Cadence Design Systems, Inc. v. Avanti Corp

SkyWater Technology Reports Third Quarter 2023 Results

Retrieved on: 
Wednesday, November 8, 2023

SkyWater Technology, Inc. (NASDAQ: SKYT), the trusted technology realization partner, today announced financial results for the third quarter of 2023, ended October 1, 2023.

Key Points: 
  • SkyWater Technology, Inc. (NASDAQ: SKYT), the trusted technology realization partner, today announced financial results for the third quarter of 2023, ended October 1, 2023.
  • Gross margin increased to 19.8% on a GAAP basis, compared to 15.8% in Q3 2022, and increased to 20.4% on a non-GAAP basis, compared to 16.9% in Q3 2022.
  • Adjusted EBITDA of $8.3 million, or 11.6% of revenue, compared to $3.8 million, or 7.3% of revenue in Q3 2022.
  • “SkyWater again achieved revenue upside and sequential growth in what was a very strong third quarter for our ATS business,” commented Thomas Sonderman, SkyWater chief executive officer.

Sourceability® Named "Outstanding Independent Distributor" and "Outstanding Supply Chain Service Provider" by AspenCore

Retrieved on: 
Tuesday, November 7, 2023

MIAMI, Nov. 7, 2023 /PRNewswire/ -- Sourceability , a global digital distributor of electronic components and supply chain service provider, announces today it has been awarded "Outstanding Independent Distributor" and "Outstanding Supply Chain Service Provider" by AspenCore's Electronic Component Distributor Awards program at IIC Shenzhen 2023.

Key Points: 
  • MIAMI, Nov. 7, 2023 /PRNewswire/ -- Sourceability , a global digital distributor of electronic components and supply chain service provider, announces today it has been awarded "Outstanding Independent Distributor" and "Outstanding Supply Chain Service Provider" by AspenCore's Electronic Component Distributor Awards program at IIC Shenzhen 2023.
  • This marks the fourth year in a row that Sourceability has received a distinction from AspenCore.
  • "We remain committed to developing world-class products and services to help digitally transform the electronic component supply chain."
  • Winners were selected by a committee comprised of AspenCore's global senior industry analysts and online users from Asia, the US and Europe.

SkyWater Announces Availability of Cadence Open-Source PDK and Reference Design for SkyWater’s 130 nm Process

Retrieved on: 
Friday, November 3, 2023

SkyWater Technology , (Nasdaq: SKYT), the trusted technology realization partner today announced a new SkyWater open-source 130 nm process design kit (PDK) from Cadence Design Systems, Inc., which will be available in the Cadence® VLSI (very large-scale integration) Fundamentals Education Kit.

Key Points: 
  • SkyWater Technology , (Nasdaq: SKYT), the trusted technology realization partner today announced a new SkyWater open-source 130 nm process design kit (PDK) from Cadence Design Systems, Inc., which will be available in the Cadence® VLSI (very large-scale integration) Fundamentals Education Kit.
  • To overcome this issue, SkyWater collaborated with Cadence to create an open-source chip manufacturing program on 130 nm CMOS process (SKY130).
  • The SKY130 process has gained popularity among academia and researchers and can be easily accessed from GitHub with no NDA necessary.
  • The design is based on a simple Arm-based microprocessor and is being migrated to the SKY130 PDK.

Spirent and Cadence Collaborate to Bring Advanced Chipset Testing to Pre-Silicon Verification

Retrieved on: 
Tuesday, October 31, 2023

The collaboration brings sophisticated virtual Ethernet traffic emulation and testing capabilities to pre-silicon verification in the Cadence Palladium® Z2 Enterprise Emulation and Protium™ X2 Enterprise Prototyping systems.

Key Points: 
  • The collaboration brings sophisticated virtual Ethernet traffic emulation and testing capabilities to pre-silicon verification in the Cadence Palladium® Z2 Enterprise Emulation and Protium™ X2 Enterprise Prototyping systems.
  • Jointly developed by Spirent and Cadence, the solution is designed to enable the increasing data bandwidths needed to verify designs for data centers and other high-performance applications.
  • It will help reduce development time, simplify testing of the complex Ethernet chipset design process, and ensure that new products perform as expected.”
    Michael Young, senior product management group director, System and Verification Group at Cadence said: “Through our work with Spirent, Cadence is continuing our commitment to work with industry leaders to bring best-in-class solutions to the pre-silicon verification market.
  • “The new unified test platform reduces testing complexity and accelerates the technology design and development of Ethernet chipsets.”

Plugfest Advances Adoption of MIPI I3C Designs

Retrieved on: 
Tuesday, September 26, 2023

The publicly available, royalty-free MIPI I3C Basic is a subset of I3C that bundles the most commonly needed I3C features for developers and other standards organizations.

