Associated tags: ASIC, MIPI, SATA, SerDes, PCI Express, USB, IP, ISO, Silicon, Internet, Michael Faraday, TWSE, Software, Networks, SOC, Hardware, In Loving Memory (compilation album), Semiconductor, Data Management, Other Technology
Locations: TAIWAN, ASIA PACIFIC, BIST, JAPAN, CHINA, EUROPE, SOUTH KOREA, AE
Technology,
Mobile,
Wireless,
Automotive,
General Automotive,
Software,
Internet,
Hardware,
Autonomous Driving,
Vehicles,
Artificial Intelligence,
Cortex,
Ecosystem,
Safety,
SOC,
Fin field-effect transistor,
IPS,
Application-specific integrated circuit,
ASIC,
Arm,
Socs,
Cryptocurrency Since 2002, Faraday has been a global Arm licensee and has now become a key design partner of the Arm automotive ecosystem in addition to being a key partner in the Arm Total Design ecosystem.
Key Points:
- Since 2002, Faraday has been a global Arm licensee and has now become a key design partner of the Arm automotive ecosystem in addition to being a key partner in the Arm Total Design ecosystem.
- With flexible business models, Faraday is committed to providing tailor-made, high-standard, and high-quality ASIC chips to meet diverse customer needs.
- “We are excited to be part of the Arm automotive ecosystem,” said Flash Lin, COO of Faraday.
- “By joining the Arm automotive ecosystem, Faraday continues to drive innovation by leveraging the first high performance Armv9 A-class CPU for automotive, the Cortex-A720AE, to address the demands of software-defined vehicles.”
IOT (Internet of Things),
Apps,
Applications,
Technology,
Software,
Networks,
Artificial Intelligence,
Hardware,
Socs,
ICS,
SOC,
ASIC,
Internet of things,
MCU,
SONOS,
UMC,
IP,
Faraday Technology,
Multimedia,
Human,
Video game Faraday’s SONOS eFlash subsystem, a logic-process-compatible solution, facilitates setting the built-in eFlash function in SoCs at 40nm, streamlining collaborative IP implementation, reducing IP porting complexity, and requiring fewer mask layers for shorter lead-time and increased cost-effectiveness.
Key Points:
- Faraday’s SONOS eFlash subsystem, a logic-process-compatible solution, facilitates setting the built-in eFlash function in SoCs at 40nm, streamlining collaborative IP implementation, reducing IP porting complexity, and requiring fewer mask layers for shorter lead-time and increased cost-effectiveness.
- The easy-to-use solution provides read/write code protection for MCU usage; the BIST (built-in self-test) ensures production quality and testing efficiency.
- Its SONOS solution required less R&D effort, achieved good chip quality, and a satisfactory yield rate.
- We are delighted to have chosen Faraday as a trusted partner and anticipate creating more success in the future,” said Chris Ko, CEO of Sonix.
Semiconductor,
5G,
Data Management,
Technology,
Artificial Intelligence,
ARM Neoverse,
Socs,
Computation,
Application-specific integrated circuit,
Intel,
Michael Faraday,
Ecosystem,
SOC,
HPC,
IP,
Silicon,
Architecture,
DIS,
CSS,
Arm Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces its collaboration with Arm and Intel in spearheading the development of a 64-core System-on-Chip (SoC) utilizing Intel 18A technology.
Key Points:
- Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces its collaboration with Arm and Intel in spearheading the development of a 64-core System-on-Chip (SoC) utilizing Intel 18A technology.
- The platform will further incorporate interface IPs from the Arm Total Design ecosystem, ensuring a comprehensive implementation and verification process for 18A technology.
- “We are excited to announce the development of our new Arm Neoverse-based SoC platform, leveraging Intel 18A technology.
- “We are pleased to work with Faraday in the development of the SoC based on Arm Neoverse CSS utilizing our most competitive Intel 18A process technology,” said Stuart Pann, Intel senior vice president and general manager of Intel Foundry Services (IFS).
