Semiconductors

Flex Logix Announces nnMAX IP Delivers Higher-Throughput/$ and Higher Throughput/Watt For Key DSP Functions

Retrieved on: 
Tuesday, April 7, 2020
Hardware acceleration, Field-programmable gate array, Processor, Semiconductors, Fabless semiconductor companies, Digital signal processors, Electrical components, Electronic engineering

MOUNTAIN VIEW, Calif., April 7, 2020 /PRNewswire/ -- Flex Logix Technologies, Inc ., the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, today unveiled key benchmarking information around its new nnMAX architecture , showing how it can effectively be used for DSP acceleration for key functions.

Key Points: 
  • MOUNTAIN VIEW, Calif., April 7, 2020 /PRNewswire/ -- Flex Logix Technologies, Inc ., the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, today unveiled key benchmarking information around its new nnMAX architecture , showing how it can effectively be used for DSP acceleration for key functions.
  • Cheng Wang, Flex Logix's senior VP engineering and co-founder, disclosed these benchmarks and more at today's online Linley Processor Forum in a presentation titled "DSP Acceleration using nnMAX."
  • "Because nnMAX is so good at accelerating AI inference, customers started asking us if it could also be applied to DSP functions," said Geoff Tate, CEO and co-founder of Flex Logix.
  • nnMAX is available now for 16nm SoC designs and will be available for additional process nodes in 2021."

The global FPGA market is projected to grow at CAGR of 7.6% from 2020 to 2025

Retrieved on: 
Monday, April 6, 2020
Field-programmable gate array, Hardware acceleration, Compound annual growth rate, Academic disciplines, Semiconductors, Electrical components

NEW YORK, April 6, 2020 /PRNewswire/ --The global FPGA market is projected to grow at CAGR of 7.6% from 2020 to 2025.

Key Points: 
  • NEW YORK, April 6, 2020 /PRNewswire/ --The global FPGA market is projected to grow at CAGR of 7.6% from 2020 to 2025.
  • The global FPGA market size is projected to grow from USD 5.9 billion in 2020 to USD 8.6 billion by 2025; it is expected to grow at a CAGR of 7.6% from 2020 to 2025.
  • The low-end FPGA segment is projected to grow at the highest CAGR during the forecast period.
  • In 2019, the less than 28 nm segment held the largest size of the FPGA market.This segment is projected to grow at the highest CAGR from 2020 to 2025.

ACM Research Appoints Jim Straus as Vice President of Sales for North America

Retrieved on: 
Wednesday, April 1, 2020
Semiconductor device fabrication, Applied Materials, Wafer, Semiconductor devices, SEMI, Technology, Semiconductors

FREMONT, Calif., April 01, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM or the Company) (NASDAQ:ACMR), a leading supplier of wafer cleaning technologies for advanced semiconductor devices, today announced the appointment of Jim Straus as Vice President of Sales for North America.

Key Points: 
  • FREMONT, Calif., April 01, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM or the Company) (NASDAQ:ACMR), a leading supplier of wafer cleaning technologies for advanced semiconductor devices, today announced the appointment of Jim Straus as Vice President of Sales for North America.
  • Jim has served in sales, account management, business development, and operations executive roles for nearly 30 years at Applied Materials.
  • Jim is a graduate of the United States Military Academy at West Point with a Bachelor of Science degree.
  • Im excited to have him to lead our sales team in North America.

Global Memory Chip Market (2018 to 2025) - Featuring Broadcom, Corsair Components & Crossbar Among Others - ResearchAndMarkets.com

Retrieved on: 
Thursday, March 26, 2020
Technology, Hardware, Semiconductor, Consumer electronics, Integrated circuit, Inventions, Technology, Semiconductors, Fabless semiconductor companies

The "Global Memory Chip Market" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Memory Chip Market" report has been added to ResearchAndMarkets.com's offering.
  • In addition to industry and competitive analysis of the market for memory chips, this report also exhaustively covers patents and company profiles of key players active in the global market.
  • The market for memory chips is expected to witness growth over the forecast period of 2019 to 2024.
  • Further, the market for memory chips is set to grow because of its wide range of applications.

