ESD

Harmonic Sets the Pace for Intelligent Broadband Networks at ANGA COM 2024

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星期三, 五月 8, 2024
Cos, DAA, Internet, DOCSIS, GPON, Broadband networks, ESD, HFC, Growth, Freedom, ONU, COM, Intel, Optical line termination, Onus, ISM, SAN, Internet service provider

SAN JOSE, Calif., May 8, 2024 /PRNewswire/ -- Harmonic (NASDAQ: HLIT) today announced that it will showcase its latest broadband access innovations for fiber and DOCSIS networks at ANGA COM in Germany. These advancements empower operators with increased speeds and enhanced network reliability, unlocking new revenue opportunities and improving subscriber retention.

Key Points: 
  • SAN JOSE, Calif., May 8, 2024 /PRNewswire/ -- Harmonic (NASDAQ: HLIT) today announced that it will showcase its latest broadband access innovations for fiber and DOCSIS networks at ANGA COM in Germany.
  • "At ANGA COM, we'll showcase how our broadband solutions enable operators to enhance quality of subscriber experience and achieve multigigabit internet speeds with greater flexibility."
  • At ANGA COM, Harmonic will highlight the following broadband access innovations, enabling operators to:
    Maximize broadband speeds and enhance service quality: Harmonic will demonstrate its new Beacon intelligent speed maximizer (ISM) application for DOCSIS networks running on the cOS™ virtualized broadband platform that maximizes upstream and downstream speeds, mitigates network impairments and drives subscriber retention.
  • ANGA COM attendees can see Harmonic's industry-leading broadband solutions on display in hall 8, stand C35.

Vishay Intertechnology Blue and True Green LEDs in MiniLED Package Deliver High Brightness in a Small Size

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星期三, 四月 17, 2024
LCD, MCD, Light-emitting diode, ESD, Heart rate, Vishay Intertechnology, JEDEC, VSH, Telecommunications, Indium gallium nitride

MALVERN, Pa., April 17, 2024 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced new blue and true green surface-mount LEDs in the ultra compact MiniLED package.

Key Points: 
  • MALVERN, Pa., April 17, 2024 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced new blue and true green surface-mount LEDs in the ultra compact MiniLED package.
  • With their high brightness and small size, the LEDs released today are the perfect choice for small scale, high power products that are expected to work reliably in arduous environments.
  • Offering a typical wavelength of 465 nm at 20 mA, the VLMB2332T1U2-08 is optimized for smoke detectors that utilize short wavelength blue light for the detection of small particles.
  • The LEDs’ MiniLED package features a lead-frame embedded in a white thermoplast.

Nordson Electronics Solutions Receives EM China Innovation Award for the New ASYMTEK Select Coat® SL-1040 Conformal Coating System

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星期一, 四月 29, 2024
Hardware, Consumer Electronics, Technology, Other Manufacturing, Semiconductor, Science, Engineering, Chemicals, Plastics, Automotive Manufacturing, Other Technology, Aerospace, Other Science, Manufacturing, ESD, NFPA, Automation, Electronics, Multimedia, SMEMA, Fourth Industrial Revolution, CE, Printed circuit board

Nordson Electronics Solutions , a global leader in electronics manufacturing technologies, received the conformal coating equipment award from EM Asia China for the new ASYMTEK Select Coat® SL-1040 conformal coating system , at an award ceremony during Productronica China, held March 21 in the Shanghai New International Expo Centre, Shanghai, China.

Key Points: 
  • Nordson Electronics Solutions , a global leader in electronics manufacturing technologies, received the conformal coating equipment award from EM Asia China for the new ASYMTEK Select Coat® SL-1040 conformal coating system , at an award ceremony during Productronica China, held March 21 in the Shanghai New International Expo Centre, Shanghai, China.
  • View the full release here: https://www.businesswire.com/news/home/20240428107861/en/
    Nordson Electronics Solutions receives EM China Innovation award for the new ASYMTEK Select Coat® SL-1040 Conformal Coating System.
  • The award was accepted by Jacky He, automotive commercial head, Nordson Electronics Solutions, China at the Productronica China 2024 tradeshow.
  • The SL-1040 conformal coating system elevates coating performance with improved yield and uptime for automotive electronics reliability.

QP Technologies™ Achieves ANSI/ESD S20.20 Certification

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星期四, 四月 11, 2024
Shoe, Safety, Certification, ISO 9001:2015, ISO, ESD, QP, PPE, Personal protective equipment, American National Standards Institute, ANSI, Organization

Implementing documented processes for monitoring and control of ESD is vital to ensuring product quality.

