Silicon Integration Initiative

OpenAccess Color Team Garners Annual Si2 Power of Partnerships Award

Retrieved on: 
Tuesday, July 25, 2023

Technologists from Intel and Microsoft are 2023 winners of the Silicon Integration Initiative Power of Partnerships Award, presented annually to the Si2 volunteer team with the most significant contributions to the electronic design automation industry.

Key Points: 
  • Technologists from Intel and Microsoft are 2023 winners of the Silicon Integration Initiative Power of Partnerships Award, presented annually to the Si2 volunteer team with the most significant contributions to the electronic design automation industry.
  • The Si2 OpenAccess Multi-Patterning Technology (oaxColor) Working Group, led by Benjamin Hoefer of Intel, won the award for developing oaxColor, a managed extension to the OpenAccess API.
  • OpenAccess is one of the most widely used open-reference databases for IC design.
  • Marshall Tiner, Si2 senior director of OpenAccess, said, “The lack of multipattern technology support had impeded the further expansion of OA interoperability in this area.

NXP Semiconductors Executive Reelected Board Chair of Silicon Integration Initiative for 2023-2024

Retrieved on: 
Thursday, July 20, 2023

Pankaj Kukkal, executive vice president of MCU/MPU Engineering for NXP Semiconductors, has been elected to a second term as board chair at Silicon Integration Initiative .

Key Points: 
  • Pankaj Kukkal, executive vice president of MCU/MPU Engineering for NXP Semiconductors, has been elected to a second term as board chair at Silicon Integration Initiative .
  • View the full release here: https://www.businesswire.com/news/home/20230720494194/en/
    Pankaj Kukkal, executive vice president of MCU/MPU Engineering for NXP Semiconductors, has been elected to a second term as board chair at Silicon Integration Initiative.
  • Kukkal joined the Si2 board in 2020 to advocate for improved integrated circuit design tool interoperability and assumed the chair role in 2022.
  • Before NXP, he held executive leadership and engineering positions at Qualcomm and Intel, and design engineering positions at startup Knowledge Based Silicon and Ricoh Electronics.

Robert Aslett Named Si2 President and CEO

Retrieved on: 
Thursday, May 4, 2023

Silicon Integration Initiative today announced that it appointed Robert Aslett as president and chief executive officer.

Key Points: 
  • Silicon Integration Initiative today announced that it appointed Robert Aslett as president and chief executive officer.
  • View the full release here: https://www.businesswire.com/news/home/20230504006035/en/
    A former Intel engineering vice president and general manager, Aslett has over 30 years of experience leading global technical organizations.
  • After leaving Intel, Aslett became an investor partner with Social Venture Partners of Portland, a leader in applying venture philanthropy to create social impact.
  • Technology Interoperability Trajectory Advisory CouNcil (TITAN) — serves the Si2 board in an advisory role, identifying industry infrastructural gaps in design automation interoperability.

New Advanced SPICE Model for ESD Diodes Addresses Challenges in IC Design and Protection

Retrieved on: 
Tuesday, February 7, 2023

"Accurate SPICE simulation of electrostatic discharge scenarios and circuit protection is crucial to avoid ESD failures in integrated circuits and products," said Khandelwal.

Key Points: 
  • "Accurate SPICE simulation of electrostatic discharge scenarios and circuit protection is crucial to avoid ESD failures in integrated circuits and products," said Khandelwal.
  • The Advanced SPICE Model for ESD Diodes captures diode behavior under ESD event conditions."
  • This new standard will help IC manufacturers ensure their products meet industry standards for ESD and provide a more robust solution for ESD design.
  • Compact Model Coalition SPICE models are used to design and simulate the world’s most advanced semiconductors.

Si2 Board Welcomes New Representatives from Leading EDA Providers

Retrieved on: 
Thursday, November 3, 2022

This change in board leadership represents a deepening in product and R&D involvement by our EDA partners, said Pankaj Kukkal, chair of the Si2 board of directors and vice president of EDA, emulation and post-silicon engineering for Qualcomm Technologies.

Key Points: 
  • This change in board leadership represents a deepening in product and R&D involvement by our EDA partners, said Pankaj Kukkal, chair of the Si2 board of directors and vice president of EDA, emulation and post-silicon engineering for Qualcomm Technologies.
  • Aparna continues to represent Cadence in leadership positions at Si2, IEEE and Accellera, and Daves strategic planning savvy was fundamental in driving Si2 toward its current focus on system-level interoperability.
  • I look forward to helping the board determine the best path forward for Si2 and for the industry as a whole.
  • Si2 has more than 65 members, including semiconductor and fabless manufacturers, foundries and EDA companies.

