Integrated circuit design

Electronic Design Automation Market to grow by USD 7.50 billion from 2022 to 2027; Growth Driven by the growing significance of EDA in the electronic design process- Technavio

Retrieved on: 
Tuesday, January 16, 2024
Integrated circuit, PCB, Siemens EDA, EDA, Synopsys, SOC, Computer-aided design, IC, Integrated circuit design, ANSYS, Chip on board, Growth, Digital, Risk, Cadence Design Systems, USD, Key, Keysight, Machine learning, Electronic, Video game

NEW YORK, Jan. 15, 2024 /PRNewswire/ -- The global electronic design automation market size is estimated to grow by USD 7.50 billion from 2023 to 2027, according to Technavio.

Key Points: 
  • NEW YORK, Jan. 15, 2024 /PRNewswire/ -- The global electronic design automation market size is estimated to grow by USD 7.50 billion from 2023 to 2027, according to Technavio.
  • The growing significance of EDA in the electronic design process drives market growth.
  • This evolution is witnessed across Electronic Design Tools, Analog Design Software, Digital Design Solutions, Chip Design Automation, PCB Layout, Electronic System Design, Design Verification, Hardware Design Tools, Electronic Circuit Simulation, ASIC Design, and System-on-Chip (SoC) Design.
  • This challenge pervades Semiconductor Design Software, VLSI Design, PCB Design Tools, FPGA Design, IC Design Solutions, Computer-Aided Design, Integrated Circuit Design, and Electronic Design Innovation.

VMO, U.S. Department of State, and PTIT University Collaborate on Climate Change Solutions by Opening CCE Hub in Hanoi Vietnam

Retrieved on: 
Thursday, October 5, 2023
Partnership, MOU, IC, Climate change, DOS, Student, VMO, Entrepreneurship, Integrated circuit design, Communication, United, Ministry of Natural Resources, Environment and Climate Change (Malaysia), Ministry of Information and Communications Technology (Qatar), Transport and Telecommunication Institute, Posts and Telecommunications Institute of Technology, Ho Chi Minh City, Ministry, Workforce, Telecommunications, CCE, U.S. Department of Defense Strategy for Operating in Cyberspace, Research, Renewable energy, Creative industries

The MOU formalized the DOS' Coalition for Climate Entrepreneurship (CCE) , a groundbreaking public-private partnership aimed at addressing climate issues while promoting economic empowerment in developing nations.

Key Points: 
  • The MOU formalized the DOS' Coalition for Climate Entrepreneurship (CCE) , a groundbreaking public-private partnership aimed at addressing climate issues while promoting economic empowerment in developing nations.
  • CCE aims to combat climate challenges while promoting entrepreneurship focused on climate solutions.
  • The CCE Lab will serve as a hub for climate tech innovation and semiconductor workforce development.
  • It will serve as a hub for innovation, skill development, and meaningful contributions to the global climate crisis.

Swave Photonics Adds Andrew Repton as Vice President of IC Design

Retrieved on: 
Thursday, May 25, 2023
Human, Headache, Engineering, Integrated circuit, Repton, IP, Morse Micro, Dialogue, CMOS, Holy Grail, Virtual reality, Integrated circuit design, AR, Economics, Dialog Semiconductor, ASIC, Management, Alan Turing, Johanna Elisabeth Swaving

LEUVEN, Belgium, May 25, 2023 /PRNewswire/ -- Swave Photonics, an innovator in Holographic eXtended Reality (HXR) technology to bring the metaverse to life, today announced the appointment of Andrew Repton as Vice President of Integrated Circuit Design. Repton brings significant experience and accomplishments leading global design teams, developing high-volume products for demanding applications, and building strong relationships with key foundries and IP providers. 

Key Points: 
  • LEUVEN, Belgium, May 25, 2023 /PRNewswire/ -- Swave Photonics , an innovator in Holographic eXtended Reality (HXR) technology to bring the metaverse to life, today announced the appointment of Andrew Repton as Vice President of Integrated Circuit Design.
  • Prior to joining Swave, Repton served as Vice President of ASIC Engineering at Morse Micro.
  • "Andrew is a welcome addition to the Swave management team," said Mike Noonen, CEO of Swave.
  • "Andrew is the ideal executive to lead our IC design team to accelerate and maximize Swave's photonics breakthroughs based on standard CMOS processes and economics."