Retrieved on:
Thursday, January 4, 2024
Networks,
Internet,
Hardware,
Technology,
Software,
Ecosystem,
CSS,
Partnership,
Arm,
GM,
Total,
AI,
HPC,
DIS,
IP,
Silicon,
Stuart Pugh Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces its participation as a design service partner in Arm® Total Design, underscoring the importance of Faraday's design proficiency and commitment to resources for Arm-based solutions.
Key Points:
- Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces its participation as a design service partner in Arm® Total Design, underscoring the importance of Faraday's design proficiency and commitment to resources for Arm-based solutions.
- By leveraging Arm Neoverse™ Compute Subsystems (CSS), Faraday is poised to deliver cutting-edge cloud, high-performance computing (HPC), and AI chips with unparalleled performance and innovation.
- As part of Arm Total Design, Faraday is the first design service partner in Taiwan and will provide comprehensive ASIC services, including subsystem integration and hardening of Neoverse CSS.
- “We’re pleased to have Faraday contributing their expertise in SoC design, and we’re looking forward to what this partnership brings to next-generation custom silicon design.”
“We are delighted to be a design partner of Arm Total Design,” said Flash Lin, COO of Faraday.
Retrieved on:
Thursday, November 16, 2023
Networks,
Internet,
Hardware,
Technology,
Carriers and Services,
SNR,
IEEE,
IEEE 802.3,
Signal-to-noise ratio,
IP,
100BASE-TX,
100BASE-FX,
SOC,
Automation,
DSP,
TWSE,
Bit,
ANSI,
UMC,
Gigabit Ethernet,
Ethernet,
PPA,
Michael Faraday,
ASIC Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces the availability of its 4-port Gigabit Ethernet PHY on UMC's 28HPC+ process.
Key Points:
- Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces the availability of its 4-port Gigabit Ethernet PHY on UMC's 28HPC+ process.
- One key feature of this 28nm 4-port Gigabit Ethernet PHY is its impressive 33% reduction in power consumption per port compared to the previous design.
- “Faraday has facilitated the mass production success of our customers' ASIC projects across a spectrum of networking applications,” said Flash Lin, COO of Faraday.
- “By harnessing this GPHY solution, we can help customers to develop next-generation Ethernet-enabled devices and systems with enhanced performance and power efficiency benefits.”
For more information on Faraday's Ethernet PHY solutions, please visit www.faraday-tech.com .
Retrieved on:
Tuesday, September 12, 2023
Semiconductor,
Technology,
Other Technology,
Nanotechnology,
Internet,
Hardware,
TSV,
OSAT,
Partnership,
Probability,
IP,
SOC,
TWSE,
UMC,
ASIC,
Retail,
Michael Faraday Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service .
Key Points:
- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service .
- Faraday goes beyond technology by offering flexible business models tailored to each customer's unique 2.5D/3D package project needs.
- Positioned neutrally and strategically, Faraday enhances flexibility and efficiency in advanced package service for multi-source chiplets, packaging, and manufacturing.
- This comprehensive analysis not only comes up with an optimal package structure for each project in the early stage but also increases the success probability of the advanced package.
Retrieved on:
Thursday, August 17, 2023
Technology,
Mobile,
Wireless,
Semiconductor,
5G,
Software,
Networks,
Internet,
Hardware,
Data Management,
MCU,
BIST,
Research,
Internet of things,
Artificial intelligence of things,
High-temperature operating life,
SOC,
TWSE,
SONOS,
Mask,
UMC,
Silicon,
ASIC,
Video game,
Michael Faraday,
IP,
Infineon Technologies Exclusively offering the SONOS eFlash solution on UMC’s 40ULP, Faraday aims at AIoT, MCU, and smart grid projects that necessitate superior performance and low-power consumption.
Key Points:
- Exclusively offering the SONOS eFlash solution on UMC’s 40ULP, Faraday aims at AIoT, MCU, and smart grid projects that necessitate superior performance and low-power consumption.
