Fabless manufacturing

Powering Up Panel-Level Packaging! Capcon’s Die Bonder Wins Bulk Adoption by Internationally Leading IDM Giant

Retrieved on: 
Thursday, March 21, 2024
Semiconductor, Technology, Manufacturing, Nanotechnology, Other Technology, Other Manufacturing, Hardware, IDM, Algorithm, Yole, Fabless manufacturing, RF, Leo, UPH, Foundry, Education minister, Key, Sensor, IDMS, Car, Law, Printed circuit board

Recently, Capcon’s large panel-level packaging die bonder, AvantGo L6 (Leo), has been adopted in bulk by an internationally-leading IDM manufacturer and mass producer.

Key Points: 
  • Recently, Capcon’s large panel-level packaging die bonder, AvantGo L6 (Leo), has been adopted in bulk by an internationally-leading IDM manufacturer and mass producer.
  • It is attracting the attention of industry leading Fabless, OSAT and IDM to position the technology as part of their packaging roadmap and process development.
  • For die bonder, the substrate size used in panel-level packaging is larger, so the surface prone to warping.
  • It is focusing on wafer-level packaging equipment, panel-level packaging equipment, and substrate-level packaging equipment, committed to providing customers with advanced semiconductor packaging products, technology, and solutions.

Trinamix Wins 2023 Oracle Worldwide Partner Award and 2023 North America Applications Partner Award for Business Impact

Retrieved on: 
Monday, November 20, 2023
Cloud, Oracle Applications, Fabless manufacturing, MES, Oracle Cloud, OEM, Business, SCM, OPN, Fab, Oracle

SANTA CLARA, Calif., Nov. 20, 2023 /PRNewswire/ -- Trinamix, a leading global solution provider specializing in Oracle Applications and member of Oracle PartnerNetwork (OPN), won the 2023 Oracle Worldwide Partner Award and North America Applications Partner Award for Business Impact for its FabConnect solution. The annual Oracle Partner Awards celebrate partners that have shown exceptional innovation, entrepreneurial success and dedication to customers. This accolade recognizes Trinamix's commitment to empowering semiconductor companies with tangible business outcomes through its differentiated solutions like FabConnect.

Key Points: 
  • SANTA CLARA, Calif., Nov. 20, 2023 /PRNewswire/ -- Trinamix , a leading global solution provider specializing in Oracle Applications and member of Oracle PartnerNetwork (OPN), won the 2023 Oracle Worldwide Partner Award and North America Applications Partner Award for Business Impact for its FabConnect solution.
  • The annual Oracle Partner Awards celebrate partners that have shown exceptional innovation, entrepreneurial success and dedication to customers.
  • This accolade recognizes Trinamix's commitment to empowering semiconductor companies with tangible business outcomes through its differentiated solutions like FabConnect.
  • "Trinamix is a valued Oracle partner, delivering Oracle Cloud solutions and dedication to support its customer's cloud transformation journeys," said Dan Haller, group vice president, North America Applications Alliance & Channels, Oracle.

EUV Lithography Market Set for Rapid Growth at 21.8% CAGR, Revolutionizing Semiconductor Manufacturing

Retrieved on: 
Thursday, August 3, 2023
IDM, Equipment, Intellectual property, High, Radiation, AGC Inc., Mask, Samsung Electronics, GlobalFoundries, EUVL, TSMC, Research, ICS, USD, ASML Holding, Fabless manufacturing, Plasma, Investment, Microprocessor, Artificial intelligence, IDS, EUV, Growth, Silicon, Region, KLA Corporation, Tin, Light, Integration, IDMS, Semiconductor, Printed circuit board, Software, Telecommunications

The key component in EUV lithography is the EUV light source, which involves generating and manipulating highly energetic light at 13.5 nm.

Key Points: 
  • The key component in EUV lithography is the EUV light source, which involves generating and manipulating highly energetic light at 13.5 nm.
  • Prominent foundries that offer semiconductor manufacturing services, including EUV lithography, encompass companies such as Taiwan Semiconductor Manufacturing Company Limited, GlobalFoundries, Samsung Foundry, and others.
  • The growth of foundry companies can be attributed to their significant investments in EUV lithography, with Asia Pacific countries serving as major contributors to the expansion and advancement of the EUV lithography market.
  • Rising Deployment of EUVL Technology in New Applications, Including Microprocessors, ICs, and Memory Modules/Chips
    The report provides insights on:
    Analysis of key drivers (Technological advancements and node migration are driving the market), restraints (High cost of implementing EUV Lithography system), opportunities (Adoption of EUV lithography in advanced semiconductor manufacturing), and challenges (Source power and productivity in EUV lithography act as a challenge for the market) influencing the growth of the EUV lithography market.

Global and China Automotive Power Management Integrated Circuits (PMIC) Industry Report 2023: The Process of Domestic Automotive PMICs Replacing Foreign Ones in China in the "Crisis of Chip Shortage" - ResearchAndMarkets.com

Retrieved on: 
Friday, April 28, 2023
Automotive Manufacturing, Manufacturing, Giant, International, TI, Electronics, SMIC, Tier 1, AFE, SOH, BCD, AC/DC, IC, LDO, BMIC, Game Industry Report Magazine, Automotive industry, SOC, ICS, BYD, Temperature, Cell, Lithium, Certification, Shortage, PMIC, Fabless manufacturing, Écu, Hongqi (marque), LED, Ops Turun, anti-price hike rally 2013, Hyundai, SAIC-GM, Algorithm, ADI, UMC, STMicroelectronics, TSMC, BMS, ADAS, Transport, NXP, Electric battery, Electric motor, Semiconductor, Infineon Technologies

The "Automotive Power Management Integrated Circuits (PMIC) Industry Report, 2023" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Automotive Power Management Integrated Circuits (PMIC) Industry Report, 2023" report has been added to ResearchAndMarkets.com's offering.
  • Automotive power management integrated circuits (PMIC) find broad application in vehicle intelligent cockpits, autonomous driving, body electronics, clusters and entertainment systems, lighting systems, and BMS.
  • The enormous supply gap in automotive power battery management system AFE ICs creates a strong desire to replace foreign products in China.
  • Demand for automotive AFE ICs: in the evolution from 400V to 800V platform, the demand for AFE ICs doubles.

Automotive Power Management Integrated Circuits (PMIC) Industry Report, 2023: China Set to Replace Foreign Products with Home-Grown Manufacturing

Retrieved on: 
Thursday, March 23, 2023
Giant, Communication, LDO, BMIC, Temperature, ISO 26262, Écu, SAIC-GM, ADI, TSMC, Transport, MCU, TI, Electronics, SMIC, ISO, BCD, AFE, LQFP, 3D, Game Industry Report Magazine, BYD, BEV, Certification, PMIC, Hongqi (marque), LED, UMC, ADC, AEC, Safety, International, Tier 1, PHEV, ASIL, AC/DC, SOC, AC, Cell, EREV, Hyundai, Algorithm, Engineering, ADAS, NXP, Lithium, DNS, SOH, IC, ICS, HEV, NTC, Fabless manufacturing, Series, STMicroelectronics, BMS, Electric motor, Electric battery, Video game, Automotive industry, Semiconductor, Infineon Technologies

DUBLIN, March 23, 2023 /PRNewswire/ -- The "Automotive Power Management Integrated Circuits (PMIC) Industry Report, 2023" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 23, 2023 /PRNewswire/ -- The "Automotive Power Management Integrated Circuits (PMIC) Industry Report, 2023" report has been added to ResearchAndMarkets.com's offering.
  • Automotive power management integrated circuits (PMIC) find broad application in vehicle intelligent cockpits, autonomous driving, body electronics, clusters and entertainment systems, lighting systems, and BMS.
  • The enormous supply gap in automotive power battery management system AFE ICs creates a strong desire to replace foreign products in China.
  • High technical barriers, high automotive certification requirements, big challenges, and long cycle are constraints on the mass production of automotive AFE ICs in China.

Keysight Introduces New Method to Accelerate Power Amplifier Digital Pre-Distortion Test Speeds

Retrieved on: 
Thursday, March 9, 2023
Data Management, Consumer Electronics, Technology, Semiconductor, Telecommunications, Software, Networks, Internet, 5G, Hardware, Electronic Design Automation, Gallium arsenide, DPD, Digital, Iterative learning control, Communication, NYSE, Fabless manufacturing, PAPR, PXA, Multidimensional Digital Pre-distortion, High frequency, Performance, PAE, ILC, Wireless, SLM Solutions Group AG, R, Transformer, Medical imaging

Keysight Technologies, Inc. (NYSE: KEYS) introduces the new Iterative Learning Control (ILC) test method that significantly shortens Digital Pre-Distortion (DPD) test times for power amplifiers.

Key Points: 
  • Keysight Technologies, Inc. (NYSE: KEYS) introduces the new Iterative Learning Control (ILC) test method that significantly shortens Digital Pre-Distortion (DPD) test times for power amplifiers.
  • By shortening the time it takes to complete the design and validation process, power amplifier manufacturers are able to accelerate their time-to-market.
  • Keysight meets this need by introducing the innovative ILC DPD test method that shortens DPD test time to minutes and accelerates R&D time from test validation to product design and optimization.
  • The ILC DPD test method offers the following benefits:
    Faster Test Speeds – Optimizes the N9055EM0E software to reduce the characterization of power amplifiers to minutes.

VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium

Retrieved on: 
Sunday, April 3, 2022
Technology, Hardware, Semiconductor, Cloud, Dai, IDM, Adoption, Human, Video processing, IPS, SOC, 2015 UCI Track Cycling World Championships, AMD, Recursive neural network, Module (mathematics), Internet, Image, Intel, ASE, Qualcomm, GPU, Research, ISP, CEO, RF, Graphics, TSMC, Industry, Technology, Google Cloud, NPU, Silicon, Ecosystem, Fabless manufacturing, Architecture, Time, IOT, VPU, Samsung, Solution, Digital signal processor, Electronics, Artificial neural network, Efficiency, DSP, Digital signal, Meta, Microsoft, Mobile phone, Service, IP

VeriSilicon (688521.SH), a leading Silicon Platform as a Service (SiPaaS) company, today announced it has officially joined the Universal Chiplet Interconnect Express (UCIe) industry consortium.

