Integrated circuits

First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency

Retrieved on: 
Tuesday, August 3, 2021

To enable next-generation aircraft electrical systems, new power conversion technology is required.

Key Points: 
  • To enable next-generation aircraft electrical systems, new power conversion technology is required.
  • Forty-percent lighter than others due to the modified substrate, the innovative design also produces an approximate 10% cost savings over standard power modules that incorporate metal baseplates.
  • The family incorporates silicon carbide MOSFETs and Schottky Barrier Diodes (SBDs) to maximize system efficiency.
  • Microchips power module technology as well as its ISO 9000- and AS9100-certified fabrication facilities provide high-quality units through flexible manufacturing alternatives.

Artificial Intelligence (AI) Chips Market to grow by USD 73.49 billion|Technavio

Retrieved on: 
Wednesday, August 4, 2021

NEW YORK, Aug. 3, 2021 /PRNewswire/ -- Technavio forecasts the artificial intelligence (AI) chips market to grow by USD73.49 billion, progressingat a CAGR of over51% during 2021-2025.

Key Points: 
  • NEW YORK, Aug. 3, 2021 /PRNewswire/ -- Technavio forecasts the artificial intelligence (AI) chips market to grow by USD73.49 billion, progressingat a CAGR of over51% during 2021-2025.
  • The artificial intelligence (AI) chips market report offers a comprehensive analysis of the strategies adopted by vendors and the trends, drivers, and challenges affecting the market size.
  • The Artificial Intelligence (AI) Chips Market is segmented by product (ASICs, GPUs, CPUs, and FPGAs) and geography (North America, Europe, APAC, South America, and MEA).
  • The artificial intelligence (AI) chips market covers the following areas:

Efabless & OpenROAD Advance Commercial Open Source Chip Design

SAN JOSE, Calif., July 29, 2021 (GLOBE NEWSWIRE) -- Efabless and the OpenROAD project are excited to announce combining their efforts to work closer together to advance and democratize chip design.

Key Points: 
  • SAN JOSE, Calif., July 29, 2021 (GLOBE NEWSWIRE) -- Efabless and the OpenROAD project are excited to announce combining their efforts to work closer together to advance and democratize chip design.
  • Importantly, the unifying of the offerings under the OpenROAD organization will provide a single point of focus for open source development, bringing more clarity and concentration of effort to advance open source design.
  • Efabless.com offers a crowd platform and marketplace for chip design that uses open source and community models to make the design and commercialization of ICs simple, inexpensive and accessible to everyone.
  • OpenROAD, launched in June 2018, is developing an open source, no-human-in-the-loop RTL-to-GDS EDA system to serve researchers and system innovators across the IC design and design automation communities.

SmartDV Leads Industry with Greatest Number of Design and Verification MIPI Protocol Standards Solutions for Mobile Applications

SAN JOSE, Calif., July 29, 2021 (GLOBE NEWSWIRE) -- SmartDV Technologies , the leader in Design and Verification Intellectual Property (IP), today announced the greatest number of commercially available Design and Verification IP solutions to support the MIPI protocol standards for mobile and other critical applications.

Key Points: 
  • SAN JOSE, Calif., July 29, 2021 (GLOBE NEWSWIRE) -- SmartDV Technologies , the leader in Design and Verification Intellectual Property (IP), today announced the greatest number of commercially available Design and Verification IP solutions to support the MIPI protocol standards for mobile and other critical applications.
  • The SmartDV portfolio has approximately 50 MIPI IP solutions, including Design IP, Verification IP, hardware emulation and FPGA prototyping models and post silicon validation IP.
  • MIPI is the most important interface specification for mobile and mobile-influenced applications, comments Deepak Kumar Tala, managing director of SmartDV.
  • This highly automated IP development and verification flow allows SmartDV to be the first to market with its MIPI products.

MZ Technologies Rolls Out New Technology Roadmap

Retrieved on: 
Thursday, July 29, 2021

ROME, July 29, 2021 /PRNewswire/ -- MZ Technologies has released its roadmap for its device/packaging Co-Design EDA tools that lays out an agenda of added features and reveals plans for generation 2.0 GENIO IC/package co-design tool.

Key Points: 
  • ROME, July 29, 2021 /PRNewswire/ -- MZ Technologies has released its roadmap for its device/packaging Co-Design EDA tools that lays out an agenda of added features and reveals plans for generation 2.0 GENIO IC/package co-design tool.
  • GENIO became the first commercially available IC/package co-design tool when MZ Technologies began taking order in August, 2020.The roadmap calls for additional features to the current tool set.
  • Expected in the first quarter of next year is availability of a parasitic estimation capability and stack planning support.
  • Parasitic Estimation then simulates a process-static timing analysis.The more technology information that is available, the more accurate is the estimation.