Key Points: 
  • Implementing documented processes for monitoring and control of ESD is vital to ensuring product quality.
  • In January 2024, TÜV SÜD representatives performed an intensive audit of QP Technologies' manufacturing facility in Escondido, California.
  • The certifications team confirmed the ESD safety and compliance of QP Technologies’ IC packaging and microelectronic assembly line.
  • This latest certification comes on the heels of QP Technologies’ recent update of its ISO 9001:2015 and ISO 13485:2016 certifications through TÜV SÜD, exemplifying the company’s comprehensive commitment to quality and safety.

SOSV Closes $306M Deep Tech Fund for Human and Planetary Health

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星期二, 四月 16, 2024
Opentrons, Investment, Seed, BSL, AI, Doctor of Philosophy, Climate, Health, NotCo, Khosla Ventures, HAX, ESD, University, Female, Therapy, Pennsylvania Plaza, Dwight (The Walking Dead), Empire, Robotics, Drug discovery, Vertical, Empire State Development Corporation, Cryptocurrency

PRINCETON, N.J., April 16, 2024 /PRNewswire/ -- SOSV , a multi-stage deep tech venture investor, today announced the close of its $306 million SOSV V fund, the firm's largest fund to date.

Key Points: 
  • PRINCETON, N.J., April 16, 2024 /PRNewswire/ -- SOSV , a multi-stage deep tech venture investor, today announced the close of its $306 million SOSV V fund, the firm's largest fund to date.
  • SOSV V will focus on deep tech startups in human and planetary health, with an emphasis on the intertwined imperatives of decarbonization and re-industrialization—part of the fund's mandate to "reinvent the means of production"—even as SOSV continues to pioneer investments in health ranging from therapeutics to medical devices.
  • "As the first check in deep tech, SOSV represents the start of the journey for hundreds of deep tech founders," said Sean O'Sullivan, SOSV's founding and managing general partner.
  • Active deep tech co-investors in SOSV portfolio companies welcomed the SOSV V news.

Empire State Development Announces 10 Startups Selected For Round Seven of Luminate NY

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星期四, 三月 28, 2024
Assembly, Ecosystem, University, ESD, Luminate, Commercialization, Commissioner, Drug discovery, Communication, Empire State Development Corporation, City, Electronics, Research, Economic development, AI, Commerce, Behavior, Creativity, Distracted driving, Workforce, OPI, Artificial intelligence, Virtual reality, Renewable energy

ROCHESTER, N.Y., March 28, 2024 (GLOBE NEWSWIRE) -- Empire State Development (ESD) today announced the 10 companies selected to take part in round seven of the Luminate NY accelerator program, investment fund, and competition. A total of 137 applications from 25 different countries were received for consideration to participate in the world’s largest accelerator for startups working on industry-first solutions that are enabled by optics, photonics, and imaging (OPI). The companies were selected after pitching their innovative ideas and being scored by an advisory panel comprised of industry experts. Each finalist will receive an initial investment of $100,000 and will have the chance to compete for up to $2 million in follow-on funding upon completion of the accelerator program. The cohort will begin on April 8, 2024, and conclude in late September.

Key Points: 
  • The companies were selected after pitching their innovative ideas and being scored by an advisory panel comprised of industry experts.
  • Empire State Development President, CEO, and Commissioner, Hope Knight said, “Congratulations to the latest entrepreneurial companies selected to take part in Luminate NY’s seventh cohort.
  • State Senator Jeremy Cooney said, “I’m excited to congratulate the 10 new innovators taking part in the seventh round of the Luminate NY accelerator program.
  • I applaud Luminate NY for continuing to promote an important pathway for workforce and economic development by supporting and nurturing startup companies.”
    Monroe County Executive Adam Bello said, “Congratulations to the 10 startups selected for this round of Luminate NY.

Vishay Intertechnology Upgrades TFBS4xx and TFDU4xx Series IR Transceiver Modules With Longer Link Distance and Improved ESD Robustness

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星期三, 三月 13, 2024
Temperature, PIN, Infrared Data Association, IRDC, ESD, Communication, Life, VSH, PCB, SIR, Vishay Intertechnology

MALVERN, Pa., March 13, 2024 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has upgraded its TFBS4xx and TFDU4xx series of infrared (IR) transceiver modules for IrDA® applications to offer 20 % longer link distance and improved ESD robustness to 2 kV.

Key Points: 
  • MALVERN, Pa., March 13, 2024 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has upgraded its TFBS4xx and TFDU4xx series of infrared (IR) transceiver modules for IrDA® applications to offer 20 % longer link distance and improved ESD robustness to 2 kV.
  • Devices in the Vishay Semiconductors TFBS4xxx and TFDU4xxx series each consist of a PIN photodiode, infrared emitter (IRED), and low power control IC in a single package.
  • And as drop-in replacements for existing devices, the modules help save costs by eliminating the need for PCB redesigns.
  • Compliant with the latest IrDA physical layer specification, TFBS4xxx and TFDU4xxx series devices are backward-compatible and are offered in top- and side-view surface-mount packages.