Key Points: 
  • VeriSilicon (688521.SH), a leading Silicon Platform as a Service (SiPaaS) company, today announced it has officially joined the Universal Chiplet Interconnect Express (UCIe) industry consortium.
  • UCIe is an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.
  • Under the concepts of IP as a Chiplet and Chiplet as a Platform, VeriSilicon has launched a high-end application processor platform based on chiplet architecture.
  • VeriSilicon will be likely to be one of the worlds first companies to bring commercialized chiplet products to market.

UST and KITVEN Fund Invests in Calligo Technologies to Enable Development of POSIT-powered RISC-V Solution for HPC & AI Markets in 2022

Retrieved on: 
Tuesday, March 22, 2022
PNS, Central, Capital, Life, EDA, Organization, SOC, Department of Electronics and Accreditation of Computer Classes, Big data, Bluespec, BT, Government, AI, Entropy, Software, Technology, Fabless manufacturing, ASIC, IOT, Posit, IEEE, UST, COE, PNU, Octopus, Solution, VCF, VP, Department, KITS, HPC, Video game console, Electronics, Firmware, Silicon

Commenting on the innovative product development, Gilroy Mathew, VP & Global Head of Semiconductor Engineering, UST, said, "UST is always at the forefront of innovation.

Key Points: 
  • Commenting on the innovative product development, Gilroy Mathew, VP & Global Head of Semiconductor Engineering, UST, said, "UST is always at the forefront of innovation.
  • Our joint effort to develop CRISP-based SoC will transform us to build more innovative AI & HPC Silicon Chipsets for our worldwide customers".
  • UST and Calligo believe that Posit is a game-changing, disruptive invention at a grass-root level that can create new standards for computing.
  • KITVEN is investing in various start-up companies in different sectors through its semi-conductor venture fund, Bio-tech venture fund and AVGC Venture Fund.

Global Interface IP Market Trajectory & Analytics Report 2022: Market to Reach $1.5 Billion by 2027 - Growing Demand for Modern SoC Chips - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 8, 2022
Technology, Networks, Hardware, Interface, IDMS, World Marketing Summit, View, Consumer electronics, Automotive industry, Adoption, Fabless manufacturing, Electronics, Emergence, CAGR, Current, Mobile phone, Video game, Semiconductor, Growth

Growing Demand for Modern SoC Chips: A Major Driver of Growth in the Interface IP Market

Key Points: 
  • Growing Demand for Modern SoC Chips: A Major Driver of Growth in the Interface IP Market
    Growing Market for Consumer Electronics Presents Opportunity for Interface IP Market: Consumer Electronics Sales in US$ Billion for the Years 2018, 2020, 2022 and 2024
    Global IoT Market: Installed Base of IoT Connected Devices in Billions for the Years 2017, 2019, 2021, 2023 and 2025
    With Rise in Adoption of In-Vehicle Networks and Emergence of Autonomous Driving Systems, High Growth Potential Exists for Interface IP Market
    IoT in Automotive Industry: Global Automotive IoT Connected Devices in Million for the Years 2017, 2020 and 2025
    World Recent Past, Current & Future Analysis for Interface IP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    World Historic Review for Interface IP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2012 through 2019 and % CAGR
    World 15-Year Perspective for Interface IP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2021 & 2027
    World 15-Year Perspective for Fabless Semiconductor Companies by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    World 15-Year Perspective for IDMs by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    World 15-Year Perspective for Foundries by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    View source version on businesswire.com: https://www.businesswire.com/news/home/20220308005738/en/

GigaDevice Selects PDF Solutions Exensio Analytics Platform to Support Rapid Semiconductor Growth

Retrieved on: 
Monday, February 14, 2022
NASDAQ, Fabless manufacturing, Memory, Time, IC, OPC Foundation, IPC, Company, Electronics, PDF, GigaDevice, Semiconductor, Solution, Efficiency, Goal, Environment, Flash memory, MCU 8051 IDE, Data analysis, PDF Solutions, SEMI, Fortune 500, TPCA, Machine learning, Data management, Growth, SPI, Industry, News, GLOBE, Organization, Computer data storage, Silicon

To meet the big data challenges brought about by the companys rapid growth, GigaDevice selected the PDF Solutions Exensio analytics platform.

Key Points: 
  • To meet the big data challenges brought about by the companys rapid growth, GigaDevice selected the PDF Solutions Exensio analytics platform.
  • "The Exensio analytics platform is a well-known solution in the semiconductor industry and PDF Solutions has an excellent local support team to meet the data analysis needs of GigaDevice," said Feng Jun, Director of the Product Integration Department of GigaDevice.
  • The PDF Solutions Exensio analytics platform is an enterprise-level, end-to-end analytics environment that architected to empower engineers and data scientists across the semiconductor ecosystem to rapidly improve the yield, quality, and profitability of their devices.
  • PDF Solutions, the PDF Solutions logo, and Exensio are trademarks or registered trademarks of PDF Solutions, Inc. or its subsidiaries.