VSR

Vertical Staffing Resources (VSR) Announces Acquisition of PeopleReady's Canadian Staffing Operations

Retrieved on: 
Wednesday, February 21, 2024
Acquisition, VSR, Workforce, TBI, Retail

TORONTO, Feb. 21, 2024 /CNW/ - Vertical Staffing Resources Inc. ("VSR"), a leading provider of specialized workforce solutions, today announced that it has reached a definitive agreement to acquire PeopleReady's Canadian staffing operations from TrueBlue Inc. (NYSE: TBI).

Key Points: 
  • TORONTO, Feb. 21, 2024 /CNW/ - Vertical Staffing Resources Inc. ("VSR"), a leading provider of specialized workforce solutions, today announced that it has reached a definitive agreement to acquire PeopleReady's Canadian staffing operations from TrueBlue Inc. (NYSE: TBI).
  • This strategic acquisition marks a major milestone for VSR, enabling it to extend its reach in the staffing industry across Canada and increase value for its clients and employees.
  • "Significant strategic rationale underpins this acquisition, as it not only broadens our geographical footprint across Canada but also fortifies our diversification into new industry verticals.
  • "This acquisition will create opportunities for expanded service offerings and we will leverage our technology to streamline processes and enhance the overall experience for all of VSR's clients."

Credo Launches 112G PAM4 SerDes IP for TSMC N3 Process Technology

Retrieved on: 
Thursday, February 1, 2024
Technology, Internet, Hardware, Data Management, Multimedia, Copper, Family, AI, Application-specific integrated circuit, DSP, N3, N4, Machine learning, Credo, Documentation, Business development, VSR, Chiplet, IP, PAM4, Silicon, Architecture, Original equipment manufacturer, Network switch, 3D printing

Credo Technology Group Holding Ltd (NASDAQ: CRDO) today introduced its newest 112G PAM4 SerDes Intellectual Property (IP) family on TSMC’s industry leading N3 and N7/N6 process technologies.

Key Points: 
  • Credo Technology Group Holding Ltd (NASDAQ: CRDO) today introduced its newest 112G PAM4 SerDes Intellectual Property (IP) family on TSMC’s industry leading N3 and N7/N6 process technologies.
  • These two new SerDes IPs complement Credo’s available IP in TSMC’s N5 process technology, which also includes the enhanced N4 version of the 5nm node.
  • Credo then ported the 12nm, 112G SerDes to more advanced process technology nodes (N7/N6, N5/N4, and N3) – allowing customers to integrate the silicon proven technology into monolithic ASICs and chiplets.
  • These new 112G PAM4 SerDes IP were designed to meet the growing data needs of high-speed, data-intensive applications.

OIF Showcases Multi-vendor Interoperability at ECOC 2023: Demo Features Nearly 40 Companies Demonstrating Innovation Across 400ZR+, Co-Packaging, CEI-112G & CEI-224G and CMIS

Retrieved on: 
Wednesday, September 20, 2023
Technology, Robotics, Packaging, Semiconductor, Engineering, Security, Other Technology, Telecommunications, Manufacturing, Software, VoIP, Networks, Internet, Mobile, Wireless, Hardware, Electronic Design Automation, Data Management, NEC, Cisco, CEI, ROADM, Common Management Information Protocol, Very short patch repair, Ecosystem, Viavi Solutions, Sumitomo Electric Industries, VSR, Broadcom Inc., DWDM, Common Electrical I/O, Pedro Klempa, CMIS, Telefónica, MACOM Technology Solutions, ECOC, Juniper Networks, Keysight, Cadence Design Systems, Inc. v. Avanti Corp, Video game, Mobile phone, Infinera, Amphenol, Molex, Semtech, Ciena, Coherence, Adtran

ECOC, taking place Oct. 2-4 in Glasgow, Scotland, provides an ideal platform for OIF and its member companies to showcase their multi-vendor interoperability achievements.

Key Points: 
  • ECOC, taking place Oct. 2-4 in Glasgow, Scotland, provides an ideal platform for OIF and its member companies to showcase their multi-vendor interoperability achievements.
  • We’ve expanded this year’s public demonstration to showcase progress to include the OpenZR+ and OpenROADM applications over a multi-span ROADM network.
  • Co-Packaging Solutions Demo: Showcasing innovative approaches to integrating multiple chips within a single package, revolutionizing performance and power efficiency in electronic devices.
  • “Attendees at ECOC can also look forward to celebrating OIF’s 25-year journey in fostering industry-wide collaboration and interoperability,” added Klempa.

Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP

Retrieved on: 
Wednesday, September 20, 2023
Electronic Design Automation, Data Management, Semiconductor, Technology, 5G, Artificial Intelligence, Hardware, LLM, Cadence Design Systems, IP Group, PHY, CDNS, SerDes, LR, PCI Express, IP, Chiplet, SOC, UCIe, DDR5, PCI, Machine learning, Media, Hyperscale computing, TSMC, Artificial intelligence, Silicon, VSR, PPA, Cassette tape, Cable television, Cadence

Other Cadence Design IP on the advanced TSMC N3E process has demonstrated silicon success or taped out, providing mutual customers with a wide range of high-speed interface and memory IP for their most advanced designs.

