Transmission loss

Road to 6G: IDTechEx Investigates Emerging Low-Loss Materials

Retrieved on: 
Monday, March 4, 2024
SoftBank Group, LTCC, Transmission loss, FCC, PTFE, Artificial intelligence, Terahertz, Polytetrafluoroethylene, Samsung Electronics, Growth, Federal Communications Commission, Hertz, Glass, PPE, High-pass filter, Tree, Ericsson, Huawei, Telecommunications, Microsoft, Research, Northeastern University, Printed circuit board

This includes R&D for low-loss materials, which IDTechEx extensively explores in its report, " Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts ".

Key Points: 
  • This includes R&D for low-loss materials, which IDTechEx extensively explores in its report, " Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts ".
  • As such, some researchers are approaching the challenge of 6G low-loss materials from the starting point of current commercially used low-loss materials.
  • Organic materials such as polyimide (PI) and poly p-(phenyl ether) (PPE) are being developed into build-up materials for substrates.
  • The IDTechEx report, "Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts", explores the technology developments and market trends driving the growth of the low-loss materials market for next-generation telecommunications.

Road to 6G: IDTechEx Investigates Emerging Low-Loss Materials

Retrieved on: 
Monday, March 4, 2024
SoftBank Group, LTCC, Transmission loss, FCC, PTFE, Artificial intelligence, Terahertz, Polytetrafluoroethylene, Samsung Electronics, Growth, Federal Communications Commission, Hertz, Glass, PPE, High-pass filter, Tree, Ericsson, Huawei, Telecommunications, Microsoft, Research, Northeastern University, Printed circuit board

This includes R&D for low-loss materials, which IDTechEx extensively explores in its report, " Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts ".

Key Points: 
  • This includes R&D for low-loss materials, which IDTechEx extensively explores in its report, " Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts ".
  • As such, some researchers are approaching the challenge of 6G low-loss materials from the starting point of current commercially used low-loss materials.
  • Organic materials such as polyimide (PI) and poly p-(phenyl ether) (PPE) are being developed into build-up materials for substrates.
  • The IDTechEx report, "Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts", explores the technology developments and market trends driving the growth of the low-loss materials market for next-generation telecommunications.

DuPont Showcases Innovative Advanced Circuit Materials at Intelligent Asia 2024

Retrieved on: 
Thursday, February 29, 2024
HPC, DC-DC, BITEC, EH, Copper, Transmission loss, Polychlorinated biphenyl, Chemistry, AI, Partnership, Miniaturization, Electronics, IC, Convention center, HDI, Insertion loss, EMI, Knowledge, AP, PCB, Artificial intelligence, Internet, Light-emitting diode, Printed circuit board

BANGKOK, Feb. 28, 2024 /PRNewswire/ -- DuPont will present an extensive range of advanced circuit materials and solutions at Intelligent Asia Thailand 2024.

Key Points: 
  • BANGKOK, Feb. 28, 2024 /PRNewswire/ -- DuPont will present an extensive range of advanced circuit materials and solutions at Intelligent Asia Thailand 2024.
  • DuPont is a one-stop powerhouse for AI-enabling solutions, offering a wide range of material, chemistry and process solutions for advanced circuit and packaging applications.
  • "I am thrilled about DuPont's integrated capabilities to enhance our leadership position in advanced packaging and printed circuit board (PCB) industry," said Yuanyuan Zhou, global business director, DuPont.
  • Through offering advanced materials and chemistry for flex, rigid-flex, and rigid PCBs, DuPont total solutions for the PCB market enhance efficiency and elevate performance levels.

IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC

Retrieved on: 
Friday, February 23, 2024
HPC, Natural language processing, Transmission loss, SRAM, Silicon, NVLink, Forecasting, HBM, 3D, Language, CPU, Growth, HyperTransport, LLM, GPT, Memory, Translation, GPU, TSMC, AMD, DRAM, Graphics processing unit, NLP, Logic, Instinct, OpenAI, Central processing unit, NVIDIA, Computer data storage

The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.

Key Points: 
  • The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.
  • It covers technology trends, industry challenges, and the advancements made by key players while forecasting market trends in the semiconductor packaging sector.
  • IDTechEx's new report, " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications ", delves into the dynamic landscape of 2.5D and 3D packaging, analyzing technology trends, industry barriers, key player's technology roadmap, and market forecasts.
  • Gain invaluable insights into not just AI and HPC applications but also 5G/6G, autonomous vehicles, and consumer electronics sectors, understanding how advanced packaging shapes their trajectory.

IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC

Retrieved on: 
Friday, February 23, 2024
HPC, Natural language processing, Transmission loss, SRAM, Silicon, NVLink, Forecasting, HBM, 3D, Language, CPU, Growth, HyperTransport, LLM, GPT, Memory, Translation, GPU, TSMC, AMD, DRAM, Graphics processing unit, NLP, Logic, Instinct, OpenAI, Central processing unit, NVIDIA, Computer data storage

The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.

Key Points: 
  • The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.
  • It covers technology trends, industry challenges, and the advancements made by key players while forecasting market trends in the semiconductor packaging sector.
  • IDTechEx's new report, " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications ", delves into the dynamic landscape of 2.5D and 3D packaging, analyzing technology trends, industry barriers, key player's technology roadmap, and market forecasts.
  • Gain invaluable insights into not just AI and HPC applications but also 5G/6G, autonomous vehicles, and consumer electronics sectors, understanding how advanced packaging shapes their trajectory.

Buoyed by mmWave 5G, Low-Loss Materials for 5G Market to Surpass US$2.1 Billion by 2034, According to IDTechEx

Retrieved on: 
Monday, February 5, 2024
Glass, Growth, Telecommunications, Research, LCB, PTFE, USD, FR-4, High-pass filter, LTCC, Transmission loss, PPE, PI, Hertz, Printed circuit board

BOSTON, Feb. 5, 2024 /PRNewswire/ -- Smart devices, autonomous driving, remote patient monitoring – countless new applications are being unlocked by advancements in telecommunication technology, specifically the transition to 5G. 5G telecommunications introduces two new frequency bands: sub-6 GHz (3.5 – 7 GHz) and mmWave (24 – 71 GHz). It is mmWave 5G that allows for extremely low latency and substantial bandwidth, thus allowing for higher data throughput, both of which are necessary to enable the new applications previously mentioned. As such, a network of 5G-enabled devices and infrastructure is growing worldwide, especially in important markets like China, leads the global 5G mid-band deployment with over 68% of the market share, according to IDTechEx.

Key Points: 
  • This demand for low transmission loss, or low-loss, materials for 5G applications is buoying the market to surpass USD$2.1 billion by 2034, as predicted by IDTechEx's new report, " Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts ".
  • As sub-6 GHz 5G is the most deployed 5G frequency band to date, low-loss materials used in sub-6 GHz applications comprise about two-thirds of the 5G market by revenue in 2024, as estimated by IDTechEx.
  • However, the performance leap from sub-6 GHz to mmWave 5G demands dielectric materials with even lower dielectric loss than incumbent materials.
  • IDTechEx's latest report, "Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts", explores the technology developments and market trends driving the growth of the low-loss materials market for next-generation telecommunications.

Buoyed by mmWave 5G, Low-Loss Materials for 5G Market to Surpass US$2.1 Billion by 2034, According to IDTechEx

Retrieved on: 
Monday, February 5, 2024
Glass, Growth, Telecommunications, Research, LCB, PTFE, USD, FR-4, High-pass filter, LTCC, Transmission loss, PPE, PI, Hertz, Printed circuit board

BOSTON, Feb. 5, 2024 /PRNewswire/ -- Smart devices, autonomous driving, remote patient monitoring – countless new applications are being unlocked by advancements in telecommunication technology, specifically the transition to 5G. 5G telecommunications introduces two new frequency bands: sub-6 GHz (3.5 – 7 GHz) and mmWave (24 – 71 GHz). It is mmWave 5G that allows for extremely low latency and substantial bandwidth, thus allowing for higher data throughput, both of which are necessary to enable the new applications previously mentioned. As such, a network of 5G-enabled devices and infrastructure is growing worldwide, especially in important markets like China, leads the global 5G mid-band deployment with over 68% of the market share, according to IDTechEx.

Key Points: 
  • This demand for low transmission loss, or low-loss, materials for 5G applications is buoying the market to surpass USD$2.1 billion by 2034, as predicted by IDTechEx's new report, " Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts ".
  • As sub-6 GHz 5G is the most deployed 5G frequency band to date, low-loss materials used in sub-6 GHz applications comprise about two-thirds of the 5G market by revenue in 2024, as estimated by IDTechEx.
  • However, the performance leap from sub-6 GHz to mmWave 5G demands dielectric materials with even lower dielectric loss than incumbent materials.
  • IDTechEx's latest report, "Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts", explores the technology developments and market trends driving the growth of the low-loss materials market for next-generation telecommunications.

