LTCC

IDTechEx Discusses AiP Market Dynamics: Drivers and Challenges in 5G and 6G

Retrieved on: 
Wednesday, April 3, 2024
Element, RFID, Physics, LTCC, Benchmarking, Growth, Communication, Electronics, Research, RF, Terahertz, Glass, Telco, High-pass filter, PCB, Wireless, Atmosphere, Hertz, Ecosystem, TBPS, Radiation pattern, AIP

BOSTON, April 3, 2024 /PRNewswire/ -- Antenna-in-package (AiP) technology is essential for high-frequency telecommunications, as it enables the integration of antennas with RF components directly into semiconductor packages, unlike traditional discrete antennas. This advancement, tailored for mmWave applications and potentially extending into the sub-THz spectrum for 6G, promises much smaller footprints and enhanced performance.

Key Points: 
  • More discussion regarding AiP technology can be found in IDTechEx's report, " Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets ".
  • Overview of AiP for 5G and 6G market and challenges:
    The AiP market is directly linked with the 5G mmWave and future 6G markets, as AiP is expected to be utilized in all 5G mmWave-based stations and 5G-enabled electronics like smartphones.
  • IDTechEx's market report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", delves into AiP technologies for 5G mmWave and 6G, focusing on various substrate types and packaging methods.
  • 10-year granular market forecast of:
    To find out more about the IDTechEx report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", please visit www.IDTechEx.com/AiP .

IDTechEx Discusses AiP Market Dynamics: Drivers and Challenges in 5G and 6G

Retrieved on: 
Wednesday, April 3, 2024
Element, RFID, Physics, LTCC, Benchmarking, Growth, Communication, Electronics, Research, RF, Terahertz, Glass, Telco, High-pass filter, PCB, Wireless, Atmosphere, Hertz, Ecosystem, TBPS, Radiation pattern, AIP

BOSTON, April 3, 2024 /PRNewswire/ -- Antenna-in-package (AiP) technology is essential for high-frequency telecommunications, as it enables the integration of antennas with RF components directly into semiconductor packages, unlike traditional discrete antennas. This advancement, tailored for mmWave applications and potentially extending into the sub-THz spectrum for 6G, promises much smaller footprints and enhanced performance.

Key Points: 
  • More discussion regarding AiP technology can be found in IDTechEx's report, " Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets ".
  • Overview of AiP for 5G and 6G market and challenges:
    The AiP market is directly linked with the 5G mmWave and future 6G markets, as AiP is expected to be utilized in all 5G mmWave-based stations and 5G-enabled electronics like smartphones.
  • IDTechEx's market report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", delves into AiP technologies for 5G mmWave and 6G, focusing on various substrate types and packaging methods.
  • 10-year granular market forecast of:
    To find out more about the IDTechEx report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", please visit www.IDTechEx.com/AiP .

Global Ceramic Substrates Market Research Report 2023-2028: Increasing Need for Advanced Architecture and Miniaturization of Electronic Devices to Drive Market - ResearchAndMarkets.com

Retrieved on: 
Wednesday, February 21, 2024
Technology, Chemicals, Plastics, Manufacturing, Consumer Electronics, Engineering, Region, LTCC, USD, Ceramic, NIKKO, Miniaturization, Growth, Electronics, Consumer electronics, Kyocera, Nanotechnology, LTD, Communication, KOA Corporation, Hardness, Kool-Aid, CeramTec, Lighting, Corrosion, Tablet, Research report, Face, Printed circuit board

The ceramic substrate market is poised for growth due to the rising demand for advanced architectural solutions and the drive for miniaturization in electronic devices, coupled with a preference for ceramic substrates over traditional metal alternatives.

Key Points: 
  • The ceramic substrate market is poised for growth due to the rising demand for advanced architectural solutions and the drive for miniaturization in electronic devices, coupled with a preference for ceramic substrates over traditional metal alternatives.
  • On a positive note, opportunities abound in the form of increasing demand for nanotechnology and high-performance computing systems.
  • Market participants are actively focusing on boosting the production of oxide ceramics in Europe, driving growth in the ceramic substrates market.
  • This underscores the critical role of ceramic substrates in enabling compact, high-performance designs in the consumer electronics landscape.

Road to 6G: IDTechEx Investigates Emerging Low-Loss Materials

Retrieved on: 
Monday, March 4, 2024
SoftBank Group, LTCC, Transmission loss, FCC, PTFE, Artificial intelligence, Terahertz, Polytetrafluoroethylene, Samsung Electronics, Growth, Federal Communications Commission, Hertz, Glass, PPE, High-pass filter, Tree, Ericsson, Huawei, Telecommunications, Microsoft, Research, Northeastern University, Printed circuit board

This includes R&D for low-loss materials, which IDTechEx extensively explores in its report, " Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts ".

