Socs

u-blox incorporates newest Nordic Semiconductor Bluetooth chips in two new compact modules

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星期三, 四月 10, 2024
Socs, Nordic Semiconductor, Communication, Health, Internet of things, Internet, MCU, Bluetooth Low Energy, Life, Radio, PCB, Machine learning, PSA, Printed circuit board

The modules are based on the latest generation nRF54 Series Systems-on-Chip (SoCs) from Nordic Semiconductor.

Key Points: 
  • The modules are based on the latest generation nRF54 Series Systems-on-Chip (SoCs) from Nordic Semiconductor.
  • They both support Bluetooth LE 5.4 and Thread/Matter technologies in a compact, power-efficient, and secure format.
  • With more than twice the processing power of previous Bluetooth LE modules, ALMA-B1 can even replace general-purpose MCUs in a compact solution.
  • u-blox (SIX:UBXN) provides semiconductor chips, modules, and IoT services that reliably locate and connect every thing.

Micron Debuts World’s First Quad-Port SSD to Accelerate Data-Rich Autonomous and AI-Enabled Vehicle Workloads

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星期二, 四月 9, 2024
IOV, Micrometre, Temperature, SLC, Socs, Vibration, SOC, Algorithm, Original equipment manufacturer, SSD, Shock, Embedded, DRAM, ADAS, AI, PCI Express, TLC, Micron Technology, VM, Telemetry, IVI, Architecture, OEM, VMS, Ecosystem, IOPS, Solid-state drive, Privacy, Map, Hacking, SR-IOV

The Micron 4150AT SSD combines market-leading features such as single-root input/output virtualization (SR-IOV), a PCIe® Generation 4 interface and ruggedized automotive design.

Key Points: 
  • The Micron 4150AT SSD combines market-leading features such as single-root input/output virtualization (SR-IOV), a PCIe® Generation 4 interface and ruggedized automotive design.
  • With these features, the automotive-grade SSD provides the ecosystem with data center-level flexibility and power.
  • This support for multi-host workloads is essential as today’s automotive SoCs increasingly use VMs to multitask across different functions, from autonomous driving to vehicle-to-vehicle communication.
  • The company is showcasing a demo of the SSD at Embedded World in Nuremberg, Germany from April 9-11 at booth 5-109.

AMD Extends Leadership Adaptive SoC Portfolio with New Versal Series Gen 2 Devices Delivering End-to-End Acceleration for AI-Driven Embedded Systems

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星期二, 四月 9, 2024
Logic, Socs, SOC, Documentation, Subaru, Health, Acceleration, Subaru Corporation, Library, Embedded, ADAS, AI, Software, Personal computer, UHD, Versal, Perception, Safety, AMD, Silicon, Medical device

NUREMBERG, Germany, April 09, 2024 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today announced the expansion of the AMD Versal™ adaptive system on chip (SoC) portfolio with the new Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 adaptive SoCs, which bring preprocessing, AI inference, and postprocessing together in a single device for end-to-end acceleration of AI-driven embedded systems.

Key Points: 
  • NUREMBERG, Germany, April 09, 2024 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today announced the expansion of the AMD Versal™ adaptive system on chip (SoC) portfolio with the new Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 adaptive SoCs, which bring preprocessing, AI inference, and postprocessing together in a single device for end-to-end acceleration of AI-driven embedded systems.
  • The AMD Versal Prime Series Gen 2 provides end-to-end acceleration for traditional, non-AI-based embedded systems by combining programmable logic for sensor processing with high-performance embedded Arm CPUs.
  • The Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 portfolios provide scalability from edge sensors to centralized compute for AI-driven systems.
  • Designers can get started with AMD Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 early access documentation and first-generation Versal evaluation kits and design tools available today.

Synaptics Astra™ AI-Native IoT Platform Launches with SL-Series Embedded Processors and Machina Foundation Series Development Kit

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星期一, 四月 8, 2024
Cortex, Arm, Speech, Socs, GM, Algorithm, GPU, Acceleration, Agriculture, Intelligence, Internet of things, Business, SAN, SVP, ARM Cortex-A55, Sale, AI, Human, Linux, NPU, CPU, Family, Android, Video game

SAN JOSE, Calif., April 08, 2024 (GLOBE NEWSWIRE) -- Synaptics® Incorporated (Nasdaq: SYNA ) today launched the Synaptics Astra platform with the SL-Series of embedded AI-native Internet of Things (IoT) processors and the Astra MachinaTM Foundation Series development kit.

Key Points: 
  • SAN JOSE, Calif., April 08, 2024 (GLOBE NEWSWIRE) -- Synaptics® Incorporated (Nasdaq: SYNA ) today launched the Synaptics Astra platform with the SL-Series of embedded AI-native Internet of Things (IoT) processors and the Astra MachinaTM Foundation Series development kit.
  • The family of embedded processors provides industry-leading compute capability at power-consumption levels that enable a wide range of consumer, enterprise, and industrial edge IoT applications.
  • The Astra Machina Foundation Series development kit supports the SL-Series.
  • The Astra Machina Foundation Series development kit will be available in Q2, 2024.

SANY Group and Ambarella Announce Strategic Cooperation to Accelerate Implementation of CV3-AD Domain Controller-Based Intelligent Driving Systems

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星期三, 四月 3, 2024
Sany, Socs, SOC, Face, BEV, SANY, Perception, Artificial intelligence, CV2, AI, Wenbo, Wang, NOA, Family, Engineering, Sales

During last week’s meeting to finalize this collaboration, Xiang Wenbo, rotating chairman of SANY Group, and chairman of SANY Heavy Industry, extended a warm welcome to the arrival of Fermi Wang, president and CEO of Ambarella.

Key Points: 
  • During last week’s meeting to finalize this collaboration, Xiang Wenbo, rotating chairman of SANY Group, and chairman of SANY Heavy Industry, extended a warm welcome to the arrival of Fermi Wang, president and CEO of Ambarella.
  • Xiang Wenbo, Rotating Chairman of SANY Group, and Chairman of SANY Heavy Industry
    Wang expressed that Ambarella’s strategic development direction aligns closely with that of SANY Group, particularly in terms of digitalization and decarbonization.
  • With a rich and comprehensive SoC product portfolio, Ambarella has demonstrated its capability across various fields of automotive intelligent driving.
  • This strategic cooperation also aims to address the labor shortages in engineering operations and lead the new trend of unmanned machine operations.

Ambiq Apollo510 Delivers 30x Power Efficiency Improvement to Unleash Endpoint AI

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星期二, 三月 26, 2024
Cortex, Arm, Health, Speech, Socs, SRAM, GM, GPU, VR, Hardware, Acceleration, Intelligence, Agriculture, Internet of things, Business, SVP, MCU, AI, Software, Human, TEE, Memory, ARM architