$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Retrieved on:
Monday, November 27, 2023
The award was made through the Department of Defense (DoD) to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP) solutions.
Key Points:
- The award was made through the Department of Defense (DoD) to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP) solutions.
- The IBAS Cornerstone Re-shore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics (RESHAPE) award includes options for additional Advanced Packaging manufacturing capabilities, which would further augment Micross' production capabilities and accelerate throughput.
- "The Defense Industrial Base will benefit from the RESHAPE on-shoring effort to further Advanced Packaging manufacturing capabilities with Micross Components", stated Matt Walsh, OSD IBAS Advanced Packaging Chief Engineer.
- "The OSD IBAS organization understands the critical need for an Advanced Packaging ecosystem in the U.S., and this contract award to Micross is part of that effort."