Tias

Semtech Pioneers the Path to 6G with Advanced 5G Wireless Technologies

Retrieved on: 
Tuesday, March 26, 2024
Semiconductor, 5G, Mobile, Wireless, Technology, Telecommunications, DWDM, MZM, TIA, Semtech, MOPA, CDR, Internet of things, Laser, Tias, Corporation, Wavelength-division multiplexing, EML, Silicon, Sumitomo Electric Industries, Exhibition, Ericsson, SFP56, Multimedia, Digital divide, Marketing, PAM4, MIMO, RAN, Mobile phone

Highlighting its Tri-Edge™ GN2256 for 50G DWDM applications alongside its expansive 5G wireless portfolio, Semtech is setting new standards for the telecommunications industry, facilitating the global transition towards next-generation networks and a smarter, more connected world.

Key Points: 
  • Highlighting its Tri-Edge™ GN2256 for 50G DWDM applications alongside its expansive 5G wireless portfolio, Semtech is setting new standards for the telecommunications industry, facilitating the global transition towards next-generation networks and a smarter, more connected world.
  • Semtech is at the forefront of this innovation, crafting chips that enhance the performance and bandwidth capabilities of DWDM systems.
  • Visit us at the Semtech booth #5301 at OFC for a live demonstration of these exciting use-cases.
  • Semtech’s 5G wireless Tri-Edge CDR portfolio includes:
    Semtech’s 5G wireless FiberEdge TIA portfolio includes:
    Semtech’s comprehensive 5G wireless ClearEdge® CDR portfolio includes:

MACOM to Demonstrate 100G/Lane Switch to Server Link with LPO Interface at OFC 2024

Retrieved on: 
Monday, March 25, 2024
Technology, Semiconductor, Security, Satellite, Photography, Telecommunications, Nanotechnology, Software, Audio, Video, VoIP, Networks, Internet, Mobile, Wireless, Hardware, Electronic Design Automation, Data Management, Consumer Electronics, Cloud, Optical networking, Product marketing, Conference, DSP, Tias, DRIVE, LPO, Communication, Architecture, Linearity, TIDEL Park Coimbatore, Digital signal

The live demonstration of the optical link leverages:

Key Points: 
  • The live demonstration of the optical link leverages:
    The switch-to-server link represents an important use case for the linear drive architecture, which can provide an optimized interconnect solution for Cloud infrastructure.
  • Linear drive modules eliminate the Digital Signal Processor (DSP) from pluggable optical modules enabling lower power consumption, improving signal latency and reducing cost.
  • “Due to linear drive’s benefits, the demand for linear pluggable optical (LPO) modules with MACOM PURE DRIVE technology is expanding.
  • We are pleased to demonstrate a working example of 100G/lane switch-to-server connectivity leveraging this technology,” said Ryan Latchman, Vice President, High-Performance Connectivity Product Marketing, MACOM.

Marvell Announces Industry's First 5nm Transmit-Only 800G PAM4 Optical DSP for AI and Cloud Interconnects

Retrieved on: 
Monday, March 25, 2024
DSP, Tias, Spica, Marvell Technology, Perseus, AI, TRO, IEEE, DSPS, Architecture, PAM4, Data-rate units, MRVL

SANTA CLARA, Calif., March 25, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Spica Gen2-T, the industry's first 5nm 800 Gbps transmit-only PAM4 optical DSP.

Key Points: 
  • SANTA CLARA, Calif., March 25, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Spica Gen2-T, the industry's first 5nm 800 Gbps transmit-only PAM4 optical DSP.
  • To enable cloud service providers to optimize their infrastructure, Marvell has reduced power per bit and cost per bit with every generation of optical DSPs.
  • Spica Gen2-T is the latest member of the Marvell family of 800 Gbps optical DSPs, the most widely deployed optical DSP in cloud data centers and AI clusters2.
  • Spica, Spica Gen2, Spica Gen2-T, and Perseus are all based on the Marvell industry-leading PAM4 optical DSP architecture .

MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

Retrieved on: 
Thursday, February 1, 2024
Mobile, Wireless, Technology, Semiconductor, Security, Other Technology, Telecommunications, Networks, Hardware, Data Management, Consumer Electronics, MXL, Multimedia, Nvidia BR02, DFE, DPD, FFE, SW, DSP, AEC, EML, KGD, CMOS, DSPS, Host, Insight Partners, PDK, PAM4, High Speed, Metro, AOCS, HW, Tias, Video game

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, today announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone.

Key Points: 
  • MaxLinear, Inc. (Nasdaq: MXL), a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, today announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone.
  • The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables.
  • View the full release here: https://www.businesswire.com/news/home/20240201593558/en/
    MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP (Graphic: Business Wire)
    MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers.
  • Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption.