Cleanroom Film & Bags Announces CFB CleanTronics Advanced Packaging for Semiconductors and Microelectronics

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星期二, 三月 26, 2024
Networks, Hardware, Electronic Design Automation, Consumer Electronics, Technology, Semiconductor, Packaging, Nanotechnology, Engineering, Chemicals, Plastics, Manufacturing, Telecommunications, ESD, IEST, Film, Electronics, CFB, Transport, Antistatic agent, NASA, Multimedia, ISO, Cleanroom, Silicon, Printed circuit board

Cleanroom Film and Bags (CFB), a division of C-P Flexible Packaging, has expanded its line of CFB CleanTronics Advanced Packaging for semiconductors, silicon wafers, microchips, printed circuit boards, motherboards, integrated circuits, microprocessors, fiber optics and other sensitive electronic components.

Key Points: 
  • Cleanroom Film and Bags (CFB), a division of C-P Flexible Packaging, has expanded its line of CFB CleanTronics Advanced Packaging for semiconductors, silicon wafers, microchips, printed circuit boards, motherboards, integrated circuits, microprocessors, fiber optics and other sensitive electronic components.
  • View the full release here: https://www.businesswire.com/news/home/20240326091962/en/
    CFB CleanTronics Advanced Packaging for semiconductors and microelectronics (Graphic: Business Wire)
    Having pioneered some of the first low outgassing films for electronics packaging, Cleanroom Film & Bags has over 35 years of experience paving the way in advanced packaging substrates and materials for semiconductors and microelectronics.
  • CFB CleanTronics Advanced Packaging can be manufactured to meet Level 50 or Level 100 IEST and NASA cleanliness specifications.
  • “Using exclusively American-made virgin resins and materials for CFB CleanTronics Advanced Packaging is one of the many ways we go above and beyond to provide unmatched quality.”
    To learn more about CFB CleanTronics Advanced Packaging, visit www.cleanroomfilm.com/electronic-packaging or contact [email protected] .

Stratasys to Test 3D-Printed Material Performance on Moon

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星期二, 三月 12, 2024
Research, Hardware, Robotics, Electronic Design Automation, Technology, Other Manufacturing, Satellite, Science, Engineering, Other Technology, Aerospace, Other Science, Manufacturing, Temperature, Radiation, ESD, FDM, Northrop Grumman, Travel, Electronics, Moon, 3D, Orion, Housing, Grumman, Part, Tungsten, Multimedia, Gamma, X-ray, Stratasys, 3D printing

Stratasys Ltd. (NASDAQ: SSYS), a leader in polymer 3D printing solutions, today announced that it will provide 3D-printed materials for an upcoming lunar mission to test their performance on the surface of the moon.

Key Points: 
  • Stratasys Ltd. (NASDAQ: SSYS), a leader in polymer 3D printing solutions, today announced that it will provide 3D-printed materials for an upcoming lunar mission to test their performance on the surface of the moon.
  • The SSTEF-1 project focuses on technology development for space infrastructure and capabilities for the moon and near-earth space.
  • (Photo: Business Wire)
    In this moon mission, Stratasys will provide 3D-printed samples that will be brought to the lunar surface by an unmanned lander in a carrier structure 3D-printed by Stratasys.
  • The first experiment assesses the performance of a sample coupon part made with Stratasys’ Antero® 800NA FDM® filament filled with tungsten.

HMI Introduces the Industry's Smallest Subscriber Identity Module (SIM) Card Level Translator

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星期四, 四月 4, 2024
ESD, RST, SIM, OEM, HMI, App Store (iOS/iPadOS), CLK, EMI, Mobile phone

CAMPBELL, Calif., April 4, 2024 /PRNewswire/ -- HMI, a leading provider of advanced analog and power management technologies, today announced the launch of its HL5301WL01, a SIM card level translator with level shifting and IEC610004-2 electrostatic charge protection for SIM card ports.

Key Points: 
  • CAMPBELL, Calif., April 4, 2024 /PRNewswire/ -- HMI, a leading provider of advanced analog and power management technologies, today announced the launch of its HL5301WL01, a SIM card level translator with level shifting and IEC610004-2 electrostatic charge protection for SIM card ports.
  • The HL5301WL01 integrates two unidirectional level shifters for the RST and CLK signals, a bidirectional level shifter for I/O, and ±8 kV electrostatic discharges (ESD) protection on all SIM card contacts.
  • Additionally, adhering to ISO-7816-3 standards, our device incorporates a shutdown feature for SIM card signals, ensuring compliance and optimized functionality.
  • Available in a WLCSP-9, 0.35 mm pitch, 1.12 mm x 1.12 mm, it's the industry's smallest SIM card level translator perfect for mobile applications, such as smartphones, tablet PCs, and wireless modems.