Texas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plant in Utah
LEHI, Utah, Nov. 2, 2023 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today broke ground on its new 300-mm semiconductor wafer fabrication plant (or "fab") in Lehi, Utah.
- LEHI, Utah, Nov. 2, 2023 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today broke ground on its new 300-mm semiconductor wafer fabrication plant (or "fab") in Lehi, Utah.
- Once completed, TI's two Utah fabs will manufacture tens of millions of analog and embedded processing chips every day at full production.
- "Today we take an important step in our company's journey to expand our manufacturing footprint in Utah.
- LFAB2 will complement TI's existing 300-mm wafer fabs, which include LFAB1 (Lehi, Utah), DMOS6 (Dallas), and RFAB1 and RFAB2 (both in Richardson, Texas).