MOSFETs

Toshiba’s 600V Small Intelligent Power Device Helps Lower Motor Power Dissipation

Thursday, May 28, 2020 - 6:00am

Toshiba Electronic Devices & Storage Corporation (Toshiba) has launched TPD4162F, a high-voltage intelligent power device (IPD) housed in a small surface mount package, designed to drive motors in products such as air conditioners, air purifiers and pumps.

Key Points: 
  • Toshiba Electronic Devices & Storage Corporation (Toshiba) has launched TPD4162F, a high-voltage intelligent power device (IPD) housed in a small surface mount package, designed to drive motors in products such as air conditioners, air purifiers and pumps.
  • View the full release here: https://www.businesswire.com/news/home/20200527005981/en/
    Toshiba: 600V small intelligent power device "TPD4162F" that helps lower motor power dissipation (Photo: Business Wire)
    Fabricated with a new process, TPD4162F reduces power dissipation about 10% [1] lower than that of Toshibas current IPD, TPD4152Fwhich will help to lower the power dissipation of devices into which it is integrated.
  • This supports direct drive of a brushless DC motor with square wave input signals from either a Hall sensor or a Hall IC without requiring a PWM controller IC.
  • Use of a small surface mount package, HSSOP31, can help reduce the size and height of motor control boards.

Kyoto Semiconductor Announces a Photodiode in the Industry’s Smallest Class, with a Broad Range of Sensitivity Wavelengths, from 400 to 1,700 nm

Tuesday, May 26, 2020 - 6:00am

Compared to earlier products from Kyoto Semiconductor, the volume ratio has been reduced to 1/8.

Key Points: 
  • Compared to earlier products from Kyoto Semiconductor, the volume ratio has been reduced to 1/8.
  • Kyoto Semiconductor was established in 1980 in Kyoto as a dedicated manufacturer of optical semiconductors.
  • They are manufactured end-to-end, including pre- and post-processing, and together with Kyoto Semiconductors unique packaging technology, at our location in Japan and made available to customers around the world.
  • Kyoto Semiconductor leads the industry with world-standard technologies for optical device solutions based on Japanese quality and attention to production detail.

Europe IGBT and Thyristor Market Forecast to 2027 - COVID-19 Impact and Regional Analysis By IGBT Packaging Type ; IGBT Power Rating ; IGBT Application ; Thyristor Application

Saturday, May 23, 2020 - 12:10am

Various major companies are looking forward to investing in startups, which can eventually help them co-create products in the future which is likely to drive the IGBT and thyristor market.

Key Points: 
  • Various major companies are looking forward to investing in startups, which can eventually help them co-create products in the future which is likely to drive the IGBT and thyristor market.
  • Based on packaging type, the European IGBT and thyristor market was led by the module segment in 2018 with a decent share and is expected to continue its dominance during the forecast period.
  • Low surge and low switching loss, high-speed switching, and reduced temperature dependence are the advantages provided by the IGBT module.
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Alpha and Omega Semiconductor Releases New 1200V αSiC MOSFETs

Tuesday, May 19, 2020 - 1:00pm

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL) a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today announced the release of the new 1200V silicon carbide (SiC) SiC MOSFET technology platform.

Key Points: 
  • Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL) a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today announced the release of the new 1200V silicon carbide (SiC) SiC MOSFET technology platform.
  • The first product release for this new platform is the AOK065V120X2 , a 1200V 65m SiC MOSFET available in a TO-247-3L package.
  • After years of development work, we are excited to add this new next-generation SiC MOSFET technology to Alpha and Omegas existing class-leading Si MOSFET and IGBT portfolio.
  • Adding to our previously released 650V GaN platform, the SiC devices further expand our positioning for the projected multi-billion dollar wide bandgap power semiconductor market.

Alchip Technology Rolls Out High Performance Computing Packaging Capability

Tuesday, May 19, 2020 - 11:06am

MILPITAS, Calif., May 19, 2020 /PRNewswire/ --Alchip Technologies, Limited, the high-performance computing ASIC leader, rolled out its Chip-on-Wafer-on-Substrate (CoWoS) packaging capability.

Key Points: 
  • MILPITAS, Calif., May 19, 2020 /PRNewswire/ --Alchip Technologies, Limited, the high-performance computing ASIC leader, rolled out its Chip-on-Wafer-on-Substrate (CoWoS) packaging capability.
  • CoWoS packaging, developed first by TSMC, is critical to successful deployment of today's High-Performance Computing (HPC) ASICs.
  • Today's CoWoS chiplet sets include high performance system-on-a-chip (SoC) and a high-performance memory (HBM) block.
  • According to Alchip Technologies' President and CEO, Johnny Shen, "Packaging is the new 'Moore's Law' for powerful high-performance computing challenges.

