GPIO

M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process

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星期四, 四月 25, 2024
Internet of things, TSMC, IP, AI, PCI Express, Silicon, IPS, OIP, R&D, PHY, Standard cell, ADAS, Artificial intelligence, ALP, MIPI, GPIO, Intellectual property, Multimedia, M31, Partner, Socs

HSINCHU, April 25, 2024 /PRNewswire/ -- M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced that the M31 MIPI C/D-PHY Combo IP has obtained silicon validation on the advanced TSMC 5nm process and the company has already started 3nm IP development.

Key Points: 
  • HSINCHU, April 25, 2024 /PRNewswire/ -- M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced that the M31 MIPI C/D-PHY Combo IP has obtained silicon validation on the advanced TSMC 5nm process and the company has already started 3nm IP development.
  • M31 has been honored with the TSMC Open Innovation Platform® (OIP) Partner of the Year Award for Special Process IP for six consecutive years.
  • M31 also introduced the 5nm MIPI C/D PHY Combo IP that complies with the latest D-PHY v2.5 and C-PHY v2.0 specifications.
  • Looking ahead, M31 will closely follow TSMC's advanced process technology, continue to invest in R&D resources, develop products using advanced process technology, and expand IP solutions in emerging application areas such as AI, IoT, and 5G communication, to help customers accelerate product launches and enhance market competitiveness."

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free IoT

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星期一, 四月 22, 2024
Ambient, Internet, RTC, Ecosystem, Radio, Internet of things, Solar energy, EM4, Silicon Labs, Partnership, Motion, Light, Senior, Wireless, LED, Silicon, GPIO, LE, Longevity, Sleep, Industrial, Socs, MCU, Transformer

AUSTIN, Texas, April 22, 2024 /PRNewswire/ -- Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, today announced their new xG22E family of Wireless SoCs, Silicon Labs' first-ever family designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications. The new family consists of the BG22E, MG22E, and FG22E. As Silicon Labs' most energy-efficient SoCs to date, all three SoCs will enable IoT device makers to build high-performance, Bluetooth Low Energy (LE), 802.15.4-based, or Sub-Ghz wireless devices for battery-optimized and battery-free devices that can harvest energy from external sources in their environments like indoor or outdoor ambient light, ambient radio waves, and kinetic motion.

Key Points: 
  • To help device manufacturers build a complete energy harvesting solution, Silicon Labs is also announcing their partnership with e-peas , a provider of industry-leading Power Managed Integrated Circuits (PMICs) designed for energy harvesting.
  • Through this partnership, Silicon Labs and e-peas co-developed two energy harvesting shields for Silicon Labs' new, energy-optimized xG22E Explorer Kit.
  • The energy harvesting shields are each tuned and optimized for different energy sources and energy storage technologies.
  • "As the market for energy harvesting and low-power solutions grows, Silicon Labs remains dedicated to enhancing our wireless MCU and radio stack capabilities to advance the development of battery-free IoT solutions," said Ross Sabolcik, Senior Vice President for the Industrial and Commercial Business Unit at Silicon Labs.

INDUSTRY LEADING PPA EFPGA AND DSP/AI IN DEVELOPMENT FOR TSMC N5/4/3

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星期二, 四月 9, 2024
Pixel, DSP, GPIO, Inference, IPS, Complex, Urinary tract infection, FFT, Field-programmable gate array, Silicon, Architecture, Graphics processing unit, SDR, IP, FPGA, TSMC

MOUNTAIN VIEW, Calif., April 9, 2024 /PRNewswire/ -- Flex Logix® Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and reconfigurable DSP/AI solutions, announced that it is in development of next generation EFLX eFPGA Generation 3.0 for TSMC N5/4 and N3. EFLX Generation 3.0, along with the eXpreso™ eFPGA compiler enables Millions of LUTs and higher frequency operation; and LUTs that can programmably be I/O's for applications requiring a lot of control like networking switches or InferX DSP/SDR/AI. EFLX Gen3.0 can reconfigure in a few microseconds for dynamic workload switches.

Key Points: 
  • MOUNTAIN VIEW, Calif., April 9, 2024 /PRNewswire/ -- Flex Logix® Technologies, Inc. , the leading supplier of embedded FPGA (eFPGA) IP and reconfigurable DSP/AI solutions, announced that it is in development of next generation EFLX eFPGA Generation 3.0 for TSMC N5/4 and N3.
  • EFLX Generation 3.0, along with the eXpreso™ eFPGA compiler enables Millions of LUTs and higher frequency operation; and LUTs that can programmably be I/O's for applications requiring a lot of control like networking switches or InferX DSP/SDR/AI.
  • "Our commercial customers rely on our TSMC EFLX eFPGA technology already from 40nm to 7nm for applications including reconfigurable crypto agility, micro FPGA, programmable GPIO, customer-programmable accelerators, reconfigurable packet processing, asynchronous control and many more.
  • We are now supporting our customers on TSMC N5/4/3 with our improved EFLX architecture and our new InferX DSP/AI hardware and the InferX compiler.

