TCB

TC BioPharm Announces Formation of Commercial Development Division, Led by Industry Veteran, Dr. Lauren Bor Ph.D

Retrieved on: 
Monday, December 18, 2023
Technology transfer, Economics, Bachelor, IND, PLC, Research, Process, TC, Holding, Doctor of Philosophy, Eye, Cancer, TCB, MHC, GMP, University, Type 1 diabetes, University College London, Research fellow, King's College London, CD19, UCL, Generation, Pharmaceutical industry

Additionally, TC BioPharm's Commercial Development Division will explore new opportunities with third parties to monetize the company's production capabilities using the GMP licensed facility.

Key Points: 
  • Additionally, TC BioPharm's Commercial Development Division will explore new opportunities with third parties to monetize the company's production capabilities using the GMP licensed facility.
  • Prior to serving as TC BioPharm's Head of Process Development, Dr. Bor completed a Bsc Hons degree in Immunology from the University of Glasgow.
  • Lauren Joined TC BioPharm in 2019, and her area of research has been the process development and technology transfer of TC BioPharm's Unmodified cryopreserved Vγ9Vδ2 T cell manufacturing process.
  • "TC BioPharm understands that early-stage biotech companies have different needs and expectations than that of large pharmaceutical companies.

Kulicke & Soffa Announces Multiple Advanced Packaging Orders Supporting Long-Term AI Opportunities

Retrieved on: 
Wednesday, November 15, 2023
GPU, CPO, Artificial intelligence, Silicon photonics, TPU, Machine learning, CPU, Growth, AI, Life, Industrial design, TCB

SINGAPORE, Nov. 15, 2023 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company") announced today that the Company has received multiple orders for its Thermocompression Bonding (TCB) solutions, primarily supporting Silicon Photonics (SiPh) based Co-Packaged Optics (CPO) applications deployed in high-bandwidth networking transceivers. K&S anticipates a series of follow on CPO orders to support aggressive capacity expansion plans throughout fiscal years 2024 and 2025. CPO units are anticipated to grow at a 66% CAGR through calendar year 2033 and represent only an individual component to the much larger Artificial Intelligence (AI) opportunity.

Key Points: 
  • K&S anticipates a series of follow on CPO orders to support aggressive capacity expansion plans throughout fiscal years 2024 and 2025.
  • Kulicke & Soffa's high-performance advanced packaging solutions are an increasingly critical enabler for leading-edge scaling which is allowing higher bandwidth networks, faster machine learning applications and more advanced mobility features.
  • "Our capable, performance-focused advanced packaging solutions are driving significant market interest, as they efficiently address many emerging assembly challenges.
  • These recent orders highlight our leadership in TCB, but also validate the growth potential of the emerging advanced packaging marketplace," said John Molnar, K&S Vice President & General Manager, Advanced Solutions.

CytomX Therapeutics Reports Third Quarter 2023 Financial Results and Provides Business Update

Retrieved on: 
Tuesday, November 7, 2023
EGFR, Neoplasm, Bristol Myers Squibb, Research, Trial of the century, NSCLC, CD71, CD3, PDT, EDT, MSS, Regeneron Pharmaceuticals, Colorectal cancer, Workforce, Conference, PD-1, Inflammation, Ipilimumab, Interferon, BMS, Epithelial cell adhesion molecule, SITC, Immunotherapy, Preclinical development, ADC, CRC, Amgen, Webcast, Annual general meeting, Tumor microenvironment, Therapeutic index, Lung cancer, Society, Society for Immunotherapy of Cancer, Therapy, Patient, Investment, Toxicity, SAN, TCB, Pharmaceutical industry, Vaccine, IND, Astellas Pharma, Cancer

SOUTH SAN FRANCISCO, Calif., Nov. 07, 2023 (GLOBE NEWSWIRE) -- CytomX Therapeutics, Inc. (Nasdaq: CTMX), a leader in the field of conditionally activated, localized biologics, today reported third quarter 2023 financial results and provided a business update.

Key Points: 
  • We have continued to diligently manage our financial resources and drive towards value-inflecting pipeline milestones,” said Sean McCarthy, D.Phil., chief executive officer and chairman of CytomX Therapeutics.
  • Preclinical profile of EpCAM-directed antibody drug conjugate CX-2051 presented at 2023 World ADC Conference – In October 2023, Dr. Marcia Belvin, chief scientific officer, CytomX Therapeutics, presented data characterizing the preclinical profile for CX-2051.
  • CX-2051 is tailored for treatment of EpCAM-expressing cancers by matching target expression and tumor sensitivity with a topoisomerase-1 inhibitor payload.
  • CytomX management will host a conference call and simultaneous webcast today at 5 p.m. EDT (2 p.m. PDT) to discuss the financial results and provide a business update.

