DMEA | Jotup

Middle East and Africa Downstream Market Monitor - ResearchAndMarkets.com

Retrieved on:

Tuesday, December 5, 2023

Energy, Other Energy, Oil, Gas, DMEA, MEA

The "Downstream ME & Africa Monitor" newsletter has been added to ResearchAndMarkets.com's offering.

Key Points:

The "Downstream ME & Africa Monitor" newsletter has been added to ResearchAndMarkets.com's offering.
In a region which has shown both extensive investment and increased instability over the past few years, MEA merits a significant degree of technically minded and industry-focused coverage.
While DMEA details mid- and downstream company activity throughout the Middle East and Africa, it also contains information of tender announcements and awards, allowing customers to be kept aware of what their competitors are up to as well as informing them of new opportunities.
Iran lines up Latin American investments, partnerships

$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US

Retrieved on:

Monday, November 27, 2023

Glass, Defense industrial base, BEOL, DMEA, Ecosystem, OSD, Silicon–germanium, Advanced packaging (semiconductors), ASIP, Back end of line, AIT, Gallium nitride, Defense

The award was made through the Department of Defense (DoD) to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP) solutions.

Key Points:

The award was made through the Department of Defense (DoD) to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP) solutions.
The IBAS Cornerstone Re-shore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics (RESHAPE) award includes options for additional Advanced Packaging manufacturing capabilities, which would further augment Micross' production capabilities and accelerate throughput.
"The Defense Industrial Base will benefit from the RESHAPE on-shoring effort to further Advanced Packaging manufacturing capabilities with Micross Components", stated Matt Walsh, OSD IBAS Advanced Packaging Chief Engineer.
"The OSD IBAS organization understands the critical need for an Advanced Packaging ecosystem in the U.S., and this contract award to Micross is part of that effort."

GlobalFoundries Awarded $35 Million Funding from U.S. Government to Accelerate Manufacturing of Next-Generation GaN Chips

Retrieved on:

Wednesday, October 18, 2023

ESSEX JUNCTION, Vt., Oct. 18, 2023 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) has been awarded $35 million in federal funding from the U.S. government to accelerate the manufacturing of GF’s differentiated gallium nitride (GaN) on silicon semiconductors at its facility in Essex Junction, Vermont.

Key Points:

ESSEX JUNCTION, Vt., Oct. 18, 2023 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) has been awarded $35 million in federal funding from the U.S. government to accelerate the manufacturing of GF’s differentiated gallium nitride (GaN) on silicon semiconductors at its facility in Essex Junction, Vermont.
This funding brings GF closer to large-scale production of GaN chips, which are unique in their ability to handle high voltages and temperatures.
The funding builds on years of collaboration with the U.S. government – including $40 million in support from 2020-2022 – that leverages the talent of GF's Vermont team and their 200mm semiconductor manufacturing experience, and applies it to GaN-on-silicon manufacturing.
“GF has a longstanding partnership with the U.S. government, and this funding is critical to move GaN on silicon chips closer to volume production.

GlobalFoundries and U.S. Department of Defense Showcase Secure Chip Manufacturing at 2023 Trusted Foundry Training

Retrieved on:

Thursday, October 12, 2023

IP, Silicon, U.S. Department of Defense Strategy for Operating in Cyberspace, Government, AI, GFS, United States Department of Defense, GF, TAPO, DMEA, DARPA, GlobalFoundries, Head, Trusted Foundry Program

MALTA, N.Y., Oct. 12, 2023 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) and the U.S. Department of Defense (DoD) will host a group of leaders and technologists from across the aerospace and defense industry on October 18-19 at GF’s Trusted Foundry Training 2023 in Arlington, Virginia.

Key Points:

MALTA, N.Y., Oct. 12, 2023 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) and the U.S. Department of Defense (DoD) will host a group of leaders and technologists from across the aerospace and defense industry on October 18-19 at GF’s Trusted Foundry Training 2023 in Arlington, Virginia.
The invite-only event will showcase the critical role of Trusted chip manufacturing for sensitive national defense applications and highlight how essential chips securely manufactured by GF are enabling innovation and provide an efficient path to new technology development across a range of markets.
The new contract was the third sequential 10-year contract of its kind between the DoD and the Trusted Foundry business team at GF.
At the Trusted Foundry Training event, Steven J. Morani, DoD principal deputy assistant secretary of defense for sustainment, will deliver the keynote address on Oct. 18.

U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing

Retrieved on:

Thursday, September 21, 2023

Partnership, U.S. Department of Defense Strategy for Operating in Cyberspace, Atmosphere, GlobalFoundries, United States Department of Defense, IP, Government, DMEA, GFS, TAPO, ITAR, Ecosystem, Trusted Foundry Program, GF, Risk management, Property management

In addition to secure chip manufacturing for DoD systems used on land, air, sea, and in space, the new contract provides the DoD and its contractors with access to GF’s robust design ecosystem, IP libraries, early-access to new technologies in development, quick and efficient prototyping, and full-scale volume manufacturing.

Key Points:

In addition to secure chip manufacturing for DoD systems used on land, air, sea, and in space, the new contract provides the DoD and its contractors with access to GF’s robust design ecosystem, IP libraries, early-access to new technologies in development, quick and efficient prototyping, and full-scale volume manufacturing.
The contract was awarded through the DoD’s Defense Microelectronics Activity (DMEA) Trusted Access Program Office (TAPO).
“This partnership provides DoD programs with ‘front-door access’ to advanced technologies in a way that is scalable and highly efficient.
Click here to learn more about the importance and impact of GF’s Trusted Foundry accreditations.