Silicon Labs xG26 Sets New Standard in Multiprotocol Wireless Device Performance

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星期二, 四月 9, 2024
Silicon Labs, Attention, SOC, Algorithm, Bluetooth Low Energy, GPIO, Bluetooth mesh networking, Acceleration, Intelligence, Internet of things, Network layer, Wireless, Internet, Sleep, ARM, Running, RAM, Silicon, Home, ARM architecture family, Radio, MG26, CCTV, CPU, Machine learning, Family, Matter, Code, Bluetooth, Video game

AUSTIN, Texas, April 9, 2024 /PRNewswire/ -- Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, today announced their new xG26 family of Wireless SoCs and MCUs, the IoT industry leader's highest performance device family to date. The new family consists of the multiprotocol MG26 SoC, the Bluetooth LE BG26 SoC, and the PG26 MCU. All three are designed to future-proof the IoT against some of the most demanding emerging applications, like Matter, with double the Flash and RAM of other Silicon Labs multiprotocol devices.

Key Points: 
  • All three are designed to future-proof the IoT against some of the most demanding emerging applications, like Matter , with double the Flash and RAM of other Silicon Labs multiprotocol devices.
  • That's Matter's interoperability and security promise, which is why Silicon Labs designed the MG26 to be the most advanced SoC for the Matter standard.
  • Pin compatibility between select xG26 and xG24 devices and shared hardware and software development tools like Silicon Labs Simplicity Studios allows for easy development and seamless migration from other Silicon Labs Series 2 devices.
  • Learn more about how to begin developing cutting-edge IoT devices using Silicon Labs, be sure to :

SmartCow introduces Uranus Plus: An AI Fanless Embedded System Powered by NVIDIA Jetson Orin

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星期一, 二月 26, 2024
GPIO, SSD, NVM Express, AI, USB, Intelligence, API, San Jose Convention Center, OTG, Safety, GTC, Uranus, Nvidia Jetson, LAN, Wi-Fi, NVIDIA, Medical device

ST JULIANS, Malta, Feb. 25, 2024 /PRNewswire/ -- SmartCow, an AI engineering company specializing in building complex hardware and software solutions for artificial intelligence at the edge, announces the launch of their latest product, Uranus Plus, an AI fanless embedded system powered by the latest NVIDIA Jetson ™ Orin NX and Jetson Orin Nano™ system-on-modules.

Key Points: 
  • ST JULIANS, Malta, Feb. 25, 2024 /PRNewswire/ -- SmartCow, an AI engineering company specializing in building complex hardware and software solutions for artificial intelligence at the edge, announces the launch of their latest product, Uranus Plus, an AI fanless embedded system powered by the latest NVIDIA Jetson ™ Orin NX and Jetson Orin Nano™ system-on-modules.
  • Uranus Plus supercharges vision AI application development at the edge with NVIDIA Metropolis Microservices for Jetson through app stack modernization.
  • "Uranus Plus is suitable for general smart applications, especially vision AI projects and AI gateways.
  • SmartCow will exhibit Uranus Plus at NVIDIA GTC 2024 — a global AI conference running March 18-21 online and at the San Jose Convention Center — in booth 342.

SparkFun Electronics Unleashes the ESP32-C6 Thing Plus: A Wireless Innovation Powerhouse

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星期五, 二月 9, 2024
Lithium polymer battery, Electronics, PTH, Ecosystem, SparkFun Electronics, Life, JST, Internet of things, Payment card, Hertz, GPIO, Power management, Benefit, Video game

BOULDER, Colo., Feb. 9, 2024 /PRNewswire/ -- SparkFun Electronics releases the ESP32-C6 Thing Plus, a game-changing wireless development board set to elevate your projects to new heights. For over eight years SparkFun has been designing around Espressif technologies, and the release of the ESP32-C6 signals the completion of SparkFun's first major roadmap for development boards using ESP-based modules.

Key Points: 
  • The SparkFun ESP32-C6 Thing Plus is poised to revolutionize IoT projects with its intuitive design, powerful features, and seamless connectivity.
  • BOULDER, Colo., Feb. 9, 2024 /PRNewswire/ -- SparkFun Electronics releases the ESP32-C6 Thing Plus , a game-changing wireless development board set to elevate your projects to new heights.
  • The SparkFun ESP32-C6 Thing Plus combines cutting-edge technology with a compact, user-friendly design.
  • "We're thrilled to introduce the SparkFun Thing Plus - ESP32-C6," says Kirk Benell, CTO at SparkFun Electronics.

Silicon Labs and Arduino Partner to Democratize Matter

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星期二, 二月 6, 2024
Partnership, GitHub, DBm, Family, Silicon Labs, Internet of things, Language, Environment, RAM, Running, Ecosystem, Simplicity, Certification, Wireless, Documentation, Arduino Nano, Silicon, Privacy, SparkFun Electronics, Student, Software, IDE, GPIO, Library, Video game

AUSTIN, Texas, Feb. 6, 2024 /PRNewswire/ -- Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, today announced a new partnership in collaboration with Arduino, the global leader in open-source hardware and software, to better enable seamless development of Matter over Thread applications for Arduino's 33 million-strong developer community. Developed in collaboration with Silicon Labs, Arduino's first-ever Matter software libraries are available today on both the xG24 Explorer Kit from Silicon Labs and the xG24-based SparkFun Thing Plus Matter – MGM240P development board.