Clubhouse Media Group, Inc. Announces TCB's 2023 Mrs Japan Joins HoneyDrip.com

Retrieved on: 
Thursday, October 26, 2023
Social media, Empowerment, TCB, Music, Nursing

LOS ANGELES, Oct. 26, 2023 /PRNewswire/ -- Clubhouse Media Group, Inc. (OTCMKTS: CMGR) ("CMGR"), a social media firm and digital agency, today announced that Yurie Rodriguez, model and TCB's 2023 Mrs. Japan, has joined HoneyDrip.com.

Key Points: 
  • LOS ANGELES, Oct. 26, 2023 /PRNewswire/ -- Clubhouse Media Group, Inc. (OTCMKTS: CMGR) ("CMGR"), a social media firm and digital agency, today announced that Yurie Rodriguez, model and TCB's 2023 Mrs. Japan, has joined HoneyDrip.com.
  • Honeydrip.com is a digital platform designed and wholly owned by CMGR with a focus on the empowerment of creators.
  • "We are beyond excited to have Yurie join the roster," said Alexandra Bolanos, Manager at HoneyDrip.com.
  • "We have grown into an international platform, with creators joining from countries all over the world such as Japan, Australia, Canada, England, and Israel (to name a few)."

YMCA of Metro Chicago to Serve as Social-Enterprise Partner in Assemble Chicago

Retrieved on: 
Thursday, September 21, 2023
Recreation, Heart, YMCA, Partnership, Studio, City, Community Builders Group, Y, Ellis Park, Organization, Loop, The, Student, State Street, Chicago metropolitan area, Restaurant, The Loop, C40, Architecture, Metro Chicago, Casino, Tunnel, Chicago Park District, TCB

CHICAGO, Sept. 21, 2023 /PRNewswire/ -- The YMCA of Metropolitan Chicago today announced the organization's plans to open a Loop YMCA in partnership with Assemble Chicago, a proposed mixed-use development in the heart of downtown Chicago that will also provide apartments affordable to a range of incomes, a wellness clinic, and a restaurant opening onto a revitalized Pritzker Park.

Key Points: 
  • In addition to serving as an anchor for Assemble Chicago, the new Loop YMCA will re-establish the YMCA of Metro Chicago's community presence in the city's downtown area.
  • "As an impact-driven initiative focused on holistic community wellbeing and sustainability, Assemble Chicago provides an incredible opportunity for the Y on our journey to strengthen all neighborhoods across the region."
  • "The Community Builders is thrilled to have the YMCA join Assemble Chicago.
  • "A YMCA and TCB partnership combines our capacities to help build strong communities where all people can thrive."

Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging

Retrieved on: 
Friday, September 15, 2023
Hardness, Pressure, ECD, IMC, 3D, RDL, Intermetallic, Temperature, EMC, MUF, CMP, Miniaturization, Risk, Knowledge, Copper, Ecosystem, CU, TCB, Printed circuit board

Their reports, titled " Advanced Semiconductor Packaging 2023-2033 " and " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ", encapsulate their in-depth analysis and insights into the rapidly evolving landscape of 3D semiconductor packaging.

Key Points: 
  • Their reports, titled " Advanced Semiconductor Packaging 2023-2033 " and " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ", encapsulate their in-depth analysis and insights into the rapidly evolving landscape of 3D semiconductor packaging.
  • Challenges in Cu-Cu Hybrid Bonding Manufacturing:
    Cu-Cu hybrid bonding technology holds great promise for advanced semiconductor packaging, but it also presents a set of challenges that require innovative solutions for future development.
  • To learn more about 3D semiconductor packaging (Cu-Cu hybrid bonding), please refer to the IDTechEx report: "Materials and Processing for Advanced Semiconductor Packaging 2024-2034".
  • The report continues beyond the discussion of 2.5D packaging to the third part, which focuses on the innovative Cu-Cu hybrid bonding technology for 3D semiconductor packaging (Cu-Cu hybrid bonding).

Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging

Retrieved on: 
Friday, September 15, 2023
Hardness, Pressure, ECD, IMC, 3D, RDL, Intermetallic, Temperature, EMC, MUF, CMP, Miniaturization, Risk, Knowledge, Copper, Ecosystem, CU, TCB, Printed circuit board

Their reports, titled " Advanced Semiconductor Packaging 2023-2033 " and " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ", encapsulate their in-depth analysis and insights into the rapidly evolving landscape of 3D semiconductor packaging.

Key Points: 
  • Their reports, titled " Advanced Semiconductor Packaging 2023-2033 " and " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ", encapsulate their in-depth analysis and insights into the rapidly evolving landscape of 3D semiconductor packaging.
  • Challenges in Cu-Cu Hybrid Bonding Manufacturing:
    Cu-Cu hybrid bonding technology holds great promise for advanced semiconductor packaging, but it also presents a set of challenges that require innovative solutions for future development.
  • To learn more about 3D semiconductor packaging (Cu-Cu hybrid bonding), please refer to the IDTechEx report: "Materials and Processing for Advanced Semiconductor Packaging 2024-2034".
  • The report continues beyond the discussion of 2.5D packaging to the third part, which focuses on the innovative Cu-Cu hybrid bonding technology for 3D semiconductor packaging (Cu-Cu hybrid bonding).

