Long Reach

OIF Highlights 400ZR, Co-Packaging Architectures, CEI-112G & CEI-224G and CMIS Implementations Interoperability Among 30+ Global Companies; Hosts Special Anniversary Events at OFC 2023

Retrieved on: 
Wednesday, February 22, 2023

OIF also announced the availability of a white paper highlighting the findings from a 400ZR Interoperability Plugfest held in January.

Key Points: 
  • OIF also announced the availability of a white paper highlighting the findings from a 400ZR Interoperability Plugfest held in January.
  • OIF’s 400ZR project is critical in facilitating the reduction of cost and complexity for high bandwidth data center interconnects and promoting interoperability among optical module manufacturers.
  • To commemorate its 25th anniversary during OFC, OIF will host a special one-hour session, “Bringing Order to Chaos – OIF,” on Wednesday, March 8 at 3 pm PT in Theater III.
  • Twelve different transceivers were cross-connected in a matrix of combinations (Tx-Rx) using a noise-loaded link to characterize the penalties associated with interoperability between suppliers.

Credo Introduces Screaming Eagle 112G Retimer DSP with Industry Leading 1.6 Terabit Capacity

Retrieved on: 
Wednesday, October 5, 2022

Credo (NASDAQ: CRDO) today announced the Screaming Eagle 112G LR (Long Reach) DSP device with 1.6 Terabits per second (Tbps) of retiming capacity.

Key Points: 
  • Credo (NASDAQ: CRDO) today announced the Screaming Eagle 112G LR (Long Reach) DSP device with 1.6 Terabits per second (Tbps) of retiming capacity.
  • View the full release here: https://www.businesswire.com/news/home/20221005005317/en/
    Credo Introduces Screaming Eagle 112G Retimer DSP with Industry Leading 1.6 Terabit Capacity.
  • Screaming Eagle is a third generation Credo 112G retimer and supports LR+ channels of 40dB+, enabling up to 1.6Tbps throughput in a single package.
  • Screaming Eagle 1.6T ships in a 23x23mm package, the industrys smallest form factor for line card applications.

Microchip Unveils Industry’s First Terabit-Scale Secure Ethernet PHY Family with Port Aggregation for Enterprise and Cloud Interconnect

Retrieved on: 
Monday, September 19, 2022

This dramatic growth is expanding the transition to 112G PAM4 connectivity beyond just cloud data center and telecom service provider switches and routers to enterprise Ethernet switching platforms.

Key Points: 
  • This dramatic growth is expanding the transition to 112G PAM4 connectivity beyond just cloud data center and telecom service provider switches and routers to enterprise Ethernet switching platforms.
  • Microchip Technology Inc. (NASDAQ: MCHP) is responding to this market inflection with the META-DX2 Ethernet PHY (physical layer) portfolio by introducing a new family of META-DX2+ PHYs.
  • Microchips second-generation Ethernet PHY SDK for the META-DX2 family lowers development costs with field-proven API libraries and firmware.
  • Note: The Microchip name and logo and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

Marvell to Showcase Cloud-Optimized Optical Connectivity Solutions at ECOC 2022

Retrieved on: 
Friday, September 16, 2022

SANTA CLARA, Calif., Sept.16, 2022 /PRNewswire/ -- Marvell (NASDAQ: MRVL) today announced the details of its participation at the European Conference on Optical Communication (ECOC), Europe's largest optical communications event.

Key Points: 
  • SANTA CLARA, Calif., Sept.16, 2022 /PRNewswire/ -- Marvell (NASDAQ: MRVL) today announced the details of its participation at the European Conference on Optical Communication (ECOC), Europe's largest optical communications event.
  • ECOC will take place at Messe Basel in Basel, Switzerland with Marvell in booth #219.
  • Optical modules from across the ecosystem powered by Marvell technologies and silicon solutions will be on display.
  • OIF members will showcase interoperability in four critical areas at this year's ECOC 2022.

SIAE Microelettronica and Deutsche Telekom boost 5G backhaul capacity with long-reach E-band

Retrieved on: 
Thursday, January 20, 2022

SIAE Microelettronica is one of the three selected wireless backhaul microwave radio suppliers of Deutsche Telekom (DT).

Key Points: 
  • SIAE Microelettronica is one of the three selected wireless backhaul microwave radio suppliers of Deutsche Telekom (DT).
  • E-band radio is one of the fastest growing wireless backhaul technology segment, and many operators are turning to E-band to boost their current network infrastructure.
  • With this solution an operator could boost capacity especially on 5G wireless backhaul use cases" said Claudio De Marco, Deutsche Telekom account manager in SIAE Microelettronica.
  • SIAE Microelettronica designs and produces its own RF components liaising over in-house RF lab, clean-room facilities and complete product assembly with latest generation SMT smart-manufacturing facility.