Renesas Electronics Announces New PMIC Reference Designs for Xilinx FPGAs and SoCs

Retrieved on: 
Wednesday, March 25, 2020
Semiconductor, Consumer electronics, Technology, Networks, Internet, Hardware, Fabless semiconductor companies, Xilinx, Field-programmable gate array, Semiconductors, Renesas Electronics, Companies, Power management integrated circuit, LPDDR, Electronic engineering

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced three easy to use Power Management IC (PMIC) reference designs for powering the multiple supply rails of Xilinx Artix-7 FPGAs, Spartan-7 FPGAs, and Zynq-7000 SoCs, with and without DDR memory.

Key Points: 
  • Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced three easy to use Power Management IC (PMIC) reference designs for powering the multiple supply rails of Xilinx Artix-7 FPGAs, Spartan-7 FPGAs, and Zynq-7000 SoCs, with and without DDR memory.
  • Renesas high efficiency PMIC reference designs provide user-friendly turnkey solutions that enable a single design to support different Xilinx speed grades and DDR memory types: DDR3, DDR3L, DDR4, LPDDR2 and LPDDR3.
  • The ISL91211A-BIK-REFZ reference board for Artix-7 FPGAs is available now from Renesas Electronics worldwide distributors with a recommended resale price of $168.00 USD.
  • The ISL91211BIK-REF2Z reference board for Spartan-7 FPGAs is available now from Renesas Electronics worldwide distributors with a recommended resale price of $160.00 USD.

Efinix’s® Trion® FPGA Silicon Platform Expands into Europe Through Partnership with ViMOS Technologies

Retrieved on: 
Wednesday, March 25, 2020
Hardware acceleration, Integrated circuits, Field-programmable gate array, Power management integrated circuit, Low-voltage differential signaling, Semiconductors, Electrical components, Electronic engineering, Fabless semiconductor companies

SANTA CLARA, Calif. and MUNICH, Germany, March 25, 2020 (GLOBE NEWSWIRE) -- Efinix , an innovator in programmable product platforms and technologies, and ViMOS Technologies , an innovative semiconductor distributor, today announced a partnership to distribute Efinixs Trion FPGA silicon platform to local customers in regional markets across Central Europe.

Key Points: 
  • SANTA CLARA, Calif. and MUNICH, Germany, March 25, 2020 (GLOBE NEWSWIRE) -- Efinix , an innovator in programmable product platforms and technologies, and ViMOS Technologies , an innovative semiconductor distributor, today announced a partnership to distribute Efinixs Trion FPGA silicon platform to local customers in regional markets across Central Europe.
  • ViMOS focus is on PMIC (Power Management ICs), communication circuits (DVB, GPS + antennas) and interfacing ICs (MIPI, HDMI, DP, LVDS).
  • Efinixs products, with its disruptive Quantum technology at its heart, are immediately available to ViMOS customers delivering a 4X Power-Performance-Area advantage over traditional FPGA technologies.
  • Efinix, an innovator in programmable products, drives the future of edge AI computing with its Trion FPGA platform.

Alchip Technology Opens North America Operation

Retrieved on: 
Thursday, March 19, 2020
Fabless semiconductor companies, Semiconductor device fabrication, Semiconductors, TSMC, Companies, Alchip, Fabless manufacturing, Milpitas, California, Semiconductor fabrication plant, Taiwan Stock Exchange, Integrated circuit

MILPITAS SAN JOSE, Calif., March 19, 2020 /PRNewswire/ --Alchip Technologies, Limited, the high-performance computing ASIC leader, today announced the opening of its North American headquarters.

Key Points: 
  • MILPITAS SAN JOSE, Calif., March 19, 2020 /PRNewswire/ --Alchip Technologies, Limited, the high-performance computing ASIC leader, today announced the opening of its North American headquarters.
  • The new office at 1900 McCarthy Blvd serves both business management and technology services.
  • According to Mr. Nagashima, Alchip will focus on Hyperscalers, OEM's and fabless IC device companies who require product-specific, high performance IC's.
  • Alchip is listed on the Taiwan Stock Exchange (TWSE: 3661) and is a TSMC-certified Value Chain Aggregator.

