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Global Industry Analysts Predicts the World Semiconductor Advanced Packaging Market to Reach $49.2 Billion by 2026

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Friday, June 3, 2022
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SAN FRANCISCO, June 3, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Semiconductor Advanced Packaging - Global Market Trajectory & Analytics" .

Key Points: 
  • SAN FRANCISCO, June 3, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Semiconductor Advanced Packaging - Global Market Trajectory & Analytics" .
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    Amid the COVID-19 crisis, the global market for Semiconductor Advanced Packaging estimated at US$35.7 Billion in the year 2022, is projected to reach a revised size of US$49.2 Billion by 2026, growing at a CAGR of 7.6% over the analysis period.
  • Growing awareness of the benefits of advanced packaging in comparison to traditional packaging technologies is also boding well for the market.
  • Global Industry Analysts, Inc., ( www.strategyr.com ) is a renowned market research publisher the world`s only influencer driven market research company.

Valued to be $50.6 Billion by 2026, Semiconductor Advanced Packaging Slated for Robust Growth Worldwide

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Wednesday, February 23, 2022
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Key Points: 
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    The semiconductor advanced packaging market growth is driven by the growing trend of miniaturization.
  • Further, the growing use of 2.5D packaging in chips and 3D IC in smartphones and other mobile devices is anticipated to spur advanced packaging demand.
  • This segment currently accounts for a 9.6% share of the global Semiconductor Advanced Packaging market.
  • The U.S. Market is Estimated at $3.3 Billion in 2022, While China is Forecast to Reach $14.3 Billion by 2026
    The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3.3 Billion in the year 2022.

Semiconductor Advanced Packaging | Global Market Trajectory & Analytics to 2026 | IoT Ecosystem to Rev Up Opportunities in the $50.6B Industry - ResearchAndMarkets.com

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Friday, January 21, 2022
Technology, Packaging, Semiconductor, Manufacturing, CAGR, IOT, WLCSP, Tablet, Miniaturization, COVID-19, ULSI, Growth, CIS, Government, Field-programmable gate array, Electronics, Industry, Silicon, Graphics processing unit, MCM, 3D IC, Application-specific integrated circuit, Semiconductor, Pet, Renewable energy, Video game

The "Semiconductor Advanced Packaging - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Semiconductor Advanced Packaging - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.
  • The semiconductor advanced packaging market growth is driven by the growing trend of miniaturization.
  • Further, the growing use of 2.5D packaging in chips and 3D IC in smartphones and other mobile devices is anticipated to spur advanced packaging demand.
  • This segment currently accounts for a 9.6% share of the global Semiconductor Advanced Packaging market.