Teledyne e2v

Teledyne e2v HiRel Introduces New Radiation Tolerant 2.5 GHz, 100 W RF Power Limiter

Retrieved on: 
Thursday, December 5, 2019
Other Manufacturing, Consumer electronics, Technology, Other Defense, Engineering, Aerospace, Manufacturing, Mobile, Wireless, Defense, Other Transport, Semiconductor, Security, Satellite, Transport, Other Technology, Audio, Video, Software, Networks, Hardware, Electronic design automation, Semiconductors, Electronics, Technology, Teledyne e2v, MOSFETs, Semiconductor device fabrication, Silicon, Limiter, Teledyne Technologies, Silicon on insulator, Integrated circuit

Teledyne e2v HiRel today announced the availability of a new RF power limiter, the 2.5 GHz, 100 W TDLM025100 .

Key Points: 
  • Teledyne e2v HiRel today announced the availability of a new RF power limiter, the 2.5 GHz, 100 W TDLM025100 .
  • The limiter is a monolithic integrated circuit based on a Silicon-on-Insulator (SOI) technology that is ideal for use in high reliability aerospace and defense applications.
  • View the full release here: https://www.businesswire.com/news/home/20191205005830/en/
    The new 2.5GHz, 100W RF Power Limiter from Teledyne e2v HiRel, a monolithic all-in-one solution for high reliability applications.
  • The power limiter delivers low insertion loss and high linearity under non-limiting power levels and extremely fast response time in a limiting event, ensuring protection of sensitive circuitry.

Teledyne Imaging to exhibit at ITE 2019

Retrieved on: 
Wednesday, November 20, 2019
Companies, Teledyne DALSA, Teledyne Technologies, States of the United States, Teledyne e2v, TDY, Pacifico Yokohama, Rex Geveden

WATERLOO, Ontario, Nov. 20, 2019 (GLOBE NEWSWIRE) -- Teledyne DALSA , Teledyne e2v , and Teledyne Lumenera , all Teledyne Technologies [NYSE: TDY] companies will exhibit as Teledyne Imaging at the International Technical Exhibition on Imaging Technology & Equipment (ITE) 2019, December 4-6, in PACIFICO Yokohama Hall D, Japan.

Key Points: 
  • WATERLOO, Ontario, Nov. 20, 2019 (GLOBE NEWSWIRE) -- Teledyne DALSA , Teledyne e2v , and Teledyne Lumenera , all Teledyne Technologies [NYSE: TDY] companies will exhibit as Teledyne Imaging at the International Technical Exhibition on Imaging Technology & Equipment (ITE) 2019, December 4-6, in PACIFICO Yokohama Hall D, Japan.
  • Please visit the Teledyne Imaging team in PACIFICO Yokohama Hall D, Japan, December 4-6, 2019 in Booth D-01.
  • Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella.
  • Teledyne Imaging forms an unrivalled collective of expertise across the spectrum and decades of experience.

Teledyne e2v introduces industry’s first 1.3MP Time-of-Flight sensor

Retrieved on: 
Tuesday, November 12, 2019
Companies, States of the United States, Teledyne e2v, TDY, California, Acoustic Research, Geographic information system, Teledyne Technologies

Ha Lan Do Thu, Marketing Manager for 3D imaging at Teledyne e2v said, We are very pleased to announce our newest Time-of-Flight sensor, which provides customers with true 1.3MP depth resolution at more than 30 fps.

Key Points: 
  • Ha Lan Do Thu, Marketing Manager for 3D imaging at Teledyne e2v said, We are very pleased to announce our newest Time-of-Flight sensor, which provides customers with true 1.3MP depth resolution at more than 30 fps.
  • The sensor uniquely achieves excellent precision and accuracy in 3D measurements and is highly flexible, handling both short- and long-range capture over 10 meters and in outdoor conditions.
  • Teledyne e2v is part of the Teledyne Imaging Group.
  • For more information imaging.teledyne-e2v.com
    Teledyne Imagingis a group of leading-edge companies aligned under the Teledyne Technologies [TDY] umbrella.

Teledyne e2v HiRel Releases Radiation Tolerant 60 GHz Reflective SPDT RF Switch for Space Applications

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Monday, October 7, 2019
Other Manufacturing, Technology, Other Defense, Engineering, Aerospace, Manufacturing, Mobile, Wireless, Defense, Semiconductor, Satellite, Other Technology, Telecommunications, Software, Hardware, Electronic design automation, Companies, Electronics, Teledyne e2v, RF switch, States of the United States, Teledyne Technologies, Radiation hardening

Teledyne e2v HiRel announces the availability of a rad-tolerant 60 GHz, Single Pole Double Throw (SPDT) reflective RF switch, model TDSW0602T , that is ideal for use in high reliability, demanding space and defense applications.