EPC Space Announces Cost Effective New 60 V Rad Hard Gallium Nitride (GaN) Power Device for Demanding Space Applications

Retrieved on: 
Wednesday, July 28, 2021

EPC Space announces the introduction of EPC7014UB, a 60 V radiation-hardened gallium nitride transistor that is lower in cost and is a more efficient solution than the nearest comparable radiation hardened (RH) silicon MOSFET.

Key Points: 
  • EPC Space announces the introduction of EPC7014UB, a 60 V radiation-hardened gallium nitride transistor that is lower in cost and is a more efficient solution than the nearest comparable radiation hardened (RH) silicon MOSFET.
  • The EPC7014UB , is a 60 V, 580 m, 4 APulsed, rad-hard eGaN FET in an industry standard UB package.
  • GaN technology enables a new generation of power conversion and motor drives in space operating at higher frequencies, higher efficiencies, lower cost, and greater power densities than achievable with rad hard silicon, said Bel Lazar, CEO of EPC Space.
  • EPC Space provides revolutionary high-reliability radiation hardened enhancement-mode gallium nitride power management solutions for space and other harsh environments.

Lattice sensAI Solution Stack Wins its 6th Industry Award with Elecfans AI Excellence Innovation Award

Retrieved on: 
Tuesday, July 27, 2021

Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced that the Lattice sensAI solution stack won a 2021 China AI Excellence Innovation Award from Elecfans magazine.

Key Points: 
  • Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced that the Lattice sensAI solution stack won a 2021 China AI Excellence Innovation Award from Elecfans magazine.
  • This marks the sixth industry award our sensAI solution stack has won since its launch three years ago, said Deepak Boppana, Sr. Director of Segments and Solutions Marketing, Lattice Semiconductor.
  • Optimized for the Lattice Nexus FPGA platform, Lattice sensAI solution stack brings new levels of power and performance to smart vision customer applications in the Surveillance/Security, Robotics, Automotive, and Computing markets.
  • To learn more about the sensAI solution stack from Lattice, please visit www.latticesemi.com/sensAI .

Boston Start-up JETCOOL Technologies Inc. Offers Solution to the Global Semiconductor Chip Shortage

Retrieved on: 
Tuesday, July 27, 2021

LITTLETON, Mass., July 27, 2021 /PRNewswire/ --The semiconductor chip shortage wreaking havoc on the automotive and tech industries is forecasted to reach into 2023 .

Key Points: 
  • LITTLETON, Mass., July 27, 2021 /PRNewswire/ --The semiconductor chip shortage wreaking havoc on the automotive and tech industries is forecasted to reach into 2023 .
  • One Boston start-up has a solution for enterprises to do more with their limited chip supply by using an innovative liquid cooling solution.
  • With the height of the pandemic behind us, manufacturers in both industries are now competing for semiconductor chip supply to meet unexpected market demands.
  • Bernie Malouin, CEO and Founder of Jetcool, explains:
    "With the global semiconductor supply shortage cross-cutting so many industries, companies need to do more with less.

Global and China Power Discrete (IGBT + MOSFET) Market (2021 to 2025) - Featuring CR Micro, Star Power and BYD Among Others - ResearchAndMarkets.com

Retrieved on: 
Tuesday, July 27, 2021

The "Global and China Power discrete (IGBT + MOSFET) Market Insight Report, 2021-2025" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global and China Power discrete (IGBT + MOSFET) Market Insight Report, 2021-2025" report has been added to ResearchAndMarkets.com's offering.
  • In 2020, the global market value of power discrete devices was US$ 26 billion, which expanded steadily in the past decade, with a CAGR of 6%.
  • The factors driving the market expansion include increasing demand for energy-saving electronic equipment, increasing demand for power products and increasing public awareness of environmental issues/stricter supervision.
  • From 2020 to 2025, the CAGR of industrial control and consumption application in China market will be stable at 2-5%.

SkyWater Technology to Strategically Invest $56 Million in Capacity Expansion and Gallium Nitride Technology

Retrieved on: 
Monday, July 26, 2021

The company intends to report actual second quarter fiscal 2021 financial results following the close of the market on Tuesday, August 3, 2021.

Key Points: 
  • The company intends to report actual second quarter fiscal 2021 financial results following the close of the market on Tuesday, August 3, 2021.
  • An archived webcast will be available on SkyWater Technologys Investor Relations page, https://ir.skywatertechnology.com .
  • SkyWaters Advanced Technology Services empower development of superconducting and 3D ICs, along with carbon nanotube, photonic and MEMS devices.
  • In future fiscal periods, we may exclude such items and may incur income and expenses similar to these excluded items.