Interlaken

S2C's PCIe Gen5-Enabled S8-40 Prototyping System, Accelerating AI Design with High Performance

Retrieved on: 
Tuesday, July 4, 2023
Transfer, FMC, Data-rate units, CXL, AMD, DSP, Internet of things, S2C, CCIX, PAM4, Collection, Interlaken, SAN, HPC, EP, Prodigy, AI, Field-programmable gate array, Family, GPU, Video game, Sulfur, Computer data storage, Medical device, Printed circuit board, Satellite navigation device

Supporting high bandwidth connectivity including PCIe Gen5 and PAM4, S8-40 effectively addresses the verification needs of high bandwidth applications such as storage, AI, and GPU chip designs.

Key Points: 
  • Supporting high bandwidth connectivity including PCIe Gen5 and PAM4, S8-40 effectively addresses the verification needs of high bandwidth applications such as storage, AI, and GPU chip designs.
  • With the increasing adoption of AI, 5G, IoT, and autonomous driving, the demand for low real-time processing is growing more than ever.
  • These applications often require low-latency and high-bandwidth interfaces such as PCIe Gen5 and high-speed interconnect protocols such as CXL and CCIX.
  • Prodigy S8-40 is the first member of our 8th-generation prototyping solution to meet the verification requirements of AI and other bandwidth-intensive designs.

Exelixis Advances Board Refreshment Plan

Retrieved on: 
Thursday, April 13, 2023
Biotechnology, Pharmaceutical, Health, Oncology, Vincent, Farallon Capital, Clinical trial, Annual Meetings of the International Monetary Fund and the World Bank Group, Cancer, L.L.C, Farallon, Patient, Physician, Interlaken, Annual general meeting, Growth, Therapy, Capital Group Companies, EXEL, Management, Shareholder, Exelixis

The Board subsequently agreed to appoint both Messrs. Heyman and Oliver to the Board as part of a proposed settlement agreement with Farallon.

Key Points: 
  • The Board subsequently agreed to appoint both Messrs. Heyman and Oliver to the Board as part of a proposed settlement agreement with Farallon.
  • While the Exelixis Board could not concede to Farallon’s information and access demands, the Board determined at the time of the interviews that Messrs. Heyman and Oliver were excellent candidates for the Board, and the failure of settlement negotiations with Farallon does not in any way affect that view.
  • Their proposed addition to the Board is part of an ongoing refreshment plan that underscores our commitment to upholding best-in-class corporate governance to ensure we have the right balance of relevant skills and expertise to guide the Company’s continued evolution and long-term strategic plan,” Dr. Papadopoulos continued.
  • Dr. Papadopoulos concluded, “We are pleased to strengthen the Exelixis Board with new independent directors who embody the important skillsets our Board is looking for as we advance our strategy to become a global, multi-product oncology company.

OpenFive and AnalogX to Provide Optimized Chip-to-Chip Interface IP Solutions

Retrieved on: 
Monday, October 5, 2020
Technology, Mobile, Wireless, Nanotechnology, Aerospace, Manufacturing, Telecommunications, Software, Networks, Internet, Hardware, Other Manufacturing, Electronic design automation, Semiconductor, Consumer electronics, Interlaken, SerDes, Fabless semiconductor companies, OpenFive, AnalogX

OpenFive, the leading provider of customizable, silicon-focused solutions with differentiated IP, along with AnalogX, a provider of SerDes interface IP, today announced a complete sub-system solution and implementation for Chip-to-Chip (C2C) interface with ultra-low latency and power.

Key Points: 
  • OpenFive, the leading provider of customizable, silicon-focused solutions with differentiated IP, along with AnalogX, a provider of SerDes interface IP, today announced a complete sub-system solution and implementation for Chip-to-Chip (C2C) interface with ultra-low latency and power.
  • View the full release here: https://www.businesswire.com/news/home/20201005005054/en/
    OpenFives 8th generation Interlaken Controller IP is silicon-proven on multiple process nodes with tier-1 customers.
  • AnalogX Inc. is a world leader in ultra-low power SerDes IP with a rich portfolio of interconnectivity solutions ranging from USR, XSR, VSR, to MR applications.
  • The OpenFive portfolio includes low-latency, high-throughput Interlaken connectivity fabric, 400/800G Ethernet, High-bandwidth memory (HBM2/E), USB subsystem IP, and die-to-die interconnect IP for next-generation heterogeneous chiplet-style products.