Power Integrations Bundles New Three-Phase BLDC Control Software into Motor-Expert Suite for BridgeSwitch IC Family

Retrieved on: 
Wednesday, August 3, 2022
Technology, Energy, Other Energy, Semiconductor, Integrated circuit design, Feedback, Arm Ltd., Torque, ADC, Power, FOC, MCU 8051 IDE, ICS, Solution, Software, BLDC, Multimedia, Hertz, NASDAQ, GUI, Power integrity, Efficiency, MISRA, PCB, Signal-to-noise ratio, FREDFET, Motor Industry Software Reliability Association, API, Electric motor, Video game console, Instrumentation, Cortex

Power Integrations (NASDAQ: POWI ), the leader in high-voltage integrated circuits (ICs) for energy-efficient power conversion, today unveiled new control software for three-phase BLDC motor drives.

Key Points: 
  • Power Integrations (NASDAQ: POWI ), the leader in high-voltage integrated circuits (ICs) for energy-efficient power conversion, today unveiled new control software for three-phase BLDC motor drives.
  • View the full release here: https://www.businesswire.com/news/home/20220802006077/en/
    Power Integrations Bundles New Three-Phase BLDC Control Software into Motor-Expert Suite for BridgeSwitch IC Family (Graphic: Business Wire)
    Traditional three-shunt field-oriented control (FOC) solutions require expensive and bulky operational amplifiers (op-amps) and matching circuitry for motor-current signal conditioning, states Cristian Ionescu-Catrina, senior product marketing manager for Power Integrations.
  • Motor-Expert 2.0 is Power Integrations easy-to-use motor control configuration and diagnostics tool for the BridgeSwitch IC family.
  • Power Integrations, power.com, the Power Integrations logo, Motor-Expert and BridgeSwitch are trademarks or registered trademarks of Power Integrations, Inc.

PolyU and ASTRI join hands to foster research collaboration and nurture R&D talent

Retrieved on: 
Thursday, April 7, 2022
Integrated circuit, Master, Female gendering of AI technologies, Nation, Memorandum of understanding, Integrated circuit design, ASTRI, Technology transfer, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Physics, Research, I&T, Hong Kong Applied Science and Technology Research Institute, Hong Kong Polytechnic University, JP, Industry, Technology, Knowledge, Master of Science, Communication, IOT, Provost, Student, Solution, Department, European environmental research and innovation policy, Trust, Tutoring, Creative industries, Management

PolyU and ASTRI will kick-start research projects, capitalising on their respective research experience and strengths to develop impactful innovations.

Key Points: 
  • PolyU and ASTRI will kick-start research projects, capitalising on their respective research experience and strengths to develop impactful innovations.
  • With cultivating young talent as a core mission of the collaboration, PolyU and ASTRI are dedicated to building a strong talent base for the long-term and sustainable development of R&D in Hong Kong.
  • The ASTRI Day @ PolyU scheduled on 13 April will foster exchange and cooperation between academia and industry.
  • Ir Sunny LEE, JP, Chairman of ASTRI, said, "We are eagerly looking forward to the strengthening of collaboration with PolyU in the areas of research and talent nurturing.

PolyU and ASTRI join hands to foster research collaboration and nurture R&D talent

Retrieved on: 
Thursday, April 7, 2022
Integrated circuit, Master, Female gendering of AI technologies, Nation, Memorandum of understanding, Integrated circuit design, ASTRI, Technology transfer, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Physics, Research, I&T, Hong Kong Applied Science and Technology Research Institute, Hong Kong Polytechnic University, JP, Industry, Technology, Knowledge, Master of Science, Communication, IOT, Provost, Student, Solution, Department, European environmental research and innovation policy, Trust, Tutoring, Creative industries, Management

PolyU and ASTRI will kick-start research projects, capitalising on their respective research experience and strengths to develop impactful innovations.

Key Points: 
  • PolyU and ASTRI will kick-start research projects, capitalising on their respective research experience and strengths to develop impactful innovations.
  • With cultivating young talent as a core mission of the collaboration, PolyU and ASTRI are dedicated to building a strong talent base for the long-term and sustainable development of R&D in Hong Kong.
  • The ASTRI Day @ PolyU scheduled on 13 April will foster exchange and cooperation between academia and industry.
  • Ir Sunny LEE, JP, Chairman of ASTRI, said, "We are eagerly looking forward to the strengthening of collaboration with PolyU in the areas of research and talent nurturing.

