Teledyne e2v

Global Adaptive Optics Market to Reach $4.8 Billion by 2026

Retrieved on: 
Monday, April 18, 2022
Consumer, Astronomy, Health, Adoption, Adaptive optics, Marketing, LLC, COVID-19, Ophthalmology, Stroke, Research, Car, Teledyne e2v, CAGR, Geography, Distortion, Weapon, Microscopy, Boston Micromachines Corporation, SAN, GIA, Wavefront sensor, Growth, Players, Technology, MEMS, American, Northrop Grumman, IRIS, Internet, Iris AO, Inc., ADAS, Investment, Forecasting, Intelligence, Industrial, Magnetism, Control System (album), Defense, D, Renewable energy, Telescopic sight, Others, ISR

SAN FRANCISCO, April 18, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Adaptive Optics - Global Market Trajectory & Analytics" .

Key Points: 
  • SAN FRANCISCO, April 18, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Adaptive Optics - Global Market Trajectory & Analytics" .
  • Amid the COVID-19 crisis, the global market for Adaptive Optics estimated at US$1.4 Billion in the year 2022, is projected to reach a revised size of US$4.8 Billion by 2026, registering a compounded annual growth rate (CAGR) of 35.5% over the analysis period.
  • The United States represents the largest regional market for Adaptive Optics, and is projected to reach US$1.8 Billion by 2026.
  • The growing demand for optics imaging solutions in defense applications, primarily for identification of long distance targets, is anticipated to boost growth in the global adaptive optics market.

Silvaco Announces that Teledyne e2v Expands Adoption of its Victory TCAD Solution to Further Accelerate Development of CMOS Image Sensors

Retrieved on: 
Wednesday, March 2, 2022
Semiconductor, Hardware, Consumer Electronics, Technology, Software, Software, CMOS, EDA, Technology, SOC, Growth, IP, TCAD, Victory, Partnership, Memory, Group, General manager, Transport, Silicon, Medical imaging, Teledyne Technologies, Silvaco, Silvaco Group, Inc., Teledyne e2v, SILVACO GROUP, INC., TELEDYNE E2V

Silvaco Group, Inc., a leading provider of TCAD, EDA software, and Design IP, today announced that Teledyne e2v, a global leader in imaging solutions, has renewed its commitment to Silvacos Victory TCAD solution to accelerate its CMOS image sensor development.

Key Points: 
  • Silvaco Group, Inc., a leading provider of TCAD, EDA software, and Design IP, today announced that Teledyne e2v, a global leader in imaging solutions, has renewed its commitment to Silvacos Victory TCAD solution to accelerate its CMOS image sensor development.
  • Teledyne e2v has a long history of high-performance image sensor development and a long partnership with Silvaco using its TCAD software suite.
  • We have been a long-term customer of the Silvaco TCAD solution due to its comprehensive flow for image sensor design and analysis, said Ana Gonzlez Mrquez, Director of Technology & Product Development at Teledyne e2v.
  • Our 2D and 3D Victory TCAD solution provides unique technologies to simulate, analyze, and optimize optoelectronics devices and in particular CMOS image sensors.

InGaAs Image Sensor Market to Witness Extensive Growth Due to Rapid Adoption of Surveillance, Non-Destructive Inspection, and Spectroscopy Systems, Says TMR

Retrieved on: 
Monday, October 4, 2021
Adoption, TMR, Efficiency, CAGR, Airport, Growth, SWIR, Automation, Safety, Noise, Teledyne e2v, Camera

Transparency Market Research (TMR) has analyzed various aspects related to the growth of the InGaAs image sensor market.

Key Points: 
  • Transparency Market Research (TMR) has analyzed various aspects related to the growth of the InGaAs image sensor market.
  • The analysts at TMR estimate the global market for InGaAs image sensor to expand at a CAGR of 5.2% during the forecast period.
  • However, manufacturers in the InGaAs image sensor market are focusing on reducing the noise level in InGaAs image sensors.
  • Thus, the growing demand for spectroscopy is directly proportional to the growth of the InGaAs image sensor market.

InGaAs Image Sensor Market to Witness Extensive Growth Due to Rapid Adoption of Surveillance, Non-Destructive Inspection, and Spectroscopy Systems, Says TMR

Retrieved on: 
Monday, October 4, 2021
Adoption, TMR, Efficiency, CAGR, Airport, Growth, SWIR, Automation, Safety, Noise, Teledyne e2v, Camera

ALBANY, N.Y., Oct. 4, 2021 /PRNewswire/ --

Key Points: 
  • Transparency Market Research (TMR) has analyzed various aspects related to the growth of the InGaAs image sensor market.
  • The analysts at TMR estimate the global market for InGaAs image sensor to expand at a CAGR of 5.2% during the forecast period.
  • However, manufacturers in the InGaAs image sensor market are focusing on reducing the noise level in InGaAs image sensors.
  • Thus, the growing demand for spectroscopy is directly proportional to the growth of the InGaAs image sensor market.

Teledyne e2v HiRel Partners with Integra Technologies Inc. to Launch 100V GaN/SiC RF Power Technology for High Reliability Aerospace & Defense Applications

Retrieved on: 
Wednesday, July 14, 2021
Semiconductor, Automotive Manufacturing, Aerospace, Satellite, Manufacturing, Defense, Nanotechnology, Other Technology, Other Defense, Telecommunications, Networks, Hardware, Electronic design automation, Technology, Mobile, Wireless, Other Energy, Oil, Gas, Energy, Engineering, Materials, Chemistry, Physical sciences, Teledyne e2v, Teledyne Technologies, Gallium nitride, Transistor, Light-emitting diode, Silicon carbide

Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced that it will be offering High Reliability qualified versions of California-based Integra Technologies, Inc. (Integra) new 100V Gallium Nitride on Silicon Carbide (GaN/SiC) power transistors.

Key Points: 
  • Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced that it will be offering High Reliability qualified versions of California-based Integra Technologies, Inc. (Integra) new 100V Gallium Nitride on Silicon Carbide (GaN/SiC) power transistors.
  • Our most demanding customers are requesting higher power density RF power devices, said Brad Little, VP and General Manager of Teledyne e2v HiRel.
  • Teledyne e2v HiRel innovations lead developments in space, transportation, defense, and industrial markets.
  • Teledyne e2v HiRel Electronics is part of the Teledyne Defense Electronics Group.

Teledyne e2v HiRel Announces New L-band Surface Mount Switch for High Power Military Applications

Retrieved on: 
Tuesday, June 29, 2021
Technology, Other Defense, Engineering, Contracts, Automotive Manufacturing, Aerospace, Manufacturing, Mobile, Wireless, Defense, Other Energy, Semiconductor, Oil, Gas, Satellite, Energy, Nanotechnology, Other Technology, Telecommunications, Networks, Hardware, Electronic design automation, Companies, Electrical engineering, Electronics, Teledyne e2v, Semiconductor devices, Teledyne Technologies, Monolithic microwave integrated circuit, Intermodulation, Diode, Acoustic Research

Teledyne e2v HiRel today announced availability of a new single-pole, double-throw multi-chip module (MCM) switch with world class power handling.

Key Points: 
  • Teledyne e2v HiRel today announced availability of a new single-pole, double-throw multi-chip module (MCM) switch with world class power handling.
  • The surface mount PIN-diode hybrid exhibits superior RF and thermal performance compared to MMIC or glass carrier-based technologies.
  • View the full release here: https://www.businesswire.com/news/home/20210629005246/en/
    Teledyne e2v HiRel High Power L-Band Switch (Photo: Business Wire)
    The small form factor (10.1 mm x 6.2 mm x 2.5 mm) offers world class power handling, low insertion loss, and superior intermodulation performance exceeding all competitive technologies.
  • The TDSW002040 is surprisingly small given the very high power-handling it is capable of, making it perfect for modern military communications transmit/receive switching.

Teledyne e2v announces low-cost, high-performance quad linear CMOS sensor family

Retrieved on: 
Tuesday, June 29, 2021
Companies, Teledyne e2v, States of the United States, Vision, Imaging, Remote sensing, Spectroscopy, Teledyne Technologies, Spectral imaging, TDY, Multispectral image, Machine vision

GRENOBLE, France, June 29, 2021 (GLOBE NEWSWIRE) -- Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and part of the Teledyne Imaging group, introduces Tetra , a low-cost, high-performance quad linear CMOS sensor family.

Key Points: 
  • GRENOBLE, France, June 29, 2021 (GLOBE NEWSWIRE) -- Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and part of the Teledyne Imaging group, introduces Tetra , a low-cost, high-performance quad linear CMOS sensor family.
  • Using wafer level coated dichroic filters, the sensor also provides spectrally independent RGB and NIR outputs for multispectral imaging.
  • Florian Julien, Director of the Machine Vision Team at Teledyne e2v said, The sorting industry has started to upgrade its traditional technology from color to multispectral imaging.
  • Teledyne e2v is part of the Teledyne Imaging Group.

