ISSCC

Silicon Box cutting-edge, advanced panel-level packaging foundry announces $3.6B investment for expansion into Italy

Retrieved on: 
Tuesday, March 12, 2024
Dai, Automation, EV, Socs, Conference, Environment, Original equipment manufacturer, EVS, Intelligence, Business, Education, HPC, Sips, Artificial intelligence, Carbon footprint, Carbon, LLM, Chiplet, Investment, Semiconductor, European, Ecosystem, European Commission, Sustainability, IDMS, Government, ISSCC, Renewable energy

ROME, March 12, 2024 /PRNewswire/ -- Silicon Box cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6B (€3.2B) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility. This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028. The multi-year investment will replicate Silicon Box's flagship foundry in Singapore which has proven capability and capacity for the world's most advanced semiconductor packaging solutions, then expand further into 3D integration and testing. When completed, the new facility will support approximately 1,600 Silicon Box employees in Italy. The construction of the facility is also expected to create several thousand more jobs, including eventual hiring by suppliers. Design and planning for the facility will begin immediately, with construction to commence pending European Commission approval of planned financial support by the Italian State.

Key Points: 
  • This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028.
  • Through the investment, Silicon Box has plans for greater innovation and expansion in Europe, and globally.
  • "We are excited to bring Italy to the forefront of chiplet deployment and the semiconductor industry, through this investment into the world's most advanced packaging solution.
  • Notably, Silicon Box facilities specialize in advanced chiplet integration capabilities ("advanced packaging"), on a large manufacturing format for scale.

Silicon Box cutting-edge, advanced panel-level packaging foundry announces $3.6B investment for expansion into Italy

Retrieved on: 
Tuesday, March 12, 2024
Dai, Automation, EV, Socs, Conference, Environment, Original equipment manufacturer, EVS, Intelligence, Business, Education, HPC, Sips, Artificial intelligence, Carbon footprint, Carbon, LLM, Chiplet, Investment, Semiconductor, European, Ecosystem, European Commission, Sustainability, IDMS, Government, ISSCC, Renewable energy

ROME, March 12, 2024 /PRNewswire/ -- Silicon Box cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6B (€3.2B) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility. This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028. The multi-year investment will replicate Silicon Box's flagship foundry in Singapore which has proven capability and capacity for the world's most advanced semiconductor packaging solutions, then expand further into 3D integration and testing. When completed, the new facility will support approximately 1,600 Silicon Box employees in Italy. The construction of the facility is also expected to create several thousand more jobs, including eventual hiring by suppliers. Design and planning for the facility will begin immediately, with construction to commence pending European Commission approval of planned financial support by the Italian State.

Key Points: 
  • This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028.
  • Through the investment, Silicon Box has plans for greater innovation and expansion in Europe, and globally.
  • "We are excited to bring Italy to the forefront of chiplet deployment and the semiconductor industry, through this investment into the world's most advanced packaging solution.
  • Notably, Silicon Box facilities specialize in advanced chiplet integration capabilities ("advanced packaging"), on a large manufacturing format for scale.

Renesas Unveils Powerful Single-Chip RZ/V2H MPU for Next-Gen Robotics with Vision AI and Real-Time Control

Retrieved on: 
Thursday, February 29, 2024
Semiconductor, Hardware, Robotics, Technology, Artificial Intelligence, Cortex, International, Algorithm, Multimedia, ISSCC, AI, Embedded, Partnership, ICS, Linux, DRP, Conference, OpenCV, BOM, SDK, Reconfigurability, Business analyst, Family, Accelerator, Ben Goertzel, Knowledge, Cloud computing, Software development kit, Software, CPU, Medical device

View the full release here: https://www.businesswire.com/news/home/20240229979997/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20240229979997/en/
    Offering the highest levels of performance within the family, the RZ/V2H enables both vision AI and real-time control capabilities.
  • Additionally, pruning technology employed in the DRP-AI3 accelerator significantly improves AI computing efficiency, boosting AI inference performance up to 80 TOPS.
  • This performance boost allows engineers to process vision AI applications directly at edge AI devices without relying on cloud computing platforms.
  • By integrating these cores into a single chip, the device can effectively manage both vision AI and real-time control tasks, making it ideal for demanding robotics applications of the future.