Blackwatch to Provide Engineering and Manufacturing Sustainment Services for DMEA

Retrieved on:

Monday, September 18, 2023

Black Watch, Semiconductor, United States Department of Homeland Security, Partnership, Justice, Senior, Defense, IDIQ, Transport, DMEA, Federal government of the United States, Acquisition, U.S. Department of Defense Strategy for Operating in Cyberspace, Integrated circuit, Management, Operation, Energy

As part of the initial award, Blackwatch received a $34.6 million task order.

Key Points:

As part of the initial award, Blackwatch received a $34.6 million task order.
"We are excited to build on our longstanding and successful commitment with the DMEA to provide high quality support for their one-of-a-kind semiconductor foundry," said Blackwatch Senior Vice President of Strategic Growth Lee Tanner.
"This contract presents a significant opportunity for Blackwatch to enhance the types of services we can provide to Federal organizations to help achieve their strategic national security objectives."
The DMEA is at the forefront of microelectronics technology and is composed of more than 200 advanced technology specialists and engineering facilities.

With ECS Support, DMEA First to Obtain ServiceNow NSC Authorization to Operate

Retrieved on:

Tuesday, September 12, 2023

ECS , a leader in advanced technology, science, and engineering solutions and an ASGN (NYSE: ASGN) brand, is the first IT provider to stand up a customer in the secure ServiceNow National Security Cloud (NSC) and achieve authorization to operate (ATO).

Key Points:

ECS , a leader in advanced technology, science, and engineering solutions and an ASGN (NYSE: ASGN) brand, is the first IT provider to stand up a customer in the secure ServiceNow National Security Cloud (NSC) and achieve authorization to operate (ATO).
ECS has enabled Defense Microelectronics Activity (DMEA) — the Department of Defense (DoD) laboratory that helps to provide the U.S. government with leading-edge microelectronics technologies — to use the ServiceNow platform in the NSC.
DMEA’s migration to the NSC is the first of many ECS plans to carry out.
“ECS provided the expert risk-management framework and ATO services that enabled DMEA to obtain the first ATO in the National Security Cloud and go live with ServiceNow,” said Martin Burke , vice president of Integrated Solutions at ECS.

U.S. Government Accredits GlobalFoundries to Manufacture Trusted Semiconductors at New York Facility

Retrieved on:

Tuesday, May 30, 2023

“We are proud to deepen our relationship with the Defense Department, and to receive DMEA accreditation at our New York manufacturing facility.

Key Points:

“We are proud to deepen our relationship with the Defense Department, and to receive DMEA accreditation at our New York manufacturing facility.
Accrediting GlobalFoundries to manufacture our country’s sensitive chips strengthens the domestic microelectronics industrial base and our nation’s efforts to fortify its semiconductor supply chain for national and economic security.
GF employs approximately 2,500 people in Malta, New York, and has invested more than $15 billion in the facility.
GF also manufactures Trusted semiconductor chips for the DoD at its facility in Vermont.

CENTOGENE to Participate in Upcoming Conferences in April

Retrieved on:

Friday, April 14, 2023

Diagnosis, DMEA, Convention center, Fashion design, Online shopping, Pharma

and ROSTOCK, Germany, and BERLIN, April 14, 2023 (GLOBE NEWSWIRE) -- Centogene N.V. (Nasdaq: CNTG), the essential life science partner for data-driven answers in rare and neurodegenerative diseases, today announced its conference schedule for April 2023.

Key Points:

and ROSTOCK, Germany, and BERLIN, April 14, 2023 (GLOBE NEWSWIRE) -- Centogene N.V. (Nasdaq: CNTG), the essential life science partner for data-driven answers in rare and neurodegenerative diseases, today announced its conference schedule for April 2023.
CENTOGENE representatives will be attending events in Spain, the U.S., and Germany and will be available to discuss Pharma, CRO, and Diagnostic collaboration opportunities.
Please see additional details below:
Location: Barcelona International Convention Centre (CCIB), Barcelona, Spain
To learn more about Pharma 2023 and set up an in-person meeting with the CENTOGENE team, please visit the event webpage ( https://link.centogene.com/3K13jDb ).
To learn more about DMEA 2023 and set up an in-person meeting with the CENTOGENE team, please visit the event webpage ( https://link.centogene.com/43BuYDx ).

Tektronix Partners with BRIDG to Boost Domestic Semiconductor Package Testing

Retrieved on:

Tuesday, November 8, 2022

BEAVERTON, Ore., Nov. 8, 2022 /PRNewswire/ -- Tektronix Inc., a leading provider in test and measurement solutions, announced today an official collaboration with BRIDG, a not-for-profit, public-private partnership specializing in advanced system integration and integrated circuit packaging. This collaboration will expand advanced semiconductor package testing capabilities in the US.

Key Points:

This collaboration will expand advanced semiconductor package testing capabilities in the US.
Tektronix is partnering with BRIDG to develop new techniques to test the latest state-of-the-art packaging.
The partnership leverages Tektronix' state-of-the-art package test services and capabilities to provide semiconductor testing, advanced package testing, and 2.5D/3D testing for BRIDG customers.
Tektronix is expanding domestic packaging production by integrating innovative solutions driving advanced packaging technology such as 2.5D/3D architectures, which reduce size, weight, power, and cost versus traditional semiconductor packaging.