TCB

CytomX Therapeutics Announces Nomination of Second Clinical Candidate in Broad PROBODY® T-Cell Engaging Bispecific (TCB) Collaboration with Astellas

Retrieved on: 
Wednesday, April 3, 2024
Senior, Patient, SAN, TCB, Research, Therapy

SOUTH SAN FRANCISCO, Calif., April 03, 2024 (GLOBE NEWSWIRE) -- CytomX Therapeutics, Inc. today announced the achievement of a second clinical candidate nomination under the companies’ TCB collaboration with Astellas, triggering a $5 million milestone payment to CytomX. CytomX and Astellas are collaborating on multiple conditionally activated TCB programs with CytomX eligible to receive additional future preclinical, clinical and commercial milestones. CytomX retains a cost share and co-commercialization option on a select number of targets.

Key Points: 
  • SOUTH SAN FRANCISCO, Calif., April 03, 2024 (GLOBE NEWSWIRE) -- CytomX Therapeutics, Inc. today announced the achievement of a second clinical candidate nomination under the companies’ TCB collaboration with Astellas, triggering a $5 million milestone payment to CytomX.
  • CytomX and Astellas are collaborating on multiple conditionally activated TCB programs with CytomX eligible to receive additional future preclinical, clinical and commercial milestones.
  • CytomX retains a cost share and co-commercialization option on a select number of targets.
  • “The achievement of clinical candidate nomination for the second Probody® TCB program in our broad collaboration with Astellas underscores our capabilities in the exciting field of conditionally activated, masked T-cell engaging bispecifics.

TCBP Increasing Treatment Capacity with Expanded Manufacturing Process

Retrieved on: 
Tuesday, April 2, 2024
PLC, Patient, TCB, Holding, Doctor of Philosophy, Senior, Cancer, TC, Commercialization, Process

This undertaking, which will utilize its current infrastructure, will provide a cost reduction of 85% per patient treatment.

Key Points: 
  • This undertaking, which will utilize its current infrastructure, will provide a cost reduction of 85% per patient treatment.
  • The Company expects to implement the improved manufacture process into its current facility in the next 24 months.
  • "These new initiatives will allow us to increase capacity while simultaneously reducing the cost of our per patient treatment once optimized," said Dr. Lauren Bor, Ph.D., Process Development and Commercialization, Senior Manager.
  • Additionally, I believe that these developments will lay the groundwork for commercialization plan and increasing TC BioPharm's manufacturing footprint."

IDTechEx Explores Technology Trends in Dielectric Materials for Next Generation 2.5D and 3D Semiconductor Packaging

Retrieved on: 
Wednesday, March 27, 2024
Temperature, Communication, Silicon dioxide, L/S, Polymer, Copper, CTE, Coefficient, CMP, TCB, Intermetallic, RDL, Miniaturization, Ecosystem, Young, Viscoelasticity, IMC, Printed circuit board

This article explores the technology trends in dielectric materials for both 2.5D and 3D packaging, with insights drawn from IDTechEx's market report on the topic, " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ".

Key Points: 
  • This article explores the technology trends in dielectric materials for both 2.5D and 3D packaging, with insights drawn from IDTechEx's market report on the topic, " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ".
  • However, traditional inorganic dielectric materials like SiO2, though capable of achieving fine L/S, suffer from high dielectric constants (Dk=3.9) and are tied to the Si manufacturing technique.
  • Organic dielectric materials emerge as promising alternatives for advanced semiconductor packaging, offering lower dielectric constants and cost advantages.
  • Finally, the report includes a 10-year market forecast for Organic Dielectric Advanced Semiconductor Packaging, providing industry perspectives on market growth and trends.

IDTechEx Explores Technology Trends in Dielectric Materials for Next Generation 2.5D and 3D Semiconductor Packaging

Retrieved on: 
Wednesday, March 27, 2024
Temperature, Communication, Silicon dioxide, L/S, Polymer, Copper, CTE, Coefficient, CMP, TCB, Intermetallic, RDL, Miniaturization, Ecosystem, Young, Viscoelasticity, IMC, Printed circuit board

This article explores the technology trends in dielectric materials for both 2.5D and 3D packaging, with insights drawn from IDTechEx's market report on the topic, " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ".

Key Points: 
  • This article explores the technology trends in dielectric materials for both 2.5D and 3D packaging, with insights drawn from IDTechEx's market report on the topic, " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ".
  • However, traditional inorganic dielectric materials like SiO2, though capable of achieving fine L/S, suffer from high dielectric constants (Dk=3.9) and are tied to the Si manufacturing technique.
  • Organic dielectric materials emerge as promising alternatives for advanced semiconductor packaging, offering lower dielectric constants and cost advantages.
  • Finally, the report includes a 10-year market forecast for Organic Dielectric Advanced Semiconductor Packaging, providing industry perspectives on market growth and trends.

Media Alert: Intel at Open Confidential Computing Conference 2024

Retrieved on: 
Friday, March 8, 2024
Software, Networks, Hardware, Artificial Intelligence, Data Management, Technology, Semiconductor, Security, Edgeless, Architecture, Growth, MMIO, Microsoft Azure, Coco, SDK, Acceleration, Trust (social science), Central processing unit, Workload, Hope for Justice, VM, SGX, TCB, OC3, CCNP, Memory, GPU, Pasupathy, AMD, BIOS, Microsoft, Ant Group, Partnership, Computer, HPC, Operational technology, Linux kernel interfaces, API, Azure, Safety, Data mapper pattern, CVM, Research, NRAS, Intel, AI, Risk, OS, Rest, Computer security software, Graphics processing unit, TEE, Justice, CPU

Clouds are varied in their infrastructure and multiple confidential computing vendors, each potentially with multiple product generations, offering confidential CPUs, GPUs and other special-purpose processing units.

Key Points: 
  • Clouds are varied in their infrastructure and multiple confidential computing vendors, each potentially with multiple product generations, offering confidential CPUs, GPUs and other special-purpose processing units.
  • Technical readiness and market momentum will converge in 2024 to accelerate growth and adoption of confidential computing.
  • Intel and Nvidia deliver confidential computing technologies that establish independent TEEs on the CPU and GPU, respectively.
  • Intel technology enables the Private Data Exchange to leverage confidential computing, which processes sensitive data out of view from unauthorized software or system administrators.

TD Awards $5 Million to U.S. Organizations Addressing Systemic Barriers to Affordable Housing

Retrieved on: 
Tuesday, March 5, 2024
Professional Services, Philanthropy, Other Philanthropy, Finance, Foundation, Banking, LMI, National Association, Bank, Housing, HOME, Work, Financial security, Toronto-Dominion Bank, Risk, TCB, City, Organization, Mobility, HSSF, Renewable energy

This year's recipients include five U.S. non-profit organizations providing innovative solutions that address systemic barriers to affordable housing across the continuum from transitional to permanent homes.

Key Points: 
  • This year's recipients include five U.S. non-profit organizations providing innovative solutions that address systemic barriers to affordable housing across the continuum from transitional to permanent homes.
  • The lack of affordable housing causes serious ripple effects that impact everything from health outcomes to educational opportunities to overall financial security," said Shelley Sylva, Head of U.S. Corporate Citizenship at TD Bank.
  • "Through the TD Ready Challenge, we're standing behind organizations with promising new ideas to address systemic barriers to permanent and stable housing in communities across our footprint and helping to create additional economic opportunities for all."
  • "Clarifi is proposing a multi-intervention strategy to address barriers to affordable and sustainable housing for low-to-moderate individuals and families in the Greater Philadelphia area.

Andersen Named One of 'America's Greatest Workplaces for Women 2024' by Newsweek

Retrieved on: 
Tuesday, March 5, 2024
Interface (computing), Parity, Andersen Corporation, Culture, TCB, Workplace, Workforce, Environment, Management

BAYPORT, Minn., March 5, 2024 /PRNewswire/ -- Andersen Corporation, manufacturer of America's most loved brand of windows and doors*, has been named a Newsweek America's Greatest Workplaces for Women 2024. This ranking highlights the companies that have created the best working environment for women based on a range of metrics, including compensation, diversity and work-life balance, according to women in the workforce. Andersen received the highest possible rating of five stars.

