Semiconductors

Silicon on Insulator (SOI) Market | Need for Low-Power Solutions to Boost Growth | Technavio

Retrieved on: 
Tuesday, March 17, 2020
Technology, Hardware, Semiconductor, Semiconductors, Chemistry, Physical sciences, Semiconductor device fabrication, Microtechnology, MOSFETs, Nanoelectronics, Silicon on insulator, Soitec, SUMCO, SOI, Wafer

Our silicon on insulator (SOI) market report covers the following areas:

Key Points: 
  • Our silicon on insulator (SOI) market report covers the following areas:
    This study identifies ongoing investments in new fabs as one of the prime reasons driving the silicon on insulator (SOI) market growth during the next few years.
  • Silicon on Insulator (SOI) Market 2019-2023: Vendor Analysis
    We provide a detailed analysis of around 25 vendors operating in the silicon on insulator (SOI) market, including some of the vendors such as GlobalWafers, Shanghai Simgui Technology, Shin-Etsu Chemical, Soitec and SUMCO.
  • Backed with competitive intelligence and benchmarking, our research reports on the silicon on insulator (SOI) market are designed to provide entry support, customer profile and M&As as well as go-to-market strategy support.
  • Silicon on Insulator (SOI) Market 2019-2023: Key Highlights

Nova Announces Availability of Annual Report on Form 20-F Through Company Website

Retrieved on: 
Thursday, March 12, 2020
Semiconductor device fabrication, Semiconductor devices, MOSFETs, Metrology, Industries, Semiconductors, Nova Measuring Instruments

Shareholders may receive a hard copy of the annual report free of charge upon request.

Key Points: 
  • Shareholders may receive a hard copy of the annual report free of charge upon request.
  • Nova is a leading innovator and key provider of metrology solutions for advanced process control used in semiconductor manufacturing.
  • Nova delivers continuous innovation by providing state-of-the-art high-performance metrology solutions for effective process control throughout the semiconductor fabrication lifecycle.
  • Nova acts as a partner to semiconductor manufacturers from its offices around the world.

Semiconductor Market in East Asia 2020-2024 | Demand from Consumer Electronics Market to Boost Market Growth | Technavio

Retrieved on: 
Thursday, March 12, 2020
Technology, Semiconductor, SEMI, Marketplace, Semiconductor device fabrication, Semiconductors, Articles, ON Semiconductor, Technology

View the full release here: https://www.businesswire.com/news/home/20200312005500/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20200312005500/en/
    Technavio has announced its latest market research report titled Semiconductor Market in East Asia 2020-2024 (Graphic: Business Wire)
    The Japanese consumer electronics market is the third-largest consumer electronics market in the world.
  • Thus, the growth of consumer electronics market will boost the growth of the semiconductor market in East Asia during the forecast period.
  • Semiconductor Market in East Asia: Segmentation Analysis
    This market research report segments the semiconductor Market In East Asia by end-users (memory, foundry and IDM), and geographic segmentation (China, Taiwan, Japan, South Korea (Republic of Korea), and rest of East Asia).
  • China led the semiconductor market in East Asia in 2019, followed by Taiwan, Japan, South Korea (Republic of Korea), and Rest of East Asia.

Si2 Compact Model Coalition to Support CEA-Leti SPICE Simulation Model

Retrieved on: 
Tuesday, March 10, 2020
Electronic design automation, Semiconductor, Technology, Software, Research, Science, Hardware, Semiconductors, Electronics, Simulation software, Electronic engineering, Semiconductor device fabrication, Compact Model Coalition, MOSFETs, Microtechnology, Silicon, Spice, Electronic circuit simulation, Silicon on insulator

The Si2 Compact Model Coalition has announced the approval and financial support of L-UTSOI, a new ultra-thin, silicon-on-insulator transistor simulation model developed by CEA-Leti, a France-based research institute for electronics and information technologies.

Key Points: 
  • The Si2 Compact Model Coalition has announced the approval and financial support of L-UTSOI, a new ultra-thin, silicon-on-insulator transistor simulation model developed by CEA-Leti, a France-based research institute for electronics and information technologies.
  • L-UTSOI was selected for support by CMC , a coalition of 30 semiconductor companies that standardizes semiconductor models used in a class of circuit simulation tools called SPICE, or Simulation Program with Integration Circuit Emphasis.
  • CEA-Letis compact model boasts physically based model parameters, said Harrison Lee, chair of the L-UTSOI Working Group and principal engineer of the Foundry Design Enablement Team at Samsung Electronics.
  • We look forward to this same support from the CMC stakeholders implementing and using the L-UTSOI model.

ON Semiconductor Names 2019 Distribution Partner Award Winners

Retrieved on: 
Thursday, March 5, 2020
Consumer electronics, Technology, Manufacturing, Semiconductor, Other Energy, Transport, Logistics, Supply chain management, Energy, Engineering, Hardware, Electronic design automation, ON Semiconductor, Semiconductors, Companies, Semiconductor device, Investment, Financial markets

Approximately 60 percent of the companys business results from distribution sales, and distribution remains the fastest channel to market.

Key Points: 
  • Approximately 60 percent of the companys business results from distribution sales, and distribution remains the fastest channel to market.
  • Over the past few years, ON Semiconductor has continued to grow distribution sales, most notably when the company reached $1 billion in distribution resales in Q3 2018.
  • At the end of 2019, we reported that distribution sales accounted for more than half of ON Semiconductors 2019 annual revenues, said Jeff Thomson, senior vice president of global channel sales for ON Semiconductor.
  • ON Semiconductor and the ON Semiconductor logo are registered trademarks of Semiconductor Components Industries, LLC.

