IDTechEx Explores Technology Trends in Dielectric Materials for Next Generation 2.5D and 3D Semiconductor Packaging
This article explores the technology trends in dielectric materials for both 2.5D and 3D packaging, with insights drawn from IDTechEx's market report on the topic, " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ".
- This article explores the technology trends in dielectric materials for both 2.5D and 3D packaging, with insights drawn from IDTechEx's market report on the topic, " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ".
- However, traditional inorganic dielectric materials like SiO2, though capable of achieving fine L/S, suffer from high dielectric constants (Dk=3.9) and are tied to the Si manufacturing technique.
- Organic dielectric materials emerge as promising alternatives for advanced semiconductor packaging, offering lower dielectric constants and cost advantages.
- Finally, the report includes a 10-year market forecast for Organic Dielectric Advanced Semiconductor Packaging, providing industry perspectives on market growth and trends.