Teledyne Technologies

Teledyne e2v HiRel and Integra Technologies Inc. Partner on High Voltage GaN Devices

Tuesday, March 2, 2021 - 4:46pm

Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced a new high reliability partnership with California-based Integra Technologies, Inc. (Integra).

Key Points: 
  • Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced a new high reliability partnership with California-based Integra Technologies, Inc. (Integra).
  • View the full release here: https://www.businesswire.com/news/home/20210302005930/en/
    With Integra, Teledyne e2v HiRel will specialize in providing high power RF devices for emerging space applications in the LEO and GEO payload market.
  • Teledyne will also offer high reliability options for Integra's popular GaN on SiC power devices and pallets targeted at the defense market.
  • Our space customers are requesting RF power devices at higher power density levels and operating at higher frequencies, said Brad Little, VP and General Manager of Teledyne e2v HiRel.

Teledyne e2v and Yumain announce collaboration to create AI-based imaging solutions for machine vision

Tuesday, March 2, 2021 - 8:00am

Together, the companies will develop cutting-edge bio-inspired vision solutions that can enable innovation in industrial applications.

Key Points: 
  • Together, the companies will develop cutting-edge bio-inspired vision solutions that can enable innovation in industrial applications.
  • By joining forces, Teledyne e2v and Yumain plan to develop significant breakthrough innovations to address these challenges, make AI technology more accessible, and advance it to the next level.
  • Vincent Hector, Vice President of Market Development at Teledyne e2v, says, Were very excited to be collaborating with Yumain on this innovative project.
  • Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

Teledyne to Hold Investor Meetings

Friday, February 26, 2021 - 11:42pm

Teledyne Technologies Incorporated (NYSE:TDY) today announced that Jason VanWees, Executive Vice President, will be holding virtual investor meetings at the following investor conferences:

Key Points: 
  • Teledyne Technologies Incorporated (NYSE:TDY) today announced that Jason VanWees, Executive Vice President, will be holding virtual investor meetings at the following investor conferences:
    Teledynes latest investor presentation is publicly available on the companys website.
  • Teledyne Technologies is a leading provider of sophisticated instrumentation, digital imaging products and software, aerospace and defense electronics, and engineered systems.
  • In connection with the proposed transaction between Teledyne and FLIR, Teledyne will file with the SEC a Registration Statement on Form S-4 that will include a joint proxy statement of Teledyne and FLIR and a prospectus of Teledyne, as well as other relevant documents concerning the proposed transaction.
  • The proposed transaction involving Teledyne and FLIR will be submitted to Teledynes stockholders and FLIRs stockholders for their consideration.

Teledyne LeCroy Announces Industry-First Capability to Analyze PCI Express® Across Physical and Protocol Layers

Tuesday, February 23, 2021 - 6:10pm

When testing and debugging PCIe, engineers use protocol analyzers to view protocol messages between components over a relatively long period of time.

Key Points: 
  • When testing and debugging PCIe, engineers use protocol analyzers to view protocol messages between components over a relatively long period of time.
  • They cannot, however, capture protocol messages with oscilloscopes because they run out of memory before the protocol event occurs.
  • For this reason, engineers need to use the two separate instruments in entirely different set ups when testing an application using PCI Express.
  • The CrossSync PHY software option for Teledyne LeCroy LabMaster and WaveMaster oscilloscopes enables the oscilloscope's MAUI user interface to be viewed directly alongside the industry-standard Teledyne LeCroy CATC protocol trace.

Teledyne LeCroy Enables First-Ever Full Picture of PCIe with Launch of CrossSync™ PHY

Tuesday, February 23, 2021 - 1:00pm

Engineers also need to use oscilloscopes to measure PCIe electrical performance at the physical layer with a high degree of resolution.

Key Points: 
  • Engineers also need to use oscilloscopes to measure PCIe electrical performance at the physical layer with a high degree of resolution.
  • By linking the oscilloscope with the protocol analyzer using Teledyne LeCroys new CrossSync PHY Interposer Probes and Software Options Link, engineers can now test PCIe using one system test.
  • Our new CrossSync PHY technology does just that, enhancing reliability and performance while also improving time to market.
  • Teledyne LeCroy is based in Chestnut Ridge, N.Y. For more information, visit Teledyne LeCroy's website at teledynelecroy.com .