Key Points: 
  • Teledyne e2v HiRel announces the availability of a rad-tolerant 60 GHz, Single Pole Double Throw (SPDT) reflective RF switch, model TDSW0602T , that is ideal for use in high reliability, demanding space and defense applications.
  • Until now, rad tolerant 60 GHz switch technology has only been available for less rigorous commercial application requirements.
  • The Teledyne e2v HiRel TDSW0602T RF switch delivers benchmark low insertion loss, high isolation, fast switching times, and high linearity across a wide frequency band from 20 kHz to 60 GHz.
  • Teledyne e2v HIREL Electronics offers high-performance, high-reliability semiconductor solutions to provide critical functions for Defense, Space and Commercial markets worldwide.

Teledyne Imaging’s newest cameras deliver true 16M resolution, global shutter and a compact C-mount lens

Retrieved on: 
Tuesday, September 10, 2019
Companies, Teledyne Technologies, Teledyne DALSA, States of the United States, Teledyne e2v, California, Geographic information system

Engineered around Teledyne DALSAs proven camera platform, and featuring Teledyne e2vs 16M Emerald image sensor, these new models deliver affordability, ease of use, and are designed for industrial imaging applications that require high-speed data transfer.

Key Points: 
  • Engineered around Teledyne DALSAs proven camera platform, and featuring Teledyne e2vs 16M Emerald image sensor, these new models deliver affordability, ease of use, and are designed for industrial imaging applications that require high-speed data transfer.
  • Users with existing Camera Link systems will benefit from their compact body size, higher resolutions, greater image quality, faster frame rates, and overall lower deployment costs.
  • 4128 pixels x 4128 Lines, 1:1 resolution
    For more information about the newest addition to the Genie Nano family, please visit the website .
  • Teledyne Imagingis a group of leading edge companies, including Teledyne DALSA and Teledyne e2v, aligned under the Teledyne umbrella.

Teledyne Imaging’s newest cameras deliver true 16M resolution, global shutter and a compact C-mount lens

Retrieved on: 
Tuesday, September 10, 2019
Companies, Teledyne Technologies, Teledyne DALSA, States of the United States, Teledyne e2v, California, Geographic information system

Engineered around Teledyne DALSAs proven camera platform, and featuring Teledyne e2vs 16M Emerald image sensor, these new models deliver affordability, ease of use, and are designed for industrial imaging applications that require high-speed data transfer.

Key Points: 
  • Engineered around Teledyne DALSAs proven camera platform, and featuring Teledyne e2vs 16M Emerald image sensor, these new models deliver affordability, ease of use, and are designed for industrial imaging applications that require high-speed data transfer.
  • Users with existing Camera Link systems will benefit from their compact body size, higher resolutions, greater image quality, faster frame rates, and overall lower deployment costs.
  • 4128 pixels x 4128 Lines, 1:1 resolution
    For more information about the newest addition to the Genie Nano family, please visit the website .
  • Teledyne Imagingis a group of leading edge companies, including Teledyne DALSA and Teledyne e2v, aligned under the Teledyne umbrella.

Teledyne e2v announces new CMOS Sensor Family, targeted at 3D Laser Triangulation Applications

Retrieved on: 
Tuesday, September 3, 2019
Companies, Active pixel sensor, Science and technology in the United States, Teledyne e2v, States of the United States, Teledyne Technologies, Rolling shutter, Shutter, Emerging technologies

GRENOBLE, France, Sept. 03, 2019 (GLOBE NEWSWIRE) -- Teledyne e2v , a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its Flash CMOS image sensor family, specifically tailored for 3D laser profiling/displacement applications and high speed, high resolution inspection.

Key Points: 
  • GRENOBLE, France, Sept. 03, 2019 (GLOBE NEWSWIRE) -- Teledyne e2v , a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its Flash CMOS image sensor family, specifically tailored for 3D laser profiling/displacement applications and high speed, high resolution inspection.
  • The new Flash sensors feature a 6m CMOS global shutter pixel which effectively combines high resolution and fast frame rate.
  • These new sensors feature a unique set of characteristics targeted at 3D laser triangulation applications including; high resolution, very high frame rate, very high readout speed, HDR capability and a large set of additional features.
  • All these capabilities allow our customers to solve the most challenging application demands in 3D laser profiling/displacement such as quality control and 3D measurement.