Renesas Develops New AI Accelerator for Lightweight AI Models and Embedded Processor Technology to Enable Real-Time Processing

Retrieved on: 
Thursday, February 22, 2024
Robotics, Semiconductor, IOT (Internet of Things), Technology, Artificial Intelligence, Internet, Hardware, International, Architecture, Multimedia, ISSCC, AI, IPS, Renesas Electronics, SLAM, DRP, Conference, CNN, Automation, Environment, Central processing unit, Software, CPU, Video game

The newly developed technologies are as follows: (1) A dynamically reconfigurable processor (DRP)-based AI accelerator that efficiently processes lightweight AI models and (2) Heterogeneous architecture technology that enables real-time processing by cooperatively operating processor IPs, such as the CPU.

Key Points: 
  • The newly developed technologies are as follows: (1) A dynamically reconfigurable processor (DRP)-based AI accelerator that efficiently processes lightweight AI models and (2) Heterogeneous architecture technology that enables real-time processing by cooperatively operating processor IPs, such as the CPU.
  • View the full release here: https://www.businesswire.com/news/home/20240222749810/en/
    Dynamically Reconfigurable Processor AI technology from Renesas enables higher speeds and lower power consumption in microprocessor units (MPUs) that realize advanced vision AI.
  • The technologies developed by Renesas are as follows:
    As a typical technology for improving AI processing efficiency, pruning is available to omit calculations that do not significantly affect recognition accuracy.
  • That is why Renesas introduced a dynamically reconfigurable processor (DRP), which handles complex processing, in addition to the CPU and AI accelerator (DRP-AI).

Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs

Retrieved on: 
Wednesday, February 21, 2024
Electronic Design Automation, Semiconductor, Data Management, Technology, Nanotechnology, Hardware, Bias, OTP, International, MB, Cascode, IO, STT-MRAM, ISSCC, AI, Multimedia, Megabit, Temperature, Renesas Electronics, Internet of things, VLSI, Conference, Memory, MCU, EFuse, Hertz, CPU, Computer data storage

It achieves a random read access frequency of over 200 MHz and a write throughput of 10.4-megabytes-per-second (MB/s).

Key Points: 
  • It achieves a random read access frequency of over 200 MHz and a write throughput of 10.4-megabytes-per-second (MB/s).
  • View the full release here: https://www.businesswire.com/news/home/20240221234586/en/
    Renesas test chip with breakthrough fast write and fast read technology.
  • As IoT and AI technologies continue to advance, MCUs used in endpoint devices are expected to deliver higher performance than ever.
  • To address these challenges, Renesas has developed the following new circuit technologies to achieve faster read and write operations in MRAM.

Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising

Retrieved on: 
Monday, January 8, 2024
Dai, Architecture, QFN, Conference, Maverick Capital, LLM, ISSCC, AI, Lam Research, Marvell Technology, LAS, Chiplet, Hillhouse Capital Group, IP, Electronics, SOC, Silicon, STATS, Renewable energy

The company is already forecasting high demand on existing capacity and has successfully closed Series B funding to expand production rapidly.

Key Points: 
  • The company is already forecasting high demand on existing capacity and has successfully closed Series B funding to expand production rapidly.
  • Additionally, Silicon Box's large production format sets a new industry standard for large scale, high yield production especially for advanced chiplet-based designs.
  • Silicon Box announced a successful $200M Series B fundraising round, bringing the company to over a one-billion-dollar valuation.
  • Silicon Box and its technologies are extremely important for the semiconductor industry, and the digital world."

Silicon Box Accelerates Industry Leadership With Production Commencement at Its World Leading Advanced Packaging Facility and Series B Fundraising

Retrieved on: 
Monday, January 8, 2024
Dai, Architecture, QFN, Conference, Maverick Capital, LLM, ISSCC, AI, Lam Research, Marvell Technology, Chiplet, Hillhouse Capital Group, IP, Electronics, SOC, Silicon, STATS, Renewable energy

Company is leading the pack to bring affordable, high performance, power-optimized, scalable solutions that enable next-gen large language models (LLM), generative AI, automotive, data centers, and mobile computing

Key Points: 
  • The company is already forecasting high demand on existing capacity and has successfully closed Series B funding to expand production rapidly.
  • Additionally, Silicon Box's large production format sets a new industry standard for large scale, high yield production especially for advanced chiplet-based designs.
  • Silicon Box announced a successful $200M Series B fundraising round, bringing the company to over a one-billion-dollar valuation.
  • Silicon Box and its technologies are extremely important for the semiconductor industry, and the digital world."