Key Points: 
  • Other Cadence Design IP on the advanced TSMC N3E process has demonstrated silicon success or taped out, providing mutual customers with a wide range of high-speed interface and memory IP for their most advanced designs.
  • Addressing this surging demand, the new 224G-LR SerDes PHY IP and other leading Cadence interface IP on the TSMC N3E process usher in a new era of innovation and high-speed connectivity.
  • Our close collaboration with TSMC enables us to deliver high-quality IP designed to achieve first-pass silicon success and faster time to market.”
    The comprehensive Cadence IP portfolio on the TSMC N3E process supports the Cadence Intelligent System Design™ strategy by enabling advanced-node SoC design excellence.
  • For more information about Cadence’s next-generation 224G SerDes PHY IP and the comprehensive Cadence N3E Design IP portfolio, please visit www.cadence.com/go/N3EDIPPR .

Credo Introduces the Seagull 452 family of High-Performance Optical DSPs

Retrieved on: 
Tuesday, September 5, 2023
Technology, Professional Services, Venture Capital, Semiconductor, Security, Artificial Intelligence, Networks, Internet, Mobile, Wireless, 5G, Hardware, Digital, Data-rate units, Cable gland, DSP, Multimedia, Marketing, Interest, DSPS, Optics, AOC, EML, PAM4, QSFP28, Documentation, QSFP-DD, PCB, Credo, Gull, CIOE, QSFP56, Growth, AI, VSR, VCSEL, AOCS, Video game, Telecommunications

The family consists of the octal channel Seagull 452, the quad channel Seagull 252 and the dual channel Seagull 152 DSPs.

Key Points: 
  • The family consists of the octal channel Seagull 452, the quad channel Seagull 252 and the dual channel Seagull 152 DSPs.
  • The Seagull 452 family of DSPs aims to help our customers balance these concerns while also benefitting from this growing market opportunity.”
    The Seagull 452 family incorporates Credo’s fourth generation DSP technology on the electrical host interface and the optical interface.
  • The new Seagull 452 boasts exceptionally low-power consumption and is targeted at the burgeoning 400G Active Optical Cable (AOC) market for AI networks.
  • All members of the Seagull 452 family support 25 Gbps NRZ operation for backwards compatibility.

ePLDT expands Telco Ecosystem in VITRO Sta. Rosa Data Center with Radius Telecoms, Inc. partnership

Retrieved on: 
Thursday, July 20, 2023
Cignal TV, EPLDT Ventus, Enterprise, Business development, Partnership, Metro Manila, Telecommunications, Radius, PLDT, Adam, Organization, Arduino, ICT, Ecosystem, VSR, Mobile phone, Management

Rosa (VSR) Data Center when it goes live in early 2024.

Key Points: 
  • Rosa (VSR) Data Center when it goes live in early 2024.
  • Through this partnership, Radius Telecoms will establish a point of presence at VSR, providing reliable connectivity solutions to enterprises and hyperscalers who will soon collocate in the facility.
  • Similarly, Radius Telecoms is working with ePLDT to expand the fiber connectivity of the VITRO Data Centers with a diverse fiber facility linking VSR to VITRO Makati 2 and other key data centers in Metro Manila, advancing ePLDT's data center interconnect service.
  • "The addition of Radius Telecoms, Inc. will undoubtedly enhance the hyperconnectivity, resilience, and scalability of VITRO Sta.

Analog Devices Announces Apollo MxFE Advanced Software-Defined Signal Processing Solution for Aerospace & Defense, Instrumentation, and Next-Generation Wireless Communications

Retrieved on: 
Tuesday, June 13, 2023
Semiconductor, Technology, Other Technology, Software, Networks, Hardware, Wireless, Heart, Defense, Aerospace Defense Command, DSP, Analog Devices, LDO, FIR, Multimedia, Temperature, Non-commissioned officer, Apollo, Radar, PLL, Aerospace, Algorithm, ADI, CMOS, ADC, Growth, Ecosystem, Device, VSR, Intelligence, DAC, RF, Mobile phone, Video game, Cable television, Instrumentation

Analog Devices, Inc. (Nasdaq: ADI) today announced Apollo MxFE, its most advanced software-defined, direct RF-sampling, wideband mixed signal front end platform.

Key Points: 
  • Analog Devices, Inc. (Nasdaq: ADI) today announced Apollo MxFE, its most advanced software-defined, direct RF-sampling, wideband mixed signal front end platform.
  • Apollo MxFE enables next-generation applications such as phased array radar, electronic surveillance, test and measurement, and 6G communications in the Aerospace & Defense, Instrumentation, and Wireless Communications industries.
  • View the full release here: https://www.businesswire.com/news/home/20230613005033/en/
    Analog Devices announces Apollo MxFE advanced software-defined signal processing solution for Aerospace & Defense, Instrumentation, and Wireless Communications industries.
  • As a result, customers need a solution that enables higher-speed data conversion and processing capabilities, while reducing electronic testing complexity.

Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC’s N4P Process

Retrieved on: 
Monday, April 24, 2023
Electronic Design Automation, Data Management, Semiconductor, Technology, 5G, Networks, Hardware, Application-specific integrated circuit, Cadence Design Systems, IP Group, CDNS, DSP, SerDes, Computation, NRZ, LR, IP, SOC, DAC, IEEE, PAM4, Socs, BER, TSMC, Insertion loss, ELR, Silicon, Architecture, VSR, Video game, Cadence

Cadence Design Systems, Inc. (Nasdaq: CDNS) today unveiled its 112G Extended Long-Reach (112G-ELR) SerDes IP on TSMC’s N4P process for hyperscale ASICs, artificial intelligence/machine learning (AI/ML) accelerators, switch fabric system-on-chips (SoCs) and 5G wireless infrastructure.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today unveiled its 112G Extended Long-Reach (112G-ELR) SerDes IP on TSMC’s N4P process for hyperscale ASICs, artificial intelligence/machine learning (AI/ML) accelerators, switch fabric system-on-chips (SoCs) and 5G wireless infrastructure.
  • The Cadence® 112G-ELR SerDes PHY IP on TSMC’s N4P process, a performance-focused enhancement of the TSMC 5nm technology platform, incorporates industry-leading digital signal processor (DSP)-based SerDes architecture with maximum likelihood sequence detection (MLSD) and reflection cancellation technology.
  • The SerDes PHY IP is compliant with IEEE and OIF Long-Reach (LR) standards while providing extra performance margin for ELR applications.
  • The 112G-ELR SerDes PHY IP on TSMC’s N4P process is part of the broader Cadence IP portfolio and supports the Cadence Intelligent System Design™ strategy, which enables advanced-node SoC design excellence.

CCC, U.S. DoD Sign Contract for Imaging Solution from LR Tech

Retrieved on: 
Thursday, April 6, 2023
U.S. Department of Defense Strategy for Operating in Cyberspace, Hyperspectral imaging, Spectroscopy, Government, CCC, Contract management, Canadian Commercial Corporation, Acquisition, United States Department of Defense, FTIR, Government of Canada, Versatile, VSR, Fourier transform, Arms industry, Cryptocurrency

OTTAWA, April 06, 2023 (GLOBE NEWSWIRE) -- The Canadian Commercial Corporation (CCC) has signed another contract with the U.S. Department of Defense (U.S. DoD) for the acquisition of a Hyperspectral Imaging System built by LR Tech.

Key Points: 
  • OTTAWA, April 06, 2023 (GLOBE NEWSWIRE) -- The Canadian Commercial Corporation (CCC) has signed another contract with the U.S. Department of Defense (U.S. DoD) for the acquisition of a Hyperspectral Imaging System built by LR Tech.
  • Based in Lévis, Quebec, LR Tech develops instruments based on infrared (IR) and spectrally-resolved IR technologies for atmospheric and defense remote sensing applications.
  • The company’s ASSIST-II atmospheric sounder and fast scanning VSR (Versatile SpectroRadiometer) are based on state-ot-the-art FTIR (Fourier Transform Infrared) designs.
  • “This contract with the U.S. DoD is another example of the innovative remote sensing capabilities that are available from Canada,” said Diane Montambault, Vice-President of Contract Management and Operations at CCC.

MaxLinear Announces Production Availability of 5nm Keystone 800G PAM4 DSP Solutions for Hyperscale Cloud Deployments

Retrieved on: 
Thursday, March 2, 2023
Semiconductor, Data Management, Technology, Networks, Internet, Hardware, Cloud, PAM4, EMLE, Multimedia, US, Metro, TX, VCSEL, LR, FFE, Conference, KGD, DSP, DPD, MXL, FR, CMOS, EML, Family, Wire, DSPS, AOCS, Swings, AEC Q-type, Growth, VSR, Silicon, AEC, Tias, Video game, Telescopic sight, MaxLinear, Keystone

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, today announced the production availability of the Keystone family of DSPs, the industry’s first 5nm CMOS 800Gbps PAM4 DSP for hyperscale data center applications.

Key Points: 
  • MaxLinear, Inc. (Nasdaq: MXL), a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, today announced the production availability of the Keystone family of DSPs, the industry’s first 5nm CMOS 800Gbps PAM4 DSP for hyperscale data center applications.
  • View the full release here: https://www.businesswire.com/news/home/20230302005368/en/
    MaxLinear Announces Production Availability of 5nm Keystone 800G PAM4 DSP Solutions for Hyperscale Cloud Deployments (Graphic: Business Wire)
    An ongoing surge in the use of cloud services to increase productivity and improve customer experiences underlies the growth of hyperscale data centers.
  • “The extremely low power consumption and small form factors of Keystone solutions enable both 7Watt 400G optical module designs and 13Watt 800G designs.
  • With the power advantages of 5nm CMOS technology, we are directly addressing our customers’ critical needs for low power, highly integrated, high performance interconnect solutions in next generation hyperscale cloud networks.”
    The Keystone 5nm DSP family has been designed to address both 400G and 800G applications.