GBT Filed a Nonprovisional Patent Application - IC Layout Design Rule Automatic Correction

Retrieved on: 
Wednesday, August 4, 2021
Intellectual property law, United States patent law, Electronic design, Electronic engineering, United States trademark law, Patent application, Patent, United States Patent and Trademark Office, Integrated circuit design, Provisional application, Integrated circuit

SAN DIEGO, Aug. 04, 2021 (GLOBE NEWSWIRE) -- GBT Technologies Inc. ( OTC PINK:GTCH ) ("GBT or the Company), filed a nonprovisional patent application for ICs automatic design rule correction system and method; application #17391292 with the U.S. Patent and Trademark Office (USPTO).

Key Points: 
  • SAN DIEGO, Aug. 04, 2021 (GLOBE NEWSWIRE) -- GBT Technologies Inc. ( OTC PINK:GTCH ) ("GBT or the Company), filed a nonprovisional patent application for ICs automatic design rule correction system and method; application #17391292 with the U.S. Patent and Trademark Office (USPTO).
  • The patent protects systems and methods for automatic correction of geometrical design rule violations which typically takes vast amount of time to correct manually.
  • A typical process of manual correction of design rule violations may take several hours or even days, per layout block; and significantly, increases the overall design time.
  • IC design firms will benefit designing smaller chips, faster and much cheaper, which will create many new markets and opportunities.

Efabless & OpenROAD Advance Commercial Open Source Chip Design

Integrated circuits, OpenROAD, Electronic engineering, Integrated circuit design, Computer engineering, Technology, Computing

SAN JOSE, Calif., July 29, 2021 (GLOBE NEWSWIRE) -- Efabless and the OpenROAD project are excited to announce combining their efforts to work closer together to advance and democratize chip design.

Key Points: 
  • SAN JOSE, Calif., July 29, 2021 (GLOBE NEWSWIRE) -- Efabless and the OpenROAD project are excited to announce combining their efforts to work closer together to advance and democratize chip design.
  • Importantly, the unifying of the offerings under the OpenROAD organization will provide a single point of focus for open source development, bringing more clarity and concentration of effort to advance open source design.
  • Efabless.com offers a crowd platform and marketplace for chip design that uses open source and community models to make the design and commercialization of ICs simple, inexpensive and accessible to everyone.
  • OpenROAD, launched in June 2018, is developing an open source, no-human-in-the-loop RTL-to-GDS EDA system to serve researchers and system innovators across the IC design and design automation communities.

Global Electronic Design Automation Market (2021 to 2026) - Industry Trends, Share, Size, Growth, Opportunity and Forecasts - ResearchAndMarkets.com

Retrieved on: 
Tuesday, July 13, 2021
Software, Technology, Electronic design automation, Electronic engineering, Electrical engineering, Automation, Electricity, Electronic design automation, Integrated circuit design, DesignSpark PCB

The "Electronic Design Automation Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2021-2026" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Electronic Design Automation Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2021-2026" report has been added to ResearchAndMarkets.com's offering.
  • Looking forward, the publisher expects the global electronic design automation market to grow at a CAGR of around 10% during 2021-2026.
  • Electronic design automation, or electronic computer-aided design tool, refers to a collection of various software tools that are used to design circuit boards digitally.
  • What is the structure of the global electronic design automation market and who are the key players?

Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets

Retrieved on: 
Thursday, June 24, 2021
Data management, Consumer electronics, Technology, Manufacturing, Semiconductor, Software, Nanotechnology, Networks, Engineering, Hardware, Electronic design automation, Technology, Electronic engineering, Articles, Science and technology, Sigrity, Simulation software, Cadence, Internet of things, Electronic design automation, Integrated circuit design, Cadence Design Systems, Cadence, Presto Engineering, CADENCE, PRESTO ENGINEERING

Presto is adopting the Cadence system design and analysis portfolio for advanced IC packaging, which includes the CadenceAllegro X Package Designer Plus, Clarity 3D Solver, Sigrity XtractIM technology and Celsius Thermal Solver, on an exclusive basis in order to design IC packaging solutions for its automotive and IoT customers.

Key Points: 
  • Presto is adopting the Cadence system design and analysis portfolio for advanced IC packaging, which includes the CadenceAllegro X Package Designer Plus, Clarity 3D Solver, Sigrity XtractIM technology and Celsius Thermal Solver, on an exclusive basis in order to design IC packaging solutions for its automotive and IoT customers.
  • We are pleased to collaborate with Cadence, a leader in electronic design software, system-level analysis, hardware and IP, said Cdric Mayor, vice president global strategy and corporate development at Presto.
  • Our ability to leverage the Cadence packaging design and analysis workflow will help us broaden our design services for IC packaging customers needing tailored capabilities and specific requirements.
  • The Cadence system design and analysis portfolio for advanced IC packaging supports Cadences Intelligent System Design strategy, enabling SoC design excellence.