SolidVue, Korea's Exclusive Developer of LiDAR Sensor Chips Showcasing World-Class Technological Capabilities

Retrieved on: 
Tuesday, December 19, 2023
Photon, Conference, SPAD, Solid, Multimedia, UNIST, Robotics, City, International, Semiconductor, Sungkyunkwan University, Electronics, ISSCC, Exhibition, CMOS, Light, Socs, VCS, Growth, Investment, Single-photon avalanche diode, Video game

Established in 2020, SolidVue focuses on designing SoCs (System-on-Chip) for LiDAR sensors that comprehensively assesses the shapes and distances of surrounding objects.

Key Points: 
  • Established in 2020, SolidVue focuses on designing SoCs (System-on-Chip) for LiDAR sensors that comprehensively assesses the shapes and distances of surrounding objects.
  • Jaehyuk Choi, the CEO of SolidVue, disclosed the company's development of Solid-State LiDAR sensor chips, aiming to replace all components of traditional mechanical LiDAR with semiconductors.
  • This innovation is expected to reduce volume by up to one-tenth and costs by around one-hundredth compared to the aforementioned mechanical LiDAR.
  • Utilizing its proprietary CMOS SPAD (Single Photon Avalanche Diode) technology, SolidVue's LiDAR sensor chips flawlessly detect even minute particles of light, enhancing measurement precision.

Chiplet Pioneer Eliyan Names Noted Communications Circuit Expert and IEEE Pederson Award Winner Dr. Behzad Razavi as Chief Technologist

Retrieved on: 
Thursday, April 20, 2023
Bell, International, PHY, AT, Stanford University, Teaching, IEEE Journal of Solid-State Circuits, Electronics, International Journal of High Speed Electronics and Systems, Princeton University, Associate, Doctor of Philosophy, IEEE, Symposium, BSEE, IEEE International Symposium on Information Theory, Michael B. T. Bell, Silicon, UCLA, Razavi, Circuit, Book, RF, ISSCC, Conference, Consumer electronics, Management, Engineering

For more information and images: CLICK HERE

Key Points: 
  • For more information and images: CLICK HERE
    Razavi is an accomplished researcher, lecturer and author in the area of communications circuitry and analog and RF circuits.
  • Razavi has been recognized as a top author in the 50-year and 70-year history of the IEEE International Solid-State Circuits Conference.
  • He has received eight IEEE best paper awards and four teaching awards and was the recipient of the 2012 IEEE Pederson Award in Solid-State Circuits.
  • "Dr. Razavi has deep experience and insights into the challenges of high-performance and low power communications at all levels of silicon and system architectures.

Computing Hardware Expert Georgios Konstadinidis Joins proteanTecs Advisory Board

Retrieved on: 
Wednesday, March 29, 2023
Hardware, Data Management, Technology, Artificial Intelligence, Software, Technical University of Berlin, Georgios, McPherson, Electronics, Institute of technology, Communication, CAD, IC, ML, Multimedia, IP, Oracle, VLSI, Advisory board, TPU, IEEE, Publication, HPC, TPC, Center for Advancing Electronics Dresden, Silicon, Sun Microsystems, AI, IRPS, ISSCC, Video game, Industrial design, Management, Physics

proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that Georgios Konstadinidis has joined its Advisory Board.

Key Points: 
  • proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that Georgios Konstadinidis has joined its Advisory Board.
  • A high performance computing (HPC) and AI hardware design expert, Georgios will offer his deep technical expertise to the company.
  • View the full release here: https://www.businesswire.com/news/home/20230329005182/en/
    proteanTecs welcomes high performance computing hardware expert Georgios Konstadinidis to its advisory board.
  • “proteanTecs is carving out a clear path in the industry, and I am eager to contribute to their continued success,” said proteanTecs’ newly appointed advisory board member, Georgios Konstadinidis.