the artificial intelligence (AI) hardware ecosystem.

Key Points: 
  • The Design Automation Conference (DAC) , the premier conference devoted to the design and automation of electronic circuits and systems, will this year showcase a dedicated Pavilion centered on the artificial intelligence (AI) hardware ecosystem.
  • DAC is becoming the home for AI hardware IP, AI design automation and everything that goes into silicon chip implementation.
  • It makes perfect sense to introduce an AI hardware pavilion at DAC 2020 for the new innovative AI startups to shine.
  • The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems, and for electronic design automation (EDA) and silicon solutions.

Lumerical Teams with OFC Lab Automation Hackathon and SMART Photonics to Open New Design Challenge: The OFC Hackathon Device Challenge

Retrieved on: 
Wednesday, February 12, 2020

I'll be able to use the design files that Lumerical sent me to execute Photonic Inverse Design back home targeted to my specific designs."

Key Points: 
  • I'll be able to use the design files that Lumerical sent me to execute Photonic Inverse Design back home targeted to my specific designs."
  • University of Maryland graduate student Sabyasachi Barik generated the best design at the Photonic Inverse Design Challenge at Photonics West, with a score of 18,765.
  • OFC Lab Automation Hackathon and Lumerical are co-hosting the device simulation challenge.
  • The challenge is open to all design teams and all kinds of design techniques, including Photonic Inverse Design.

Global Electronic Design Automation Market 2020-2024| Rising Adoption of ICs across Various Applications to Boost the Market Growth | Technavio

Retrieved on: 
Thursday, February 6, 2020

The electronic design automation market is expected to grow by USD 4.7 billion during 2020-2024 according to the latest market research report by Technavio.

Key Points: 
  • The electronic design automation market is expected to grow by USD 4.7 billion during 2020-2024 according to the latest market research report by Technavio.
  • View the full release here: https://www.businesswire.com/news/home/20200206005639/en/
    Technavio has announced its latest market research report titled global electronic design automation market 2020-2024 (Graphic: Business Wire)
    The adoption of semiconductor ICs across various end-user sectors such as automotive, healthcare, communication, IoT, and computing is growing rapidly.
  • The rising adoption of semiconductor ICs across various applications is expected to drive the growth of the market.
  • The APAC region led the electronic design automation market in 2019, followed by North America, Europe, South America and MEA.

The Annual Marie R. Pistilli Women in Electronic Design Award Opens Call for Nominations

Retrieved on: 
Tuesday, January 14, 2020

Nominations are now being accepted for the 2020 Marie R. Pistilli Women in Electronic Design Award .

Key Points: 
  • Nominations are now being accepted for the 2020 Marie R. Pistilli Women in Electronic Design Award .
  • The Marie R. Pistilli Award honors a woman or man in semiconductor-related industry or academia.
  • Past recipients have played key roles in creating, launching, or managing products that involved contributions from women or created opportunities for women in the industry.
  • The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems, and for electronic design automation (EDA) and silicon solutions.