CCD Image Sensor Technology Plays Key Role in COVID-19 Diagnostics

Tuesday, May 19, 2020 - 9:00am

In the past few weeks, the UK CCD Fabrication team have been producing hundreds of CCD77-358 devices that will be designed into camera systems to support COVID-19 diagnostics.

Key Points: 
  • In the past few weeks, the UK CCD Fabrication team have been producing hundreds of CCD77-358 devices that will be designed into camera systems to support COVID-19 diagnostics.
  • Miles Adcock President Teledyne e2v Space & Quantum said: The Coronavirus outbreak has triggered increased demand and interest for CCD and CMOS sensors.
  • Our ability to expedite and meet urgent requirements is testament to the drive and commitment of the Chelmsford CCD Fabrication Operations team.
  • Testament to the resilience of CCD technology in the most demanding applications, Teledyne is committed to the provision of a long-term vertically integrated, dedicated CCD fab and continues to make technology developments to the design and production of CCDs.

Ichor Announces Upcoming Investor Webcasts

Monday, May 18, 2020 - 2:00pm

Ichor Holdings, Ltd. (NASDAQ: ICHR), a leader in the design, engineering, and manufacturing of critical fluid delivery subsystems for semiconductor capital equipment, today announced webcasts for upcoming virtual investor conferences:

Key Points: 
  • Ichor Holdings, Ltd. (NASDAQ: ICHR), a leader in the design, engineering, and manufacturing of critical fluid delivery subsystems for semiconductor capital equipment, today announced webcasts for upcoming virtual investor conferences:
    Wednesday, May 27, 2020Cowen Virtual Technology, Media & Telecom Conference at 11:45 a.m. PDT
    Tuesday, June 9, 2020Stifel Virtual Cross Sector Insight Conference at 9:40 a.m. PDT
    The live and archived webcasts will be available on the investor relations page of Ichors website at ir.ichorsystems.com.
  • We are a leader in the design, engineering and manufacturing of critical fluid delivery subsystems and components for semiconductor capital equipment.
  • Our product offerings include gas and chemical delivery subsystems, collectively known as fluid delivery subsystems, which are key elements of the process tools used in the manufacturing of semiconductor devices.
  • Our gas delivery subsystems deliver, monitor and control precise quantities of the specialized gases used in semiconductor manufacturing processes such as etch and deposition.

COVID-19 Impact and Recovery Analysis | Semiconductor Market 2020-2024 | Increasing Number of Data Centers to Boost Growth | Technavio

Saturday, May 9, 2020 - 3:30am

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Key Points: 
  • To learn more about the global trends impacting the future of market research, download a free sample: https://www.technavio.com/talk-to-us?report=IRTNTR43410
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    This study identifies growing investment in 3D NAND and FinFET technologies as one of the prime reasons driving the semiconductor market growth during the next few years.
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Nova's Solutions Selected by a Leading Global Logic Manufacturer

Tuesday, May 5, 2020 - 12:00pm

REHOVOT, Israel, May 5, 2020 /PRNewswire/ --Nova (Nasdaq: NVMI)announced today that one of the world's top Integrated Circuits (IC) manufacturers recently selected Nova's leading-edge optical metrology solutions for its global logicfabrication sites.

Key Points: 
  • REHOVOT, Israel, May 5, 2020 /PRNewswire/ --Nova (Nasdaq: NVMI)announced today that one of the world's top Integrated Circuits (IC) manufacturers recently selected Nova's leading-edge optical metrology solutions for its global logicfabrication sites.
  • Nova's solution was chosen due to its unique combination of advanced optical metrology hardware, enhanced by cutting-edge algorithms and modeling software.
  • The solution provides the essential process insight needed to confidently fabricate advanced Logic devices which requires accurate process control, shorter time to solution and solving complicated dimensional challenges.
  • About Nova:Nova is a leading innovator and key provider of metrology solutions for advanced process control used in semiconductor manufacturing.

Synopsys Introduces 3DIC Compiler, Industry's First Unified Platform to Accelerate Multi-die System Design and Integration

Tuesday, April 28, 2020 - 2:05pm

With 3DIC Compiler, IC design and packaging teams are enabled to achieve unparalleled levels of multi-die integration, co-design and faster time to convergence.

Key Points: 
  • With 3DIC Compiler, IC design and packaging teams are enabled to achieve unparalleled levels of multi-die integration, co-design and faster time to convergence.
  • "Synopsys' 3DIC Complier with its unified platform is an industry disruptor in how advanced multi-die packages are designed, as it has redefined the conventional tool boundaries across the full design workflow for 2.5D/3D multi-die solutions."
  • An increasing number of factors are driving system design teams to leverage multi-die integration to address new applications such as artificial intelligence and high-performance computing.
  • Synopsys' 3DIC Compiler is built on an IC design data model enabling scalability in capacity and performance with more modern 3DIC structures.