Teledyne Expands its Virtual Trade Show, Allowing Visitors to Explore and Connect Products to Markets to Applications with Precision

Thursday, February 18, 2021 - 6:49pm
Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20210218005921/en/
    A view from the floor of the new Virtual Trade Show of Teledyne Defense Electronics.
  • It offers a 360 panorama view, allowing customers to look in any direction and move through the TDE hall using a laptop mouse.
  • Moving through the hall, visitors may click on prompts that appear for numerous global markets that TDE serves, and in some cases markets served by other Teledyne companies.
  • These markets webpages are constructed to enable visitors to quickly find and drill down into a wide array of Teledyne solutions for that market.

Global Next-Generation Avionics Market Markets, 2020-2025 - Opportunities in Growing Utilization of Advanced Navigation and Surveillance Technologies for Avionics

Monday, February 15, 2021 - 3:30pm

There are several factors that are contributing to the significant growth of next-generation avionics market.

Key Points: 
  • There are several factors that are contributing to the significant growth of next-generation avionics market.
  • The next-generation avionics market research provides detailed market information for segmentation such as aircraft type, system, and region.
  • The next-generation avionics market is segregated by region under four major regions, namely North America, Europe, Asia-Pacific, and Rest-of-the-World.
  • The key market players in the global next-generation avionics market include Collins Aerospace, Thales Group, Saab, GE Aviation, L3Harris Technologies, Universal Avionics (an Elbit Systems Company), Curtiss-Wright Corporation, Safran, Cobham, Scioteq (Esterline), Garmin, Teledyne Technologies, Inc., BAE Systems, and Trig Avionics, among others.

Teledyne SP Devices Announces 12-bit Digitizer with 7 Gbyte/s Sustained Data Transfer Rate

Tuesday, February 9, 2021 - 1:30pm

Teledyne SP Devices, a business unit of Teledyne Technologies Incorporated (NYSE: TDY), today announced the release of ADQ32 a fourth-generation modular data acquisition board optimized for high-throughput applications.

Key Points: 
  • Teledyne SP Devices, a business unit of Teledyne Technologies Incorporated (NYSE: TDY), today announced the release of ADQ32 a fourth-generation modular data acquisition board optimized for high-throughput applications.
  • It can also be used to perform data reduction so that the output rate matches the 7 Gbyte/s sustained transfer capacity of the PCI Express interface.
  • Teledyne SP Devices designs and manufactures world-leading modular data acquisition and signal generation instruments.
  • SP Devices products are deployed across a wide variety of industries, including analytical instruments, remote sensing, scientific instrumentation, medical imaging, and more.

Teledyne Imaging Begins a New Era in Large Area CMOS Imaging

Tuesday, February 9, 2021 - 1:00pm

Exclusively developed by Teledyne Imaging, LACera advanced imaging technology draws on Teledynes decades of expertise in CMOS sensor and camera development.

Key Points: 
  • Exclusively developed by Teledyne Imaging, LACera advanced imaging technology draws on Teledynes decades of expertise in CMOS sensor and camera development.
  • Scientific imaging, spanning x-ray to near infrared (NIR) regions, is critical to emerging applications in life and physical sciences.
  • Applications as diverse as next generation genomics, astronomical photometry, ultra-high-resolution x-ray and electron imaging require CMOS sensors and cameras with low light sensitivity and speed.
  • Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne Technologies umbrella.

Teledyne to Present at the Cowen Aerospace/Defense & Industrials Conference

Monday, February 8, 2021 - 10:20pm

Teledyne Technologies Incorporated (NYSE:TDY) today announced that Jason VanWees, Executive Vice President, will present at the 42nd Annual Cowen Aerospace/Defense & Industrials Virtual Conference on Wednesday, February 10, at 10:30 a.m. (Pacific).

Key Points: 
  • Teledyne Technologies Incorporated (NYSE:TDY) today announced that Jason VanWees, Executive Vice President, will present at the 42nd Annual Cowen Aerospace/Defense & Industrials Virtual Conference on Wednesday, February 10, at 10:30 a.m. (Pacific).
  • A live webcast of Teledynes conference presentation may be accessed via the companys website at www.teledyne.com/investors/events-and-presentations .
  • Teledyne Technologies is a leading provider of sophisticated instrumentation, digital imaging products and software, aerospace and defense electronics, and engineered systems.
  • The proposed transaction involving Teledyne and FLIR will be submitted to Teledynes stockholders and FLIRs stockholders for their consideration.