Si2 Announces New Board Chair at 2022 Annual Members Meeting

Retrieved on: 
Thursday, September 29, 2022

At its recent Annual Members Meeting, Silicon Integration Initiative announced the election of Pankaj Kukkal, vice president of EDA, emulation, and post-silicon engineering for Qualcomm Technologies, as chair of the board of directors.

Key Points: 
  • At its recent Annual Members Meeting, Silicon Integration Initiative announced the election of Pankaj Kukkal, vice president of EDA, emulation, and post-silicon engineering for Qualcomm Technologies, as chair of the board of directors.
  • "Rahul will continue to be an integral part of Si2s board," said John Ellis, Si2 president and CEO.
  • "During his tenure as chair, Si2 created an internal technology incubator to develop new interoperability solutions.
  • The Annual Members Meeting featured an executive round table with Kukkal, Goyal, and former Si2 board chair Leon Stok, vice president of EDA at IBM.

Si2 Names Recipients of Annual Power of Partnerships Award

Retrieved on: 
Wednesday, June 29, 2022

Technologists from Intel, IBM, Microsoft and Cadence Design Systems are this year's Silicon Integration Initiative Power of Partnerships Award winners, recognizing the Si2 volunteer team with the most significant contributions to silicon-to-system implementation.

Key Points: 
  • Technologists from Intel, IBM, Microsoft and Cadence Design Systems are this year's Silicon Integration Initiative Power of Partnerships Award winners, recognizing the Si2 volunteer team with the most significant contributions to silicon-to-system implementation.
  • The OA database creates interoperability between EDA companies and semiconductor designers and manufacturers.
  • The Si2 board of directors is focused on improving OA interoperability and this team has risen to the challenge," said Marshall Tiner, senior director of OA.
  • The Si2 membership includes more than 65 semiconductor and fabless manufacturers, foundries and EDA companies.

Si2 Forum Addresses Novel Approaches to Low-Power Semiconductor Design

Retrieved on: 
Monday, June 20, 2022

Cosponsored by IEEE CEDA, the Si2 Low-Power Forum features ten leading semiconductor design architects, academics, and practitioners of electronic design automation.

Key Points: 
  • Cosponsored by IEEE CEDA, the Si2 Low-Power Forum features ten leading semiconductor design architects, academics, and practitioners of electronic design automation.
  • They will present novel strategies and solutions for speeding the adoption of low-power design, and fabrication of semiconductors.
  • Advanced system design architectures are limited by efficiency and scalability of low-power analysis, said Leigh Anne Clevenger, Si2 vice president, technology.
  • The Si2 membership includes more than 65 semiconductor and fabless manufacturers, foundries and EDA companies.

The Valens Company Reports First Quarter Fiscal 2022 Financial Results

Retrieved on: 
Wednesday, April 13, 2022

See reconciliation of "Adjusted Gross Profit (non-GAAP measure)" in the Company's Management's Discussion and Analysis for the quarter ended February 28, 2022.

Key Points: 
  • See reconciliation of "Adjusted Gross Profit (non-GAAP measure)" in the Company's Management's Discussion and Analysis for the quarter ended February 28, 2022.
  • See reconciliation of "Adjusted EBITDA (non-GAAP measure)" in the Company's Management's Discussion and Analysis for the three months ended February 28, 2022.
  • The Company will host a conference call tomorrow, Thursday, April 14, 2022, at 11:00 AM Eastern Time / 8:00 AM Pacific Time to discuss the financial results and business outlook.
  • Nothing herein should be construed as either an offer to sell or a solicitation to buy or sell securities of The Valens Company.

Keysight Joins Si2 TITAN to Advance Silicon-to-System Technology Interoperability

Retrieved on: 
Thursday, April 7, 2022

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced it recently joined the Silicon Integration Initiative (Si2) Technology Interoperability Trajectory Advisory Council ( TITAN ).

Key Points: 
  • Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced it recently joined the Silicon Integration Initiative (Si2) Technology Interoperability Trajectory Advisory Council ( TITAN ).
  • TITAN is a thought leadership forum focused on accelerating ecosystem collaboration with technology interoperability for silicon-to-system success.
  • Our TITAN membership reflects Keysights commitment to contribute to technology interoperability and support industry standards within our PathWave tools and workflows.
  • Keysight has a long history of active participation in Si2 programs, said John Ellis, Si2 president and CEO.