Delta Secures License to Hydrogen Energy Technology from UK-listed Ceres to Develop its Fuel Cell and Electrolysis Solutions

Retrieved on: 
Thursday, January 18, 2024
Hydrogen, Technology transfer, London Stock Exchange, SOEC, Temperature, Electricity, Partnership, ICE, Electronics, Delta Electronics, Methane, Ship, Carbon, Water, Steel, Transport, Transmission loss

Ceres is a global leader in solid oxide fuel cell and electrochemical technology.

Key Points: 
  • Ceres is a global leader in solid oxide fuel cell and electrochemical technology.
  • Through this partnership, Delta expects to integrate Ceres' energy stack technology with its own industry-leading power electronics and thermal management technologies to develop solid oxide fuel cell (SOFC) and solid oxide electrolysis cell (SOEC) systems for hydrogen energy applications, with production expected to start by the end of 2026, with strong ambition for future scale-up.
  • These SOFC and SOEC systems are expected to enhance the capabilities of Delta's green solutions for a myriad of sectors, such as, chemicals, energy, transportation, steel and more.
  • We believe Delta can deliver efficient clean hydrogen solutions for its customers utilising both our SOFC and SOEC technologies.

High Voltage Direct Current (HVDC) Transmission Market to Reach $23.7 Billion, Globally, by 2032 at 8.4% CAGR: Allied Market Research

Retrieved on: 
Friday, October 20, 2023
PDF, HVDC, Transmission loss, Growth, VSC, AC, Transformers, LCC, Field line, Electrode, Table, Electric power

WILMINGTON, Del., Oct. 20, 2023 /PRNewswire/ -- Allied Market Research published a report, titled, "High Voltage Direct Current (HVDC) Transmission Market By Component (Converter Stations, Transmission Medium (Cables), Others), By Technology (Voltage Source Converters (VSC), Line Commutated Converters (LCC), Capacitor Commutated Converter (CCC)), By Transmission Type (Submarine, Overhead, Underground), By Application (Bulk Power Transmission, Interconnecting Grids, Infeed Urban Areas): Global Opportunity Analysis And Industry Forecast, 2023-2032." According to the report, the global high voltage direct current (HVDC) transmission industry was estimated at $10.6 billion in 2022 and is projected to reach $23.7 billion by 2032, growing at a CAGR of 8.4% from 2023 to 2032.   

Key Points: 
  • This is because converter stations are a crucial component of modern electrical transmission systems, primarily used in high-voltage direct current (HVDC) transmission.
  • However, the others segment is projected to manifest the highest CAGR of 9.0% from 2023 to 2032.
  • Based on transmission type, the overhead segment held the highest market share in 2022, accounting for more than half of the global high voltage direct current (HVDC) transmission market revenue, and is projected to rule the roost by 2032.
  • The growth is attributed to the fact that overhead HVDC transmission is highly efficient for long-distance power transmission.

High Voltage Direct Current (HVDC) Transmission Market to Reach $23.7 Billion, Globally, by 2032 at 8.4% CAGR: Allied Market Research

Retrieved on: 
Friday, October 20, 2023
PDF, HVDC, Transmission loss, Growth, VSC, AC, Transformers, LCC, Field line, Electrode, Table, Electric power

WILMINGTON, Del., Oct. 20, 2023 /PRNewswire/ -- Allied Market Research published a report, titled, "High Voltage Direct Current (HVDC) Transmission Market By Component (Converter Stations, Transmission Medium (Cables), Others), By Technology (Voltage Source Converters (VSC), Line Commutated Converters (LCC), Capacitor Commutated Converter (CCC)), By Transmission Type (Submarine, Overhead, Underground), By Application (Bulk Power Transmission, Interconnecting Grids, Infeed Urban Areas): Global Opportunity Analysis And Industry Forecast, 2023-2032." According to the report, the global high voltage direct current (HVDC) transmission industry was estimated at $10.6 billion in 2022 and is projected to reach $23.7 billion by 2032, growing at a CAGR of 8.4% from 2023 to 2032.   

Key Points: 
  • This is because converter stations are a crucial component of modern electrical transmission systems, primarily used in high-voltage direct current (HVDC) transmission.
  • However, the others segment is projected to manifest the highest CAGR of 9.0% from 2023 to 2032.
  • Based on transmission type, the overhead segment held the highest market share in 2022, accounting for more than half of the global high voltage direct current (HVDC) transmission market revenue, and is projected to rule the roost by 2032.
  • The growth is attributed to the fact that overhead HVDC transmission is highly efficient for long-distance power transmission.