Teledyne Scientific Presenting Three New Papers Next Week at International Microwave Symposium 2019

Retrieved on: 
Thursday, May 30, 2019
Sailing, Technology, Satellite, Semiconductor, Manufacturing, Aerospace, Engineering, Defense, Other Defense, Sports, Companies, States of the United States, Teledyne Technologies, Teledyne e2v, Economy of the United States, Acoustic Research, Microwave, IEEE MTT-S International Microwave Symposium, Henry Earl Singleton

Next week at the annual International Microwave Symposium (IMS) trade show in Boston, Teledyne Scientific staff will be taking part in three of the Technical Sessions being held on Thursday, June 6.

Key Points: 
  • Next week at the annual International Microwave Symposium (IMS) trade show in Boston, Teledyne Scientific staff will be taking part in three of the Technical Sessions being held on Thursday, June 6.
  • The three Teledyne Scientific staff people presenting technical papers at the sessions will be Keisuke Shinohara, Principal Scientist, Zach Griffith, mm-wave and THz Design and Product Engineer, and Andrea Arias, Senior RF Engineer.
  • These papers showcase Teledynes leadership in linear broadband millimeter-Wave amplifiers with high efficiency.
  • In addition to Teledyne Scientific, other Teledyne companies participating in TDE Booth #1124 include Teledyne e2v Semiconductors , Teledyne e2v RF Power -- Defence , Teledyne Labtech , Teledyne Microwave Solutions (RF & Microwave Products), Teledyne MEC (TWT Products), Teledyne Relays / Teledyne Coax Switches and Teledyne Storm Microwave .

At IMS 2019, Teledyne Defense Electronics Unveils New Products Along with an Unrivaled Breadth of RF/MW Solutions

Retrieved on: 
Thursday, May 30, 2019
Technology, Data management, Hardware, Software, Telecommunications, Satellite, Semiconductor, Manufacturing, Aerospace, Engineering, Defense, Other Defense, Companies, States of the United States, Teledyne Technologies, California, Teledyne e2v, Acoustic Research, Teledyne Controls, Henry Earl Singleton

Eight separate Teledyne brands currently offer a wide variety of RF/MW solutions to leading companies and government agencies worldwide.

Key Points: 
  • Eight separate Teledyne brands currently offer a wide variety of RF/MW solutions to leading companies and government agencies worldwide.
  • Participating Teledyne companies at Booth 1124 will include Teledyne e2v Semiconductors , Teledyne e2v RF Power -- Defence , Teledyne Labtech , Teledyne Microwave Solutions (RF & Microwave Products), Teledyne MEC (TWT Products), Teledyne Relays / Teledyne Coax Switches , Teledyne Scientific , and Teledyne Storm Microwave .
  • Serving Defense, Space and Commercial sectors worldwide, Teledyne Defense Electronics offers a comprehensive portfolio of highly engineered solutions that meet your most demanding requirements in the harshest environments.
  • TDE is a business unit of Teledyne Technologies, Inc., a leading provider of sophisticated instrumentation, digital imaging products and software, aerospace and defense electronics, and engineered systems.

Mixel MIPI D-PHY IP Integrated Into Teledyne e2v Snappy CMOS Image Sensors

Retrieved on: 
Wednesday, May 29, 2019
Technology, Hardware, Photography, Semiconductor, Manufacturing, Engineering, ARM architecture, Electronic engineering, System on a chip, Electronics, Companies, MIPI Alliance, Ice, Display Serial Interface, Tegra, Teledyne e2v, Teledyne Technologies, MIPI

Mixel Inc., a leader in mixed-signal intellectual property (IP), and Teledyne Imaging, a leader in sensor, signal generation, and image processing, today announced that Mixel MIPI IPhas been successfully integrated into Teledyne e2v Snappy 2-Megapixel and 5-Megapixel CMOS Image Sensor IC products.

Key Points: 
  • Mixel Inc., a leader in mixed-signal intellectual property (IP), and Teledyne Imaging, a leader in sensor, signal generation, and image processing, today announced that Mixel MIPI IPhas been successfully integrated into Teledyne e2v Snappy 2-Megapixel and 5-Megapixel CMOS Image Sensor IC products.
  • The MIPI solution is comprised of two IP products delivered fully validated and integrated, namely: a MIPI D-PHY Transmitter and a MIPI CSI-2SM Host Controller Core.
  • The Mixel MIPI IP has been integrated in both of Teledyne e2vs Snappy products and will be integrated in other new products as well.
  • MIPI CSI-2SM, MIPI DSISM, MIPI DSI-2SM, MIPI C-PHYSMand MIPI D-PHYSMare service marks of MIPI Alliance.