Key Points: 
  • This includes R&D for low-loss materials, which IDTechEx extensively explores in its report, " Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts ".
  • As such, some researchers are approaching the challenge of 6G low-loss materials from the starting point of current commercially used low-loss materials.
  • Organic materials such as polyimide (PI) and poly p-(phenyl ether) (PPE) are being developed into build-up materials for substrates.
  • The IDTechEx report, "Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts", explores the technology developments and market trends driving the growth of the low-loss materials market for next-generation telecommunications.

Road to 6G: IDTechEx Investigates Emerging Low-Loss Materials

Retrieved on: 
Monday, March 4, 2024
SoftBank Group, LTCC, Transmission loss, FCC, PTFE, Artificial intelligence, Terahertz, Polytetrafluoroethylene, Samsung Electronics, Growth, Federal Communications Commission, Hertz, Glass, PPE, High-pass filter, Tree, Ericsson, Huawei, Telecommunications, Microsoft, Research, Northeastern University, Printed circuit board

This includes R&D for low-loss materials, which IDTechEx extensively explores in its report, " Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts ".

Key Points: 
  • This includes R&D for low-loss materials, which IDTechEx extensively explores in its report, " Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts ".
  • As such, some researchers are approaching the challenge of 6G low-loss materials from the starting point of current commercially used low-loss materials.
  • Organic materials such as polyimide (PI) and poly p-(phenyl ether) (PPE) are being developed into build-up materials for substrates.
  • The IDTechEx report, "Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts", explores the technology developments and market trends driving the growth of the low-loss materials market for next-generation telecommunications.

IDTechEx Discusses Advancing Integration in Antenna Packaging Technologies for 5G and 6G

Retrieved on: 
Tuesday, February 27, 2024
AIP, LTCC, Radar, Terahertz, Miniaturization, EMC, Radiation pattern, EIRP, Application, Communication, Glass, High-pass filter, RF, Benchmarking, PCB, Deep diving, Research, Printed circuit board

Advancing into the sub-THz range, potentially within the spectrum of 6G, research is underway on new antenna packaging technologies aimed at integrating antennas directly onto RF components.

Key Points: 
  • Advancing into the sub-THz range, potentially within the spectrum of 6G, research is underway on new antenna packaging technologies aimed at integrating antennas directly onto RF components.
  • Deep Dive into Beamforming Technologies Enabled by Phased Array Antenna for 5G mmWave:
    Compare beamforming technologies of 5G sub-6 vs mmWave.
  • Antenna Integration Technologies for 5G mmWave:
    Discuss antenna substrate technology, benchmarking, material requirements, and packaging for phased arrays.
  • Explore various antenna packaging technologies for 5G mmWave, including antenna on PCB and antenna in package (AiP), categorized by packaging technologies: Flip-chip vs fan-out.

IDTechEx Discusses Advancing Integration in Antenna Packaging Technologies for 5G and 6G

Retrieved on: 
Tuesday, February 27, 2024
AIP, LTCC, Radar, Terahertz, Miniaturization, EMC, Radiation pattern, EIRP, Application, Communication, Glass, High-pass filter, RF, Benchmarking, PCB, Deep diving, Research, Printed circuit board

Advancing into the sub-THz range, potentially within the spectrum of 6G, research is underway on new antenna packaging technologies aimed at integrating antennas directly onto RF components.

Key Points: 
  • Advancing into the sub-THz range, potentially within the spectrum of 6G, research is underway on new antenna packaging technologies aimed at integrating antennas directly onto RF components.
  • Deep Dive into Beamforming Technologies Enabled by Phased Array Antenna for 5G mmWave:
    Compare beamforming technologies of 5G sub-6 vs mmWave.
  • Antenna Integration Technologies for 5G mmWave:
    Discuss antenna substrate technology, benchmarking, material requirements, and packaging for phased arrays.
  • Explore various antenna packaging technologies for 5G mmWave, including antenna on PCB and antenna in package (AiP), categorized by packaging technologies: Flip-chip vs fan-out.