Key Points: 
  • Developed in collaboration with Silicon Labs, Arduino's first-ever Matter software libraries are available today on both the xG24 Explorer Kit from Silicon Labs and the xG24-based SparkFun Thing Plus Matter – MGM240P development board.
  • Code samples, reference designs, documentation and more are now live in the Arduino Core for Silicon Labs Devices GitHub page.
  • This new partnership between Silicon Labs and Arduino is a part of Silicon Labs' ongoing goal to make IoT development as user-friendly and expedient as possible.
  • Learn more about how Silicon Labs is looking inward and outward to make the lives of developers easier:

pSemi Unveils PE562212, Its Smallest and Fully Integrated PA-LNA-SW IoT Front-End Module

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星期二, 一月 9, 2024
Semiconductor, IOT (Internet of Things), Technology, Mobile, Wireless, Networks, Internet, Hardware, RF, PCB, Hertz, Semiconductor industry, Multimedia, LGA, SMD, FEM, ESD, BLE, DBm, Wi-Fi, CES, Typ, Marketing, GPIO, Internet of things, Internet service provider

pSemi® Corporation , a Murata company leading in the design and development of semiconductor integration and advanced connectivity, today announced the introduction of their smallest PA-LNA-SW Internet of Things (IoT) front-end module (FEM): the PE562212.

Key Points: 
  • pSemi® Corporation , a Murata company leading in the design and development of semiconductor integration and advanced connectivity, today announced the introduction of their smallest PA-LNA-SW Internet of Things (IoT) front-end module (FEM): the PE562212.
  • The PE562212 enables connectivity across Thread, Zigbee®, Bluetooth® BDR/EDR, BLE, and low-medium throughput Wi-Fi® (MCS7) as well as 2.4 GHz proprietary applications.
  • It also offers excellent ESD and ruggedness for all intended applications and environmental conditions inherent to the IoT space.
  • Samples and EVKs for PE562212 are available now, directly through pSemi, and are expected to be commercially available by August 2024.

Atmosic and AONDevices announce strategic partnership to leverage both the benefits of AI and energy harvesting to lower power consumption in AIoT Smart Home devices

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星期三, 一月 10, 2024
RF, AON, Sound, Artificial intelligence, SOC, Wireless, Radio, Partnership, Memory, AI, Spacecraft, Artificial intelligence of things, Human, GPIO, Television, Bluetooth Low Energy, Thread, SVP

CAMPBELL,Calif. and IRVINE, Calif., Jan. 10, 2024 /PRNewswire/ -- Atmosic Technologies, an innovator of ultra-low-power wireless IoT platforms such as the award-winning ATM33/e, today announced its strategic partnership with AONDevices, a pioneer in low-power application-specific edge Artificial Intelligence (AI) processors including the AON1120. The collaboration brings together low-power AI capabilities and ultra-low-power wireless technology, for innovative AIoT and wearable applications.

Key Points: 
  • Atmosic's partnership with AONDevices will reduce product power consumption by reducing false detect wakeups, RF transmissions, and cloud time.
  • The collaboration brings together low-power AI capabilities and ultra-low-power wireless technology, for innovative AIoT and wearable applications.
  • Atmosic has set a golden standard in IoT sustainability by reducing the power consumption of RF radios, and by leveraging harvested energy to power sensors, tags, remotes, and more.
  • The partnership with AONDevices brings further power reductions by cutting energy used when sensors 'false detect'.

XIMEA Releases High Speed Cameras With Resolutions Up To 21 Mpix With Speeds Above 300 FPS

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星期一, 十二月 18, 2023
Polsat News 2, Starz (Canadian TV channel), ROI, PCI Express, DMA, Binning, CPU, Housing, FPS, CMOS, GPIO, Noise, EF, Camera, Television, Computer data storage, Gigapixel image

MUNSTER, Germany, Dec. 18, 2023 /PRNewswire-PRWeb/ -- XIMEA, a pioneer in high speed interfaces, developed new models for the well established camera family of high resolution line cameras with PCI Express interface.

Key Points: 
  • XIMEA, a pioneer in high speed interfaces, developed new models for the well established camera family of high resolution line cameras with PCI Express interface.
  • MUNSTER, Germany, Dec. 18, 2023 /PRNewswire-PRWeb/ -- XIMEA, a pioneer in high speed interfaces, developed new models for the well established camera family of high resolution line cameras with PCI Express interface.
  • This PCIe high-speed camera line from XIMEA called xiB-64 already contains fast models ranging from 1 Mpix at 3600 Fps to 65 Mpix at 71 Fps.
  • The new models with names CB209, CB100 and CB024 offer resolutions up to 21 Megapixels at outstanding speeds of 300 frames per second.