Kulicke & Soffa Collaborates with UCLA

Retrieved on: 
Tuesday, August 8, 2023
CHIPS, IDM, HBM, Bruce Kulick, OSAT, Senior, KLIC, 3D, Product-form solution, University of California, Temperature, Professor, University, HPC, CMOS, Artificial intelligence, Silicon, Performance, UCLA, Printed circuit board, Video game, Engineering, TCB

SINGAPORE, Aug. 8, 2023 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company") announced its expanded collaboration with The University of California, Los Angeles, Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) to deliver cost-effective advanced solutions which are needed within Artificial Intelligence (AI), high-performance computing (HPC) and data-center applications today. As the need for leading-edge packaging technology moves into higher-volume markets, yield, throughput and productivity are becoming increasingly important.

Key Points: 
  • SINGAPORE, Aug. 8, 2023 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. ( NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company") announced its expanded collaboration with The University of California, Los Angeles, Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) to deliver cost-effective advanced solutions which are needed within Artificial Intelligence (AI), high-performance computing (HPC) and data-center applications today.
  • K&S joined UCLA CHIPS as a charter member in 2016 to develop ultrafine pitch micro-bump interconnect solutions.
  • Kulicke & Soffa's innovative fluxless process eliminates contamination concerns while ensuring interconnect integrity through an integrated delivery platform.
  • With our collaboration and continuous development efforts with UCLA, we are confident that K&S micro-bump interconnect solutions will deliver exceptional value to support the rapidly evolving industry."

CytomX Therapeutics Reports Second Quarter 2023 Financial Results and Provides Business Update

Retrieved on: 
Tuesday, August 8, 2023
Workforce, Amgen, Sutro Biopharma, Therapy, Drug development, University, Senior, VaxGen, Regeneron Pharmaceuticals, CD3, Neoplasm, CMC, Therapeutic index, PDT, Toxicity, Bristol Myers Squibb, Research, Medicine, CMO, University of North Carolina at Greensboro, EDT, Science, Trial of the century, Patent, Patient, AbbVie, Investment, EGFR, Ipilimumab, Colorectal cancer, SAN, CD71, Webcast, ADC, Jazz Pharmaceuticals, BMS, Interferon, Safety, IND, Tumor microenvironment, Biology, TCB, Management, Vaccine, Pharmaceutical industry, Cryptocurrency, Quality, Chemistry

SOUTH SAN FRANCISCO, Calif., Aug. 08, 2023 (GLOBE NEWSWIRE) -- CytomX Therapeutics, Inc. (Nasdaq: CTMX), a leader in the field of conditionally activated, localized biologics, today reported second quarter 2023 financial results and provided a business update.

Key Points: 
  • - Management to hold conference call today at 5 p.m. EDT / 2 p.m. PDT -
    SOUTH SAN FRANCISCO, Calif., Aug. 08, 2023 (GLOBE NEWSWIRE) -- CytomX Therapeutics, Inc. (Nasdaq: CTMX), a leader in the field of conditionally activated, localized biologics, today reported second quarter 2023 financial results and provided a business update.
  • In the private placement, CytomX sold pre-funded warrants and accompanying tranche warrants at a combined price of $2.08 per share.
  • Yu-Waye (Wayne) Chu, M.D., joins CytomX as Chief Medical Officer – In July 2023, CytomX announced the appointment of Yu-Waye (Wayne) Chu, M.D., as Chief Medical Officer (CMO).
  • CytomX management will host a conference call and simultaneous webcast today at 5 p.m. EDT (2 p.m. PDT) to discuss the financial results and provide a business update.

BE Semiconductor Industries N.V. Announces Q2-23 and H1-23 Results

Retrieved on: 
Thursday, July 27, 2023
Share repurchase, Smartphone, Weakness, OSAT, Applied Materials, Video game, AI, TCB

DUIVEN, the Netherlands, July 27, 2023 (GLOBE NEWSWIRE) -- BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the second quarter and first half year ended June 30, 2023.

Key Points: 
  • For the quarter, revenue of € 162.5 million and net income of € 52.6 million increased by 21.8% and 52.5%, respectively, versus Q1-23.
  • Sequential revenue growth benefited from increased smartphone demand this year versus 2022 partially offset by weakness broadly in computing end-user markets.
  • Cumulatively, Besi has returned € 1.7 billion to shareholders over the past 13 years, representing approximately 30% of total revenue.
  • In addition, we expect gross margins to range between 62-64% and for operating expenses to decline by 10-15% versus Q2-23.