Key Points: 
  • The publicly available, royalty-free MIPI I3C Basic is a subset of I3C that bundles the most commonly needed I3C features for developers and other standards organizations.
  • Public versions of MIPI I3C Basic and MIPI Debug for I3C are available to download and use by developers and the open-source community.
  • “The MIPI I3C and Debug for I3C Plugfest exemplified the power of collaboration to foster seamless integration and efficiency across a breadth of applications, reinforcing the immense potential of the I3C specification.”
    The next I3C and Debug for I3C plugfest is planned for 2024 in conjunction with the 67th member meeting in Taipei, Taiwan.
  • Cadence has a strong I3C IP offering, and our participation in the plugfest facilitates the broad adoption of the MIPI I3C standard.”
    “Interoperability testing is an important step in validating new product designs," said Matthew Schnoor, debug architect with Intel Corporation.

Is AI the Future for the Evolution of Electronic Design Automation (EDA) Tools

Retrieved on: 
Tuesday, September 26, 2023

According to allaboutcircuits.com ,"For years, EDA companies have claimed "artificial intelligence" features in their IC design tools.

Key Points: 
  • According to allaboutcircuits.com ,"For years, EDA companies have claimed "artificial intelligence" features in their IC design tools.
  • Over the last decade, there has been significant growth in the integration of AI technologies within Electronic Design Automation (EDA) tools.
  • AI has played a pivotal role in enhancing various aspects of EDA, such as design automation, optimization, verification, and physical design (Todorov & Dabral, 2020).
  • But it's no secret that electronic design automation (EDA) companies are folding AI into more of their offerings to speed up design and verification."

Engineering Services Market size to grow by USD 365.9 billion from 2022 to 2027, AECOM, AKKA Technologies SE, Babcock International Group Plc, and more among key companies- Technavio

Retrieved on: 
Monday, September 25, 2023

NEW YORK, Sept. 24, 2023 /PRNewswire/ -- The engineering services market is expected to grow by USD 365.9 billion from 2022 to 2027.

Key Points: 
  • NEW YORK, Sept. 24, 2023 /PRNewswire/ -- The engineering services market is expected to grow by USD 365.9 billion from 2022 to 2027.
  • In addition, the growth momentum of the market will progress at a CAGR of 4.2% during the forecast period, according to Technavio.
  • AECOM - The company offers engineering services such as Advanced modeling, Building engineering, Hydraulic services, and Specialty structures.
  • The IT professional services market is estimated to grow at a CAGR of 9.09% between 2022 and 2027.

OIF Showcases Multi-vendor Interoperability at ECOC 2023: Demo Features Nearly 40 Companies Demonstrating Innovation Across 400ZR+, Co-Packaging, CEI-112G & CEI-224G and CMIS

Retrieved on: 
Wednesday, September 20, 2023

ECOC, taking place Oct. 2-4 in Glasgow, Scotland, provides an ideal platform for OIF and its member companies to showcase their multi-vendor interoperability achievements.

Key Points: 
  • ECOC, taking place Oct. 2-4 in Glasgow, Scotland, provides an ideal platform for OIF and its member companies to showcase their multi-vendor interoperability achievements.
  • We’ve expanded this year’s public demonstration to showcase progress to include the OpenZR+ and OpenROADM applications over a multi-span ROADM network.
  • Co-Packaging Solutions Demo: Showcasing innovative approaches to integrating multiple chips within a single package, revolutionizing performance and power efficiency in electronic devices.
  • “Attendees at ECOC can also look forward to celebrating OIF’s 25-year journey in fostering industry-wide collaboration and interoperability,” added Klempa.

OIF Achieves Milestone with Largest Ever Multi-Vendor Interoperability Demo at ECOC 2023, Featuring 39 Companies Accelerating Implementation of Next-Generation Capabilities

Retrieved on: 
Wednesday, August 9, 2023

OIF , where the optical networking industry’s interoperability work gets done, will showcase its largest-ever multi-vendor interoperability demonstration at ECOC 2023 , being held October 2-4 in Glasgow, Scotland.

Key Points: 
  • OIF , where the optical networking industry’s interoperability work gets done, will showcase its largest-ever multi-vendor interoperability demonstration at ECOC 2023 , being held October 2-4 in Glasgow, Scotland.
  • Additionally, during ECOC, OIF will continue its commemoration of 25 years dedicated to driving meaningful progress in the industry.
  • 39 companies will participate in live and static interoperability demos at OIF’s booth #304, highlighting advancements in four key technology areas: 400ZR+ optics, Co-Packaging solutions, Common Electrical I/O (CEI) channels and Common Management Interface Specification (CMIS) implementations.
  • The interoperability demo is supported by participating companies Telefonica and LightRiver.

The Clinton Health Access Initiative to Partner with the Cadence Giving Foundation on Sustainable Climate Innovation

Retrieved on: 
Wednesday, August 2, 2023

Of the 2.8 billion people living in the hottest parts of the world, only eight percent currently possess air conditioners.

Key Points: 
  • Of the 2.8 billion people living in the hottest parts of the world, only eight percent currently possess air conditioners.
  • Cadence will act as a catalyst investor for this initiative, with the Cadence Giving Foundation providing a significant investment toward supporting climate solutions through the development of clean technology.
  • The Cadence Giving Foundation is committed to bringing innovation, technical expertise and philanthropy together to make a lasting, positive impact throughout the world.
  • “Through this collaboration with the Clinton Health Access Initiative, we will be jointly working to find solutions to alleviate the global climate crisis and make a positive impact.