Marvell Joins Ultra Ethernet Consortium to Drive Network Enhancements for AI and Accelerated Computing

Retrieved on: 
Tuesday, November 28, 2023
Linux Foundation, MRVL, GM, Marvell Technology, PAM4, UEC, AEC, API, Ultra, Software, Communication, Original equipment manufacturer, DCI, AI, Silicon, Tias, Human, Internet service provider, Video game, Ethernet

SANTA CLARA, Calif., Nov. 28, 2023 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it has joined the Ultra Ethernet Consortium (UEC), part of the Linux Foundation's Joint Development Foundation. Enormous changes in cloud infrastructure are being driven by generative AI workloads and a shift from traditional computing architectures toward accelerated computing. The UEC is bringing leading companies together to cooperate on developing Ethernet specifications and software APIs to ensure data center networks can meet these new performance and interoperability demands.

Key Points: 
  • Enormous changes in cloud infrastructure are being driven by generative AI workloads and a shift from traditional computing architectures toward accelerated computing.
  • The shift to accelerated computing is disrupting cloud data center architectures and driving the need for higher performance, higher bandwidth, and lower-latency infrastructure at an unprecedented cadence.
  • The collaboration with Marvell and the rest of the members will expedite the integration of UEC-inspired Ethernet enhancements into comprehensive systems, ready to meet the dynamic demands of the market," said Dr. J Metz, steering committee chair of Ultra Ethernet Consortium.
  • The consortium will work on minimizing communication stack changes while maintaining and promoting Ethernet interoperability.

Optomind and MaxLinear announce collaboration on PAM4 112Gbps OSFP 800Gbps SR8 transceiver solution at ECOC Exhibition 2023

Retrieved on: 
Sunday, October 1, 2023
Data Management, Technology, Manufacturing, Nanotechnology, Networks, Other Manufacturing, Hardware, SR, MXL, Mechanics, OSFP, MaxLinear, GPT, DSP, SR8, Mexicali, OSA, AOC, EML, Tias, HPC, Exhibition, Architecture, Ecosystem, ECOC, AEC Routemaster, VCSEL, Family, AOCS, Telecommunications, Video game

Optomind and MaxLinear will be demonstrating 800Gbps OSFP active optical cables (AOC) and SR8 optical transceivers at ECOC 2023 Exhibition, in Glasgow, Scotland, October 2-4 (Booth #775, Optomind; #776, MaxLinear).

Key Points: 
  • Optomind and MaxLinear will be demonstrating 800Gbps OSFP active optical cables (AOC) and SR8 optical transceivers at ECOC 2023 Exhibition, in Glasgow, Scotland, October 2-4 (Booth #775, Optomind; #776, MaxLinear).
  • Optomind has developed the best-in-class PAM4 100Gbps/lane SR optical transceivers and AOCs using MaxLinear's 5nm Keystone PAM4 DSP.
  • The low-power, high-performance AOCs and transceivers that Optomind and MaxLinear have developed together are ideal for these applications.
  • Optomind selected MaxLinear's 5nm Keystone PAM4 DSP as the best-in-class solution for 800Gbps SR8 transceiver with high-performance and the lowest power consumption to meet the market demand.

Semtech Announces Production Availability of Best-in-Class FiberEdge® Linear Transimpedance Amplifier and Laser Driver for Short Reach 400G and 800G Data Center Applications

Retrieved on: 
Tuesday, September 5, 2023
Networks, Internet, Hardware, Data Management, Technology, IOT (Internet of Things), Semiconductor, Mobile, Wireless, Semtech, Digital signal processing, Noise, Digital signal, DSP, Internet of things, TIA, Multimedia, LPO, AOC, PAM4, Corporation, Tias, CIOE, Vertical-cavity surface-emitting laser, VCSEL, Audio power amplifier, AOCS, Electronics, Printed circuit board

Semtech Corporation (Nasdaq: SMTC), a high-performance semiconductor, IoT systems and cloud connectivity service provider, today announced production availability of the FiberEdge® GN1816 and GN1848 chipset to its portfolio of PAM4 Transimpedance Amplifiers (TIAs) and Linear Laser Drivers.

Key Points: 
  • Semtech Corporation (Nasdaq: SMTC), a high-performance semiconductor, IoT systems and cloud connectivity service provider, today announced production availability of the FiberEdge® GN1816 and GN1848 chipset to its portfolio of PAM4 Transimpedance Amplifiers (TIAs) and Linear Laser Drivers.
  • View the full release here: https://www.businesswire.com/news/home/20230905446519/en/
    Semtech announces production availability of the FiberEdge® GN1816 and GN1848 chipset to its portfolio of PAM4 Transimpedance Amplifiers (TIAs) and Linear Laser Drivers.
  • The FiberEdge GN1848 is a 56GBd quad low power, low cost, highly linear and industry leading Vertical-Cavity Surface-Emitting Laser (VCSEL) driver.
  • Both chips are available as wire-bondable bare dies and are designed for 400GBASE-SR4/VR4 and 800GBASE-SR8/VR8 PAM4 multi-mode optical transceivers and AOCs.