Key Points: 
  • BAYPORT, Minn., March 5, 2024 /PRNewswire/ -- Andersen Corporation, manufacturer of America's most loved brand of windows and doors*, has been named a Newsweek America's Greatest Workplaces for Women 2024.
  • In cooperation with Plant-A Insights Group, Newsweek interviewed over 142,000 women across the U.S. about their companies' diversity policies and efforts.
  • The Women Leaders of Andersen network is focused on empowering, supporting and inspiring women in their careers and lives.
  • Andersen proudly highlights the women leaders within the company, including the following executives:
    This America's Greatest Workplaces for Women recognition is the latest accolade for Andersen's commitment to being a company where all employees feel welcomed, valued and inspired to achieve their full potential, including:

The 2023 TD Ready Challenge awarded $10 million in total to 10 Canadian and American organizations focused on addressing barriers to accessing affordable housing

Retrieved on: 
Tuesday, March 5, 2024
National Association, Climate change, Organization, LMI, Bank, HOME, TCB, Roof, Woman, Birdcage Inn, City, Employment, Homelessness, WHC, Senior counsel, Indigenous, Refugee, Hope, USD, CDN, Risk, Policy, All, Mobility

"Boosting access to affordable housing helps strengthen communities and helps them prosper in a way that can lead to sustainable economic growth.

Key Points: 
  • "Boosting access to affordable housing helps strengthen communities and helps them prosper in a way that can lead to sustainable economic growth.
  • For 2023, there were 10 grants available under the TD Ready Challenge across North America.
  • Eligible Canadian-based organizations were able to apply for CDN$1 million and eligible US-based organizations were able to apply for USD$1 million.
  • To learn more about the 2023 TD Ready Challenge grant recipients and the TD Ready Challenge Grant program, visit www.td.com/readychallenge .

IDTechEx Explores Advanced Semiconductor Packaging Technologies: 2.5D and 3D Insights

Retrieved on: 
Wednesday, January 10, 2024
Silicon, PCB, Glass, Area studies, Silicon dioxide, Electronics, Intermetallic, AI, Ecosystem, Communication, TCB, CTE, 3D, Thermal expansion, Copper, ICS, Intel, Growth, Printed circuit board

Four critical parameters shape advanced semiconductor packaging : power, performance, area, and cost:

Key Points: 
  • Four critical parameters shape advanced semiconductor packaging : power, performance, area, and cost:
    Power: Enhancing power efficiency through innovative packaging technologies.
  • Cost: Continuously reducing packaging costs by employing alternative, more affordable materials or enhancing manufacturing equipment efficiency
    2.5D and 3D packaging technology:
    The 2.5D and 3D packaging technologies encompass various packaging techniques.
  • Key aspects of this report:
    Exploring Technology Trends and Manufacturers in Advanced Semiconductor Packaging:
    Explore advanced semiconductor packaging evolution, addressing transistor IC challenges.
  • This webinar will reveal insights into 2.5D and 3D advanced semiconductor packaging technologies and the content include:
    2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis
    3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis
    Click here to find out more and register your place on one of our three sessions.

IDTechEx Explores Advanced Semiconductor Packaging Technologies: 2.5D and 3D Insights

Retrieved on: 
Wednesday, January 10, 2024
Silicon, PCB, Glass, Area studies, Silicon dioxide, Electronics, Intermetallic, AI, Ecosystem, Communication, TCB, CTE, 3D, Thermal expansion, Copper, ICS, Intel, Growth, Printed circuit board

Four critical parameters shape advanced semiconductor packaging : power, performance, area, and cost:

Key Points: 
  • Four critical parameters shape advanced semiconductor packaging : power, performance, area, and cost:
    Power: Enhancing power efficiency through innovative packaging technologies.
  • Cost: Continuously reducing packaging costs by employing alternative, more affordable materials or enhancing manufacturing equipment efficiency
    2.5D and 3D packaging technology:
    The 2.5D and 3D packaging technologies encompass various packaging techniques.
  • Key aspects of this report:
    Exploring Technology Trends and Manufacturers in Advanced Semiconductor Packaging:
    Explore advanced semiconductor packaging evolution, addressing transistor IC challenges.
  • This webinar will reveal insights into 2.5D and 3D advanced semiconductor packaging technologies and the content include:
    2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis
    3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis
    Click here to find out more and register your place on one of our three sessions.