Teledyne e2v HiRel Unveils Two New High-Power PIN Diode Limiter Modules

Retrieved on: 
Monday, March 22, 2021
Technology, Other Defense, Semiconductor, Security, Aerospace, Nanotechnology, Manufacturing, Audio, Video, Electronic design automation, Defense, Electronics, Companies, Electrical engineering, Diodes, Limiter, Teledyne Technologies, Teledyne e2v, PIN diode, Diode

Teledyne e2v HiRel today announced two new additions to its family of high power limiters, the TDLM052402, a quasi-active, 2 kW, L/S/C-band SMT PIN Diode Limiter and the TDLM961122 High Power Limiter Module a quasi-active, 1 kW, ARNS/IFF-band SMT PIN Diode Limiter.

Key Points: 
  • Teledyne e2v HiRel today announced two new additions to its family of high power limiters, the TDLM052402, a quasi-active, 2 kW, L/S/C-band SMT PIN Diode Limiter and the TDLM961122 High Power Limiter Module a quasi-active, 1 kW, ARNS/IFF-band SMT PIN Diode Limiter.
  • View the full release here: https://www.businesswire.com/news/home/20210322005659/en/
    Teledyne e2v HiRel High Power PIN Diode Limiter Modules (Photo: Business Wire)
    The new power limiter modules are packaged in a small 8 mm x 5 mm form factor designed for demanding electronic warfare and radar applications and utilize proven hybrid assembly technology.
  • The limiter design employs a two-stage detector circuit which enables ultra-fast turn-on of the high-power PIN Diodes.
  • These two devices are excellent additions to Teledyne e2v HiRels high power limiter portfolio for military applications, as we continue to expand our RF product line, said Mont Taylor, VP of Business Development at Teledyne HiRel.

Newly Resurrected TD72403L FIFO Memory Chip Enables Vital Defense Platform Extensions

Retrieved on: 
Wednesday, March 17, 2021
Technology, Other Defense, Semiconductor, Engineering, Satellite, Aerospace, Manufacturing, Hardware, Defense, Companies, Teledyne e2v, Teledyne Technologies, States of the United States, Queue management, Computer memory, Synchronization, FIFO, Data buffer, California

Teledyne e2v HiRel Electronics announces the availability of the newly resurrected TD72403L dual port First-In, First-Out (FIFO) memory device, with Military MlL-PRF-38535, Class Level B processing and a military-suitable temperature range of 55C to +125C.

Key Points: 
  • Teledyne e2v HiRel Electronics announces the availability of the newly resurrected TD72403L dual port First-In, First-Out (FIFO) memory device, with Military MlL-PRF-38535, Class Level B processing and a military-suitable temperature range of 55C to +125C.
  • The TD72403L has the following features:
    The FIFO device is commonly used for inter-chip communications protocol, frequency matching, bus-width matching, data buffering and data rate matching applications.
  • Other examples of devices that Teledyne HiRel has re-introduced following re-engineering effort to support legacy systems include:
    The new TD72403L FIFO is now available for ordering and immediate purchase.
  • About Teledyne e2v HiRel Electronics, Inc.
    Teledyne e2v HiRel Electronics innovations lead developments in space, transportation, defense, and industrial markets.

Teledyne e2v HiRel and Integra Technologies Inc. Partner on High Voltage GaN Devices

Retrieved on: 
Tuesday, March 2, 2021
Technology, Mobile, Wireless, Defense, Other Defense, Contracts, Semiconductor, Security, Satellite, Photography, Nanotechnology, Audio, Video, Other Technology, Telecommunications, Software, Networks, Internet, Hardware, Electronic design automation, Aerospace, Data management, Manufacturing, Consumer electronics, VoIP, Companies, Chemistry, Teledyne e2v, Electronics industry, Teledyne Technologies, Gallium nitride, Reliability, Power semiconductor device, Acoustic Research

Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced a new high reliability partnership with California-based Integra Technologies, Inc. (Integra).

Key Points: 
  • Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced a new high reliability partnership with California-based Integra Technologies, Inc. (Integra).
  • View the full release here: https://www.businesswire.com/news/home/20210302005930/en/
    With Integra, Teledyne e2v HiRel will specialize in providing high power RF devices for emerging space applications in the LEO and GEO payload market.
  • Teledyne will also offer high reliability options for Integra's popular GaN on SiC power devices and pallets targeted at the defense market.
  • Our space customers are requesting RF power devices at higher power density levels and operating at higher frequencies, said Brad Little, VP and General Manager of Teledyne e2v HiRel.