SOIC

TI simplifies current sensing with the industry's most accurate Hall-effect sensors and integrated shunt solutions

Retrieved on: 
Tuesday, August 22, 2023

For nonisolated systems up to 85 V and 75 ARMS, TI's new EZShunt™ portfolio includes the industry's smallest fully integrated current shunt monitor and the industry's highest-accuracy 75-A integrated shunt solution.

Key Points: 
  • For nonisolated systems up to 85 V and 75 ARMS, TI's new EZShunt™ portfolio includes the industry's smallest fully integrated current shunt monitor and the industry's highest-accuracy 75-A integrated shunt solution.
  • "These new products highlight how the breadth of our sensing technologies address this design challenge for a variety of systems.
  • To learn more, see the technical article, " How to simplify accurate current sensing in high-voltage systems ."
  • TI's new EZShunt portfolio of current-sensing solutions simplifies designs by removing the need for an external shunt resistor.

Elevation Semiconductor Introduces Two New Offline AC-DC Primary-Side PWM Controllers for Flyback Converters

Retrieved on: 
Tuesday, September 27, 2022

The HL9510 and HL9512 are flyback PWM controller ICs that operate in a quasi-resonant (QR) mode to significantly enhance the system efficiency and power density.

Key Points: 
  • The HL9510 and HL9512 are flyback PWM controller ICs that operate in a quasi-resonant (QR) mode to significantly enhance the system efficiency and power density.
  • "The new flyback PWM controllers add another dimension to our fast-charging solutions portfolio with their enhanced system efficiency and power density.
  • Their smaller footprint also plays a critical role in key applications with limited board space," said David Nam, CEO of Elevation Semiconductor.
  • Elevation Semiconductor was founded in 2021 by industry veterans from leading analog companies experienced in AC-DC power solutions, silicon controllers, and GaN intellectual properties.

TSMC FinFlex™, N2 Process Innovations Debut at 2022 North America Technology Symposium

Retrieved on: 
Thursday, June 16, 2022

TSMC (TWSE: 2330, NYSE: TSM) today showcased the newest innovations in its advanced logic, specialty, and 3D IC technologies at the Companys 2022 North America Technology Symposium, with the next-generation leading-edge N2 process powered by nanosheet transistors and the unique FinFlex technology for the N3 and N3E processes making their debut.

Key Points: 
  • TSMC (TWSE: 2330, NYSE: TSM) today showcased the newest innovations in its advanced logic, specialty, and 3D IC technologies at the Companys 2022 North America Technology Symposium, with the next-generation leading-edge N2 process powered by nanosheet transistors and the unique FinFlex technology for the N3 and N3E processes making their debut.
  • The innovations we will showcase at our Technology Symposiums demonstrate TSMCs technology leadership and our commitment to support our customers through this exciting period of transformation and growth.
  • With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
  • TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world.

Global Industry Analysts Predicts the World Semiconductor Advanced Packaging Market to Reach $49.2 Billion by 2026

Retrieved on: 
Friday, June 3, 2022

SAN FRANCISCO, June 3, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Semiconductor Advanced Packaging - Global Market Trajectory & Analytics" .

Key Points: 
  • SAN FRANCISCO, June 3, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Semiconductor Advanced Packaging - Global Market Trajectory & Analytics" .
  • Preview Registry
    Amid the COVID-19 crisis, the global market for Semiconductor Advanced Packaging estimated at US$35.7 Billion in the year 2022, is projected to reach a revised size of US$49.2 Billion by 2026, growing at a CAGR of 7.6% over the analysis period.
  • Growing awareness of the benefits of advanced packaging in comparison to traditional packaging technologies is also boding well for the market.
  • Global Industry Analysts, Inc., ( www.strategyr.com ) is a renowned market research publisher the world`s only influencer driven market research company.

Silanna Semiconductor's Roll Out of AnyPort™ Architecture Will Dramatically Simplify Development of Multi Port Chargers

Retrieved on: 
Tuesday, May 24, 2022

SAN DIEGO, May 24, 2022 /PRNewswire-PRWeb/ -- Silanna Semiconductor, The Power Density Leader, has announced that it will be making its flexible AnyPort™ architecture for multiport chargers available for a wide variety of silicon- and GaN-based designs supporting power levels beyond 100W.

Key Points: 
  • AnyPort brings together Silanna's CO2 Smart Power families of advanced ACF controllers and high-frequency DC/DC converters to deliver high-power-density, ultra-efficient, multi-port charger solutions for USB-PD applications between 30W and 150W.
  • AnyPort was first deployed in Silanna Semiconductor's RD-5 all-silicon reference design, a production-ready solution that provides everything an engineer needs to rapidly prototype and test a fully functional 65W 2C charger.
  • As well as incorporating AnyPort into future silicon- and GaN-based reference designs, the company is now planning to make the AnyPort architecture available to all customers of its advanced AC/DC and DC/DC technologies.
  • "Basing a design around AnyPort architecture speeds development, minimizes the BoM required across multiple charger models and allows companies to launch and modify high-efficiency, high-power-density products in the shortest possible timescales."

Silanna Semiconductor Announces First Multi-Port Production-Ready Fast Charger Reference Design

Retrieved on: 
Wednesday, March 23, 2022

SAN DIEGO, March 23, 2022 /PRNewswire-PRWeb/ --Silanna Semiconductor, The Power Density Leader, has announced its first multi-port fast charger reference design.