Svante Named a World’s Top 100 Private Deep Tech Companies & Finalist in the 2023 Tech Innovation Awards

Retrieved on: 
Tuesday, June 20, 2023
Sustainability, Environment, Other Manufacturing, Alternative Energy, Energy, Environmental Health, Green Technology, Manufacturing, Carbon, Climate, General counsel, Atmosphere, Carbon dioxide, GE, Temasek, Climate change, MOF, Tias, XPRIZE, Imagination, CO2, CCUS, Cryptocurrency, Renewable energy, Pharmaceutical industry, Svante

Carbon capture and removal solutions provider, Svante Technologies Inc. (Svante), announced today that it has been recognized on the XB100 , a notable ranking of the world’s top 100 private deep tech companies published by XPRIZE and Bessemer Venture Partners.

Key Points: 
  • Carbon capture and removal solutions provider, Svante Technologies Inc. (Svante), announced today that it has been recognized on the XB100 , a notable ranking of the world’s top 100 private deep tech companies published by XPRIZE and Bessemer Venture Partners.
  • The company has also been recognized as a finalist in the BC Tech 2023 Technology Impact Awards (TIAs).
  • Svante has been headquartered in BC, Canada since 2007 and has made sizable advancements in the global carbon capture, utilization, and storage (CCUS) space since then.
  • “The companies on the XB100 list represent the most valuable and impactful private companies in the deep tech sector,” said Tess Hatch, partner at Bessemer Venture Partners.

Don’t Miss ‘Un Cafecito Sin Nervios’ – How To Help Middle School Latino Kids Open Up About Their Emotional Well-Being – An Exclusive Broadcast Event Only On Vme TV!

Retrieved on: 
Wednesday, March 22, 2023
Tias, Council, Music, Depression, Sound Mind Live, Parent, Anxiety, Communication, V-me, Ad Council, Mental health, Grandparent, Emotion, Tune, Viewer, Marketing, CDC, Hispanic Heritage Foundation, MANA, Manas National Park, Huntsman Mental Health Institute, MANA, A National Latina Organization, Norm (mathematics), Father, VME, Caregiver, Nursing, Television

MIAMI, March 22, 2023 (GLOBE NEWSWIRE) -- Tune in on Sunday March 26th at 3pm on Vme TV for an exclusive broadcast event: Un Cafecito Sin Nervios, A Conversation on Protecting Our Middle Schoolers’ Mental Health.  The show is part of the Sound It Out campaign, created by the Ad Council and Pivotal Ventures, with guidance from a panel of leading mental health experts.  Sound It Out uses the power of music to help parents and caregivers have meaningful conversations with their middle schoolers about emotional wellbeing.

Key Points: 
  • Sound It Out uses the power of music to help parents and caregivers have meaningful conversations with their middle schoolers about emotional wellbeing.
  • The Vme TV-sponsored, nationally televised show will bring awareness to the ongoing mental health crisis among our nation’s Latino youth.
  • Viewers will receive tips, and resources to help parents and caregivers have open conversations with their kids about their emotional wellbeing and how they are feeling.
  • “Middle school can be a challenging and stressful time for many children,” said Michael Fernandez, VP of Marketing for Vme TV.

Semtech Unveils New Products for Next-Gen Data Centers, PON and 5G Wireless Networks to Address Increasing Data Demands

Retrieved on: 
Tuesday, March 7, 2023
Data Management, Semiconductor, IOT (Internet of Things), Technology, Networks, Internet, Hardware, Cloud, Business Integration Group, Inc., Corporation, Digital, OFC, Signal integrity, Artificial intelligence, Semtech, Copper, Mixed-signal integrated circuit, Cloud computing, Signal, Broadcom Inc., MOPA, Internet of things, PON, Tias, TIA, Marketing, Video game, Road, Internet service provider

The new products provide customers with the low power, low cost and low-latency solutions needed for hyperscale data center applications, wireless infrastructure, and access and enterprise networking.

Key Points: 
  • The new products provide customers with the low power, low cost and low-latency solutions needed for hyperscale data center applications, wireless infrastructure, and access and enterprise networking.
  • The digital revolution—spurred by the rapid adoption of IoT-based technology, Artificial Intelligence (AI), automotive, Cloud services, mobile subscriptions and more—is rapidly increasing worldwide data usage that drives the need for higher data rates in data center, PON and wireless networks.
  • Semtech’s optical networking platform provides the backbone IC technology to support these higher rates and global data usage.
  • By improving networks at the chip level, Semtech is allowing our customers to prepare their networks for the exponential growth in data demands expected in the next few years.