OpenFive Enhances Differentiated IP Portfolio with Die-to-Die Interface Controllers for HPC and Chiplet Markets

Retrieved on: 
Thursday, August 20, 2020
Software, Mobile, Wireless, Networks, Internet, Hardware, Electronic design automation, Data management, Consumer electronics, Technology, Semiconductor, Security, Nanotechnology, Audio, Video, Interlaken, Computer network, Computer networking

OpenFive, the leading provider of customizable, silicon-focused solutions with differentiated IP, today announced the launch of a new Die-to-Die (D2D) interface IP portfolio to serve next-generation chiplet based designs for Networking, HPC, and AI Markets.

Key Points: 
  • OpenFive, the leading provider of customizable, silicon-focused solutions with differentiated IP, today announced the launch of a new Die-to-Die (D2D) interface IP portfolio to serve next-generation chiplet based designs for Networking, HPC, and AI Markets.
  • To enable this heterogeneous integration for various markets, OpenFive Die-to-Die connectivity IP is a major enablement block.
  • OpenFive will continue to extend the series of Die-to-Die IP portfolio for other parallel PHY based architectures in the future as they become available.
  • The OpenFive portfolio includes low-latency, high-throughput Interlaken connectivity fabric, 400/800G Ethernet, High-bandwidth memory (HBM2/E), USB subsystem IP, and die-to-die interconnect IP for next-generation heterogeneous chiplet-style products.

AnalogX Launches Ultra Low Power Interconnect SerDes IP Portfolio to Fuel Next-Generation I/O Connectivity

Retrieved on: 
Thursday, April 25, 2019
SerDes, Serial communication, Interlaken

TORONTO, April 25, 2019 /PRNewswire-PRWeb/ -- AnalogX Inc., a Canadian corporation, is delighted to unveil its new, silicon-proven, multi-protocol, 1 to 33Gbps AXLinkIO connectivity IP portfolio.

Key Points: 
  • TORONTO, April 25, 2019 /PRNewswire-PRWeb/ -- AnalogX Inc., a Canadian corporation, is delighted to unveil its new, silicon-proven, multi-protocol, 1 to 33Gbps AXLinkIO connectivity IP portfolio.
  • The AXLinkIO portfolio of Serializer/Deserializer interconnect IP solutions is ideally suited for high-bandwidth chiplets and chips in AI processors, 5G networking, optical interfaces, and datacenter computing.
  • AXLinkIO exhibits the world's lowest power, lowest area, and highest performance for any interconnect SerDes IP architecture running up to 33Gbps.
  • The AXLinkIO portfolio of IPs includes AXDieIO, AXLinkIO-SR, and AXLinkIO-MR IP solutions.

Tamba Networks' Ethernet IP Selected for Innovium's TERALYNX™ 12.8 Tbps Data-Center Optimized Switch

Retrieved on: 
Tuesday, April 23, 2019
Digital electronics, Electronic engineering, Interlaken, Semiconductor intellectual property core, Ethernet, Digital technology

"Innovium was pleased to work with Tamba and its innovative IP, as we developed our highly innovative TERALYNX switch."

Key Points: 
  • "Innovium was pleased to work with Tamba and its innovative IP, as we developed our highly innovative TERALYNX switch."
  • Here are the highlights of Tamba products:
    Ethernet IP cores at rates from 1Gbps to 400Gbps.
  • In the 6 years, since launch of the Ethernet products, Tamba has become the dominant low latency supplier in financial markets.
  • Based in Silicon Valley, the portfolio includes IP solutions consisting of a complete family of silicon-proven soft Ethernet and Interlaken cores.