Buoyed by mmWave 5G, Low-Loss Materials for 5G Market to Surpass US$2.1 Billion by 2034, According to IDTechEx

Retrieved on: 
Monday, February 5, 2024
Glass, Growth, Telecommunications, Research, LCB, PTFE, USD, FR-4, High-pass filter, LTCC, Transmission loss, PPE, PI, Hertz, Printed circuit board

BOSTON, Feb. 5, 2024 /PRNewswire/ -- Smart devices, autonomous driving, remote patient monitoring – countless new applications are being unlocked by advancements in telecommunication technology, specifically the transition to 5G. 5G telecommunications introduces two new frequency bands: sub-6 GHz (3.5 – 7 GHz) and mmWave (24 – 71 GHz). It is mmWave 5G that allows for extremely low latency and substantial bandwidth, thus allowing for higher data throughput, both of which are necessary to enable the new applications previously mentioned. As such, a network of 5G-enabled devices and infrastructure is growing worldwide, especially in important markets like China, leads the global 5G mid-band deployment with over 68% of the market share, according to IDTechEx.

Key Points: 
  • This demand for low transmission loss, or low-loss, materials for 5G applications is buoying the market to surpass USD$2.1 billion by 2034, as predicted by IDTechEx's new report, " Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts ".
  • As sub-6 GHz 5G is the most deployed 5G frequency band to date, low-loss materials used in sub-6 GHz applications comprise about two-thirds of the 5G market by revenue in 2024, as estimated by IDTechEx.
  • However, the performance leap from sub-6 GHz to mmWave 5G demands dielectric materials with even lower dielectric loss than incumbent materials.
  • IDTechEx's latest report, "Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts", explores the technology developments and market trends driving the growth of the low-loss materials market for next-generation telecommunications.

Buoyed by mmWave 5G, Low-Loss Materials for 5G Market to Surpass US$2.1 Billion by 2034, According to IDTechEx

Retrieved on: 
Monday, February 5, 2024
Glass, Growth, Telecommunications, Research, LCB, PTFE, USD, FR-4, High-pass filter, LTCC, Transmission loss, PPE, PI, Hertz, Printed circuit board

BOSTON, Feb. 5, 2024 /PRNewswire/ -- Smart devices, autonomous driving, remote patient monitoring – countless new applications are being unlocked by advancements in telecommunication technology, specifically the transition to 5G. 5G telecommunications introduces two new frequency bands: sub-6 GHz (3.5 – 7 GHz) and mmWave (24 – 71 GHz). It is mmWave 5G that allows for extremely low latency and substantial bandwidth, thus allowing for higher data throughput, both of which are necessary to enable the new applications previously mentioned. As such, a network of 5G-enabled devices and infrastructure is growing worldwide, especially in important markets like China, leads the global 5G mid-band deployment with over 68% of the market share, according to IDTechEx.

Key Points: 
  • This demand for low transmission loss, or low-loss, materials for 5G applications is buoying the market to surpass USD$2.1 billion by 2034, as predicted by IDTechEx's new report, " Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts ".
  • As sub-6 GHz 5G is the most deployed 5G frequency band to date, low-loss materials used in sub-6 GHz applications comprise about two-thirds of the 5G market by revenue in 2024, as estimated by IDTechEx.
  • However, the performance leap from sub-6 GHz to mmWave 5G demands dielectric materials with even lower dielectric loss than incumbent materials.
  • IDTechEx's latest report, "Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts", explores the technology developments and market trends driving the growth of the low-loss materials market for next-generation telecommunications.

NanoPhoria Bioscience Publishes Groundbreaking Study in Major Cardiology Journal

Retrieved on: 
Tuesday, January 2, 2024
Research, Medical Devices, Surgery, Clinical Trials, Cardiology, Other Health, Biotechnology, General Health, Health, Science, Blood pressure, Heart rate, FESC, JACC, Injection, Disease, FACC, Massachusetts General Hospital, MD, Doctor of Philosophy, Heart failure, Inhalation, Animal, Cerebral edema, LTCC, American College, Patient, Facial muscles, Harvard Medical School, Journal, Medical device

NanoPhoria srl, a pre-clinical stage biotech company, is pleased to announce today the publication of a groundbreaking study in the field of cardiology, conducted using a clinically relevant pig model of heart failure.

Key Points: 
  • NanoPhoria srl, a pre-clinical stage biotech company, is pleased to announce today the publication of a groundbreaking study in the field of cardiology, conducted using a clinically relevant pig model of heart failure.
  • This significant piece of preclinical research, titled “Lung-to-Heart Nano-in-Micro Peptide Promotes Cardiac Recovery in a Pig Model of Chronic Heart Failure,” was published by our co-founders in the Journal of the American College of Cardiology (JACC), a prominent peer-reviewed medical journal.
  • Results confirming the therapeutic effect recapitulated ex vivo in cardiac myofibrils and biopsies from treated heart failure animals.
  • “Additionally, our research showcases a major advancement in the field of heart disease treatment.