- Through the extensive testing on real silicon under rigorous conditions, Infineon’s SONOS eFlash has been confirmed that it is a qualified eNVM solution on UMC’s 40ULP.
- In a strategic collaboration with UMC and Infineon, Faraday has rolled out the 40ULP SONOS eFlash ASIC turnkey service, which supports the SONOS subsystem IP, wafer manufacturing, chip packaging and testing; the SONOS subsystem IP includes eFlash controller, eFlash macro IP, complete BIST on eFlash, and additional cache functions for easy data access and control.
- “The SONOS eFlash is fully compatible with UMC’s 40ULP logic process,” said Flash Lin, COO of Faraday.
Technology,
Mobile,
Wireless,
Semiconductor,
5G,
Software,
Networks,
Internet,
Hardware,
Data Management,
Application-specific integrated circuit,
DDR,
PHY,
Faraday Technology,
IO,
ATE,
Michael Faraday,
Fiber,
IP,
TWSE,
SSD,
IPA,
Guideline,
Socs,
PCB,
UMC,
PCI-SIG,
ASIC,
Cable television,
SerDes Already, Faraday has successfully integrated the SerDes total solution into mass–produced ASICs for Fiber-to-the-Home (FttH), home gateways, Ethernet switches, SSD, industrial automation, and 5G baseband, and other applications.
Key Points:
- Already, Faraday has successfully integrated the SerDes total solution into mass–produced ASICs for Fiber-to-the-Home (FttH), home gateways, Ethernet switches, SSD, industrial automation, and 5G baseband, and other applications.
- Combining silicon-proved SerDes IP with Faraday’s IPA service speeds customer into mass production.
- Using in-house IC Automatic Test Equipment (ATE) and compliance measuring instruments, the IPA service can accelerate the testing flow at different temperatures in the lab for bug-solving before mass production.
- “Faraday’s newly launched SerDes total solution is designed to accelerate customer’s integration.
Retrieved on:
Tuesday, January 31, 2023
Technology,
Mobile,
Wireless,
Semiconductor,
5G,
Software,
Networks,
Internet,
Hardware,
Data Management,
OSAT,
IP,
Accident,
ASIC,
BCP,
Epidemic,
Michael Faraday,
TWSE,
Partnership Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced to offer multi-site manufacturing support across all regions for ASIC customers.
Key Points:
- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced to offer multi-site manufacturing support across all regions for ASIC customers.
- With its long-term close collaboration with global foundry and OSAT vendors, Faraday is able to provide customers the multi-site support to mitigate manufacturing risks due to economy, accidents, epidemics, or geopolitics.
- To implement corporate sustainability, Faraday has devoted its resources and efforts to developing a robust business continuity plan (BCP).
- “We are pleased to offer the preference manufacturing solution to our customers,” said Flash Lin, chief operating officer of Faraday.
Retrieved on:
Tuesday, December 13, 2022
Data Management,
Technology,
Mobile,
Wireless,
Software,
Networks,
Internet,
ASIC,
SerDes,
BIST,
UMC,
IP,
TWSE,
Infineon Technologies,
ISO,
MIPI,
USB,
AI,
MCU,
Silicon,
In Loving Memory (compilation album),
CPU,
SONOS,
IOT,
PCI Express,
Computer data storage,
3D printing,
Michael Faraday Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced it has collaborated with Infineon to develop a SONOS eFlash platform on UMCs 40uLP process.
Key Points:
- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced it has collaborated with Infineon to develop a SONOS eFlash platform on UMCs 40uLP process.
- To meet the demand for 40nm low-power and secure eFlash driven by AI, smart grid, IoT, and MCU applications, Faraday and Infineon jointly developed this SONOS eFlash platform.
- We are excited to work with Faraday to develop this SONOS eFlash platform for customers, said Vineet Agrawal, Sr. Director of Infineon Technologies LLC Memory Solutions.
- By leveraging the advantages of Infineons SONOS eFlash on UMC 40uLP, manufacturing cycle time can benefit from far fewer additional mask layers when compared to other eFlash solutions.