Alpha and Omega Semiconductor Releases 700V and 600V αMOS5™ Super Junction MOSFETs in SMD-type DFN5x6 and DFN8x8 Packages

Retrieved on: 
Friday, March 6, 2020
Technology, Hardware, Semiconductors, Electrical components, Semiconductor packages, TO-263, MOSFET, Data General AOS, Technology, Hardware, Corporate crime, Federal Trade Commission, Consumer protection, Economy, Government

View the full release here: https://www.businesswire.com/news/home/20200305005144/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20200305005144/en/
    Super Junction MOSFETs in SMD-type DFN5x6 and DFN8x8 Packages (Graphic: Business Wire)
    The new MOS5 DFN8x8 products footprint is only 64 mm, which is 57% smaller than that of D2PAK.
  • The new MOS5 DFN5x6 products footprint is more compact at 30 mm, 61% smaller than that of DPAK.
  • AOS MOS5 DFN8x8 and DFN5x6 products also come with an MSL1 rating, meaning longer floor life and less maintenance concern.
  • As part of the first wave release, AONV210A60 (600V 210mOhm DFN8x8), AONS660A70F (700V 660mOhm DFN5x6) and AONS1R6A70 (700V 1.6Ohm DFN5x6) are immediately available for production quantities.

Tower Semiconductor SiGe Technology Adopted by Renesas Electronics for Production of its Market Leading SATCOM RFICs

Retrieved on: 
Wednesday, March 4, 2020
Semiconductor devices, Integrated circuits, Electrical components, Semiconductors, Thermoelectricity, Tower Semiconductor, Renesas Electronics, Silicon-germanium, BiCMOS, MOSFET

Thanks to the strong collaboration between Tower Semiconductor and our world-class design team, we are exceeding our customers expectations by all metrics and progressing rapidly into production.

Key Points: 
  • Thanks to the strong collaboration between Tower Semiconductor and our world-class design team, we are exceeding our customers expectations by all metrics and progressing rapidly into production.
  • By leveraging Tower Semiconductors high-performance SiGe BiCMOS technology, Renesas is able to achieve unprecedented levels of integration.
  • During early development, the Renesas design team also took advantage of the flexibility and customization of the Tower Semiconductor process offerings to identify the optimal compromise between cost and performance.
  • By some estimates, the Satcom market is projected to grow to $50 billion by 2027 at a CAGR of 10%.

The Conventional & Advanced Packaging Market for IC Devices, Forecast to 2023 - FOWLP, MRQFN, Vertically Stacked Multichip Packages, and SiPs

Retrieved on: 
Tuesday, March 3, 2020
Semiconductor device fabrication, Packaging, Electronic engineering, Semiconductors, Inventions, Integrated circuits

DUBLIN, March 3, 2020 /PRNewswire/ -- The "The Worldwide Conventional and Advanced Packaging Market for IC Devices" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 3, 2020 /PRNewswire/ -- The "The Worldwide Conventional and Advanced Packaging Market for IC Devices" report has been added to ResearchAndMarkets.com's offering.
  • Worldwide Integrated Circuit Market Forecasts, 2018-2023
    Worldwide IC Packaging Market Forecasts, 2018-2023
    The Worldwide Conventional and Advanced Packaging Market for IC Devices examines the global marketplace of integrated circuits (ICs) and the many packaging designs developed for ICs.
  • The 385-page report provides insightful analysis of major market trends affecting the IC industry and presents more than 170 tables quantifying both the IC devices and IC packaging markets.
  • Chapter 4, IC Packaging Market Analysis, examines the IC packaging market in deep granular detail.

Xilinx Launches Industry's First SmartNIC Platform Bringing Turnkey Network, Storage and Compute Acceleration to Cloud Data Centers

Retrieved on: 
Tuesday, March 3, 2020
Xilinx, Hardware acceleration, Field-programmable gate array, Semiconductors, Science and technology in the United States, Electrical components

The U25 combines a highly optimized SmartNIC platform with a powerful and flexible FPGA-based engine that supports full programmability and turnkey accelerated applications.

Key Points: 
  • The U25 combines a highly optimized SmartNIC platform with a powerful and flexible FPGA-based engine that supports full programmability and turnkey accelerated applications.
  • The platform enables 'bump-in-the-wire' network, storage, and compute offload and acceleration functions for maximum efficiency by avoiding unnecessary data movements and CPU processing.
  • The Alveo U25 SmartNIC platform enables turnkey accelerated applications that make it easier for non-tier-1 cloud data center operators to deploy SmartNICs and quickly reap the benefits.
  • Copyright 2020 Xilinx, Inc. Xilinx, the Xilinx logo and other designated brands included herein are trademarks of Xilinx in the United States and other countries.

Lam Research Breaks New Ground in Etch Technology and Productivity for Chipmaking Processes

Retrieved on: 
Tuesday, March 3, 2020
Semiconductor device fabrication, Semiconductors, Electrical components, Technology, Lam Research, Wafer, Integrated circuit

As dimensions shrink and aspect ratios increase, the Sense.i platform is designed to support future technology inflections.

Key Points: 
  • As dimensions shrink and aspect ratios increase, the Sense.i platform is designed to support future technology inflections.
  • As semiconductor manufacturers develop smarter, faster, and denser chips, processes are rapidly growing in complexity and number of steps.
  • Lam is introducing the most innovative etch product that has been developed in the last 20 years, said Vahid Vahedi, senior vice president and general manager of the Etch product group at Lam Research.
  • Lam Research Corporationis a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry.