Microelectromechanical systems

Top US MEMS Semiconductor Foundry Raises $30m Series C Financing

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Tuesday, November 8, 2022
Cloud, CHIPS, Novo, Glass, Growth, Life, Economics, ITAR, Biochip, Entrepreneurship, Genomics, Microelectromechanical systems, Silicon, Partnership, Cloud computing, Internet of things, Investment, Leadership, MEMS, Solution, IOT, Technology, Airline, Renewable energy, Borosilicate glass, Medical imaging, Cerium, Atom (character)

SANTA BARBARA, Calif., Nov. 8, 2022 /PRNewswire-PRWeb/ -- Atomica Corp, a leader of micro electro-mechanical systems (MEMS), today announced a $30 million Series C financing. The round was funded by Cerium Technology Ventures, Novo Tellus Capital Partners, and St. Cloud Capital. The new financing allows Atomica to expand its foundry capabilities, advance MEMS technologies, and support domestic production of biochips, sensors, and photonic circuits.

Key Points: 
  • Cloud Capital
    SANTA BARBARA, Calif., Nov. 8, 2022 /PRNewswire-PRWeb/ -- Atomica Corp , a leader of micro electro-mechanical systems (MEMS), today announced a $30 million Series C financing.
  • The new financing allows Atomica to expand its foundry capabilities, advance MEMS technologies, and support domestic production of biochips, sensors, and photonic circuits.
  • Atomica is the leading US MEMS foundry, partnering with innovative system-vendors and fabless device firms globally to bring new technologies to life.
  • These investments aid our efforts to grow and protect domestic U.S. manufacturing of MEMS and related semiconductor technologies."

EV GROUP ADVANCES LEADERSHIP IN OPTICAL LITHOGRAPHY WITH NEXT-GENERATION EVG150 RESIST PROCESSING PLATFORM

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Monday, November 7, 2022
Nanotechnology, Booth, Research, 3D, Industry, Microelectromechanical systems, Multimedia, Industrialisation, AI, IOT, Semiconductor, Electronics, ACE EV Group, EBS, View, EVG, NIL, CPS, MEMS, Silicon, Canon FD 200 mm lens, Solution, Mobile phone, Printed circuit board

ST. FLORIAN, Austria, Nov. 7, 2022 /PRNewswire/ -- EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has strengthened its portfolio of optical lithography solutions with the unveiling of the next-generation 200-mm version of its EVG®150 automated resist processing system. The redesigned EVG150 platform includes advanced features and enhancements that provide even greater throughput (by up to 80 percent) and versatility, as well as smaller tool footprint (by nearly 50 percent), compared to the previous-generation platform. The EVG150 provides reliable and high-quality coating and developing processes in a universal platform that supports a variety of devices and applications, including advanced packaging, MEMS, radio frequency (RF), 3D sensing, power electronics, and photonics. Its high throughput, flexibility and repeatability support the most demanding needs for both high-volume production and industrial development.

Key Points: 
  • Company executives will be available to discuss the next-generation EVG150 resist processing system at SEMICON Europa, taking place next week at the Messe Mnchen in Munich, Germany, from November 15-18 (co-located with Electronica).
  • Silicon Austria Labs, a leading research center for Electronic Based Systems (EBS), is the first customer to receive the next-generation EVG150 system.
  • EVG is now accepting orders for the next-generation EVG150 automated resist processing system, and is offering product demonstrations at EVG's headquarters.
  • Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.

Nanox to Report Third Quarter 2022 Financial Results on November 10, 2022

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Monday, October 31, 2022
Forward-looking statement, Event, Compliance, Solution, Interest, Maintenance, The Company, AI, Terminology, U.S. Securities and Exchange Commission, Company, GLOBE, ARC, NASDAQ, File, Technology, Microelectromechanical systems, COVID-19, Vii, Teleradiology, Review, Investor relations, Efficiency, Risk management

NEVE ILAN, Israel, Oct. 31, 2022 (GLOBE NEWSWIRE) -- NANO-X IMAGING LTD("Nanox" or the "Company," Nasdaq: NNOX) will report its financial results for the third quarter endedSeptember 30, 2022before market onThursday, November 10, 2022.Erez Meltzer, Chief Executive Officer, andRan Daniel, Chief Financial Officer, will host a conference call to review these results and provide a business update beginning at8:30 a.m.

Key Points: 
  • NEVE ILAN, Israel, Oct. 31, 2022 (GLOBE NEWSWIRE) -- NANO-X IMAGING LTD("Nanox" or the "Company," Nasdaq: NNOX) will report its financial results for the third quarter endedSeptember 30, 2022before market onThursday, November 10, 2022.Erez Meltzer, Chief Executive Officer, andRan Daniel, Chief Financial Officer, will host a conference call to review these results and provide a business update beginning at8:30 a.m.
  • Interested parties may register for the conference call using the following link: Nanox Q 3 2022 Earnings Registration Link .
  • You may access the live webcast of the conference call by using the following link: Nanox Q2 2022 Earnings .The link will also be posted in the Investor Relations section of the Nanox website at Events and Presentations .
  • Except as required by law, Nanox undertakes no obligation to update publicly any forward-looking statements after the date of this report to conform these statements to actual results or to changes in the Companys expectations.

Nanox to Host and Livestream ‘ARC Day’ event: Company’s Demonstration of Nanox’s Ecosystem

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Thursday, October 20, 2022
U.S. Securities and Exchange Commission, Teleradiology, Efficiency, LTD, Forward-looking statement, Nasdaq, Radiology, Technology, Company, AI, Q&A, Microelectromechanical systems, Vii, File, GLOBE, Maintenance, ARC, Terminology, COVID-19, Solution, Compliance, Medical imaging, Risk management

Nanox will showcase the Companys holistic, end-to-end 3D medical imaging solution, which integrates Nanox.ARC, Nanoxs artificial intelligence (AI) technology and teleradiology services.

Key Points: 
  • Nanox will showcase the Companys holistic, end-to-end 3D medical imaging solution, which integrates Nanox.ARC, Nanoxs artificial intelligence (AI) technology and teleradiology services.
  • Nanox will be hosting the ARC Day event with a live audience in Neve Ilan on Wednesday, Nov. 16, at 9:30am ET which will be followed by a live Q&A session.
  • Participants can view the demonstration live by visiting https://nanox.virtualmagix.com/ to pre-register.
  • Nano-X Imaging Ltd (Nasdaq: NNOX) is focused on applying its proprietary medical imaging technology and solutions to make diagnostic medicine more accessible and affordable across the globe.

The Market for Wearable Sensors Is Expanding, Says IDTechEx

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Tuesday, October 11, 2022
Prevalence, Growth, Subscription business model, Sleep, Electrode, Research, Brain, Forecasting, Technology, CGM, Consultant, VO2, Marketing, PPG, Chemical substance, Athlete, Microelectromechanical systems, Skin, Heart, Vital signs, Medical imaging, Instrumentation

However, despite its origin in simple step counting, the market for wearable sensors is expanding into the more complex arena of health monitoring.

Key Points: 
  • However, despite its origin in simple step counting, the market for wearable sensors is expanding into the more complex arena of health monitoring.
  • The latest wearable sensors report from IDTechEx, " Wearable Sensors 2023-2033 ", breaks down the complex landscape of sensor types, biometrics, and form factors.
  • This includes inertial measurement units, optical sensors, and chemical sensors for vital signs, stress, sleep, and even brain activity.
  • The latest wearable sensors report from IDTechEx dedicates a section to four key categories of electrodes: wet, dry, microneedle, and electronic skin.

The Market for Wearable Sensors Is Expanding, Says IDTechEx

Retrieved on: 
Tuesday, October 11, 2022
Prevalence, Growth, Subscription business model, Sleep, Electrode, Research, Brain, Forecasting, Technology, CGM, Consultant, VO2, Marketing, PPG, Chemical substance, Athlete, Microelectromechanical systems, Skin, Heart, Vital signs, Medical imaging, Instrumentation

However, despite its origin in simple step counting, the market for wearable sensors is expanding into the more complex arena of health monitoring.

Key Points: 
  • However, despite its origin in simple step counting, the market for wearable sensors is expanding into the more complex arena of health monitoring.
  • The latest wearable sensors report from IDTechEx, " Wearable Sensors 2023-2033 ", breaks down the complex landscape of sensor types, biometrics, and form factors.
  • This includes inertial measurement units, optical sensors, and chemical sensors for vital signs, stress, sleep, and even brain activity.
  • The latest wearable sensors report from IDTechEx dedicates a section to four key categories of electrodes: wet, dry, microneedle, and electronic skin.

EV GROUP AND TOPPAN PHOTOMASK JOIN FORCES TO ACCELERATE MARKET ADOPTION OF NANOIMPRINT LITHOGRAPHY FOR PHOTONICS MANUFACTURING

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Monday, September 19, 2022
ACE EV Group, Adhesive, Adoption, Electronics, HVM, NIL, MNE, Smartphone, EVG, Knowledge, TPC, Booth, Industry, IP, Nanotechnology, Semiconductor, Technology, NNT, Solution, Silicon, Micro, Ecosystem, Microelectromechanical systems, Conference, Multimedia, AI, MEMS, View, Nanoimprint lithography, Printed circuit board, Online shopping

ST. FLORIAN, Austria and TOKYO, Sept. 19, 2022 /PRNewswire/ -- EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Toppan Photomask Co. Ltd., the world's premier photomask provider, today announced that they have entered into an agreement to jointly market nanoimprint lithography (NIL) as an enabling high-volume manufacturing (HVM) process for the photonics industry.

Key Points: 
  • Toppan Photomask sees a bright future as NIL grows into another successful lithography solution, enabled by both companies' established strengths."
  • With this collaboration between two established industry leaders in lithography and photomask fabrication, respectively, EVG and Toppan Photomask intend to fuel the adoption of NIL as a mainstream HVM technology for the photonics industry.
  • According to Markus Wimplinger, corporate technology development and IP director at EV Group, "We are excited to be partnering with Toppan Photomask to bring nanoimprint lithography to mainstream manufacturing applications.
  • Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.

EV Group Revolutionizes 3D Integration from Advanced Packaging to Transistor Scaling with NanoCleave Layer Release Technology

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Monday, September 12, 2022
ACE EV Group, 3D IC, Glass, Adhesive, Temperature, Time, Memory, CFET-FM, 3D, ICS, ST, NIL, 300C, EVG, Booth, Industry, Nanotechnology, IR, Semiconductor, Technology, 4th floor, Solution, Silicon, Taipei Nangang Exhibition Center, Microelectromechanical systems, MEMS, Semiconductor device fabrication, 3D printing, Borosilicate glass, Printed circuit board

ST. FLORIAN, Austria, Sept. 12, 2022 /PRNewswire/ -- EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced NanoCleave™, a revolutionary layer release technology for silicon that enables ultra-thin layer stacking for front-end processing, including advanced logic, memory and power device formation, as well as semiconductor advanced packaging. NanoCleave is a fully front-end-compatible layer release technology that features an infrared (IR) laser that can pass through silicon, which is transparent to the IR laser wavelength. Coupled with the use of specially formulated inorganic layers, this technology enables an IR laser-initiated release of any ultra-thin film or layer from silicon carriers with nanometer precision.

Key Points: 
  • NanoCleave is a fully front-end-compatible layer release technology that features an infrared (IR) laser that can pass through silicon, which is transparent to the IR laser wavelength.
  • As a result, NanoCleave enables silicon wafer carriers in advanced packaging processes such as Fan-out Wafer-level Packaging (FoWLP) using mold and reconstituted wafers as well as interposers for 3D Stacked ICs (3D SIC).
  • Our NanoCleave layer release technology is a game-changer for semiconductor scaling through thin-layer and die stacking, with the potential to address the most pressing requirements of the industry.
  • Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.

Nanox to Present at Two Upcoming Investor Conferences in September 2022

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Thursday, September 8, 2022
Microelectromechanical systems, COVID-19, Technology, ARC, File, NASDAQ, Solution, Maintenance, LTD, Investor relations, Forward-looking statement, U.S. Securities and Exchange Commission, Teleradiology, GLOBE, Conference, Company, Compliance, Efficiency, Terminology, Compans-Caffarelli, Vii, AI, Television, Public relations, Risk management

The presentation is scheduled for Wednesday, September 21st at 8:30 am Eastern Time and will be accessible via a live webcast here .

Key Points: 
  • The presentation is scheduled for Wednesday, September 21st at 8:30 am Eastern Time and will be accessible via a live webcast here .
  • A replay of presentation will be available after the conclusion of the live presentation on the Investor Relations section of the Companys website .
  • The presentation is scheduled forThursday, September 29th at 4:30 pm Eastern Time and will be accessible via a live webcast here .
  • The webcast replay will be available after the conclusion of the live presentation on the Investor Relations section of the Compan y s website .

EV Group Expands Collaboration with ITRI on Heterogeneous Integration Process Development

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Tuesday, August 30, 2022
Nanotechnology, EVG, Ministry, Microelectromechanical systems, 3D, Technology, ACE EV Group, Research, Artificial intelligence, DB, Solution, R, MOEA, Multilateralism, Department, Electronic, Semiconductor, Industrial technology, NIL, Industrial Technology Research Institute, Doit, Department of Sustainability, Environment, Water, Population and Communities, MEMS, TSMC, Module (mathematics), ITRI, Economy, Ecosystem, Laboratory, Growth, UMC, Ministry of Economic Affairs (Taiwan), Renewable energy

The installation of these high-volume-manufacturing platforms at ITRI's state-of-the-art facility will help enable EVG's and ITRI's shared customers to accelerate the development and transfer of new heterogeneous integration processes from R&D to customers' fabs.

Key Points: 
  • The installation of these high-volume-manufacturing platforms at ITRI's state-of-the-art facility will help enable EVG's and ITRI's shared customers to accelerate the development and transfer of new heterogeneous integration processes from R&D to customers' fabs.
  • As a result, the MOEA is proactively following up and bridging the resources with national-scale R&D projects such as "AI Chip Heterogeneous Integrated Module Advanced Manufacturing Platform" and "Programmable Heterogeneous 3D Integration".
  • EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices.
  • Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.