Key Points: 
  • SAN DIEGO, March 23, 2022 /PRNewswire-PRWeb/ --Silanna Semiconductor, The Power Density Leader, has announced its first multi-port fast charger reference design.
  • Representing the latest addition to Silanna's growing family of silicon- and GaN-based fast charger reference designs, the RD-5 is an all-silicon solution that will simplify and speed charger development by providing everything an engineer needs to rapidly prototype and test a fully functional 65W 2C unit.
  • "By bringing together these technologies in the RD-5 AnyPort reference design we are providing designers with the fastest possible route from prototyping to full production of fast chargers with any number or type of output ports."
  • This family includes all-silicon 33W and 45W solutions and silicon- and GaN-based single-output 65W USB-PD reference designs.

Silanna Semiconductor Adds All-Silicon 45W Option to Family of Ultra-Efficient Production-Ready Fast Charger Reference Designs

Retrieved on: 
Thursday, March 10, 2022

SAN DIEGO, March 10, 2022 /PRNewswire-PRWeb/ -- Silanna Semiconductor , The Power Density Leader, has further expanded its family of silicon- and GaN-based fast charger reference designs with an all-silicon option that will significantly reduce the time needed to develop high-density 45W applications.

Key Points: 
  • SAN DIEGO, March 10, 2022 /PRNewswire-PRWeb/ -- Silanna Semiconductor , The Power Density Leader, has further expanded its family of silicon- and GaN-based fast charger reference designs with an all-silicon option that will significantly reduce the time needed to develop high-density 45W applications.
  • Supplied as a fully production-ready solution, the new RD-24 design provides everything needed to rapidly prototype and test a fully functional 45W 1C charger.
  • SZ1131 integrates ACF controller with UHV active clamp FET, active clamp driver, and start-up regulator
    About Silanna Semiconductor: The Power Density Leader.
  • Silanna Semiconductor, with its family of CO2 Smart Power ICs, offers technologies that will benefit the planet and the people on it by delivering best-in-class power density and efficiency.

Silanna Semiconductor Extends All-Silicon Reference Design Family to 65W

Retrieved on: 
Wednesday, February 23, 2022

This family includes all-silicon 33W and GaN-based 65W USB-PD reference designs.

Key Points: 
  • This family includes all-silicon 33W and GaN-based 65W USB-PD reference designs.
  • SZ1131 integrates ACF controller with UHV active clamp FET, active clamp driver, and start-up regulator
    About Silanna Semiconductor: The Power Density Leader.
  • Silanna Semiconductor, with its family of CO2 Smart Power ICs, offers technologies that will benefit the planet and the people on it by delivering best-in-class power density and efficiency.
  • Silanna Semiconductor, headquartered in San Diego, CA, is a privately-held semiconductor company, and has global facilities supporting customers with design centers and offices in North America, Europe, Asia, and Australia.

Silanna Semiconductor Moves to Full Production of Active Clamp Flyback (ACF) Controllers for Power Adapters beyond 100W

Retrieved on: 
Wednesday, January 26, 2022

Featuring the industry's highest level of integration, the SZ1131 incorporates an adaptive digital PWM controller, ultra-high-voltage (UHV) active clamp FET, active clamp gate driver and startup regulator.

Key Points: 
  • Featuring the industry's highest level of integration, the SZ1131 incorporates an adaptive digital PWM controller, ultra-high-voltage (UHV) active clamp FET, active clamp gate driver and startup regulator.
  • Customer applications are high-efficiency and high-power-density adapters of up to 65W output power with universal input and 120W output power with PFC-support applications - including single-port and multi-port USB-PD fast chargers.
  • Integrated UHV active clamp FET, active clamp driver and start-up regulator
    Sample information and live demonstrations are available at https://www.powerdensity.com .
  • Silanna Semiconductor, with its family of CO2 Smart Power ICs, offers technologies that will benefit the planet and the people on it by delivering best-in-class power density and efficiency.

Silanna Semiconductor Reference Design Supports Development of Industry's Most Efficient All-Silicon 33W 1C Chargers

Retrieved on: 
Monday, January 3, 2022

SAN DIEGO, Jan. 3, 2022 /PRNewswire-PRWeb/ -- Silanna Semiconductor, The Power Density Leader, has launched a new active clamp flyback (ACF)-based reference design that simplifies and speeds the development of 33W 1C fast charger applications built using silicon power FETs.

Key Points: 
  • SAN DIEGO, Jan. 3, 2022 /PRNewswire-PRWeb/ -- Silanna Semiconductor, The Power Density Leader, has launched a new active clamp flyback (ACF)-based reference design that simplifies and speeds the development of 33W 1C fast charger applications built using silicon power FETs.
  • RD-23 uses the SZ1131 Silanna Semiconductor's newest ACF controller, which is rated for 65W for Universal input and above 100W with PFC-supported applications.
  • Silanna Semiconductor, with its family of CO2 Smart Power ICs, offers technologies that will benefit the planet and the people on it by delivering best-in-class power density and efficiency.
  • Silanna Semiconductor, headquartered in San Diego, CA, is a privately-held semiconductor company, and has global facilities supporting customers with design centers and offices in North America, Europe, Asia, and Australia.