JA Solar offer customers high-quality solar modules with Mono PERC MBB Cells adopting Ga-doped Silicon Wafers

Retrieved on: 
Thursday, March 19, 2020
Energy, Physical sciences, Semiconductors, Energy conversion, Photovoltaics, Semiconductor devices, Energy harvesting, Physical chemistry, Solar cell, Doping, Solar panel, Monocrystalline silicon

BEIJING, March 19, 2020 /PRNewswire/ -- With the recent introduction of Ga doped wafers company wide, JA Solar becomes the first firm in the world to mass-producehigh-efficiency Mono PERC MBB cells and modules using Ga-doped wafers.

Key Points: 
  • BEIJING, March 19, 2020 /PRNewswire/ -- With the recent introduction of Ga doped wafers company wide, JA Solar becomes the first firm in the world to mass-producehigh-efficiency Mono PERC MBB cells and modules using Ga-doped wafers.
  • JA Solar, a world-leading manufacturer of high-performance photovoltaic products, announced that all its production lines of Mono PERC MBB Cells and related modules can be switched to produce modules and cells adopting Ga-doped silicon wafers.Integrating with PERC-SE technology and large-size wafers, Ga doping technology consistently improves the performance of both cells and modules.
  • In 2019, Shin-Etsu Chemical granted its "Ga-doped silicon wafers for making solar cells" IP rights to JA Solar, which paved way for JA Solar to use Ga doped wafers worldwide.
  • The application of Ga-doped silicon wafers to solar cells can effectively mitigate the initial light-induced degradation (LID) issue, which limits the performance of solar modules with traditional Si wafers.

JA Solar offer customers high-quality solar modules with Mono PERC MBB Cells adopting Ga-doped Silicon Wafers

Retrieved on: 
Thursday, March 19, 2020
Energy, Physical sciences, Semiconductors, Energy conversion, Photovoltaics, Semiconductor devices, Energy harvesting, Physical chemistry, Solar cell, Doping, Solar panel, Monocrystalline silicon

BEIJING, March 19, 2020 /PRNewswire/ -- With the recent introduction of Ga doped wafers company wide, JA Solar becomes the first firm in the world to mass-producehigh-efficiency Mono PERC MBB cells and modules using Ga-doped wafers.

Key Points: 
  • BEIJING, March 19, 2020 /PRNewswire/ -- With the recent introduction of Ga doped wafers company wide, JA Solar becomes the first firm in the world to mass-producehigh-efficiency Mono PERC MBB cells and modules using Ga-doped wafers.
  • JA Solar, a world-leading manufacturer of high-performance photovoltaic products, announced that all its production lines of Mono PERC MBB Cells and related modules can be switched to produce modules and cells adopting Ga-doped silicon wafers.Integrating with PERC-SE technology and large-size wafers, Ga doping technology consistently improves the performance of both cells and modules.
  • In 2019, Shin-Etsu Chemical granted its "Ga-doped silicon wafers for making solar cells" IP rights to JA Solar, which paved way for JA Solar to use Ga doped wafers worldwide.
  • The application of Ga-doped silicon wafers to solar cells can effectively mitigate the initial light-induced degradation (LID) issue, which limits the performance of solar modules with traditional Si wafers.

ACM Research Launches Stress-Free Polishing Tool for Advanced Packaging Applications; Delivers First Tool to Leading Chinese OSAT

Retrieved on: 
Wednesday, March 18, 2020
Semiconductor device fabrication, Chemical-mechanical polishing, Wafer-level packaging, Wafer, Semiconductors, Electronics, Electronic engineering

FREMONT, Calif., March 18, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today introduced the Ultra SFP ap tool for advanced packaging solutions.

Key Points: 
  • FREMONT, Calif., March 18, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today introduced the Ultra SFP ap tool for advanced packaging solutions.
  • The Ultra SFP ap leverages ACMs proven stress-free polishing (SFP) technology and integrates it with chemical mechanical planarization (CMP) and wet-etch chambers into a single system.
  • We completed the research and development for SFP technology in 2009, understanding that it was ahead of its time, explained David Wang, CEO of ACM Research.
  • ACM also announced today that it delivered the first Ultra SFP ap to a leading Chinese wafer-level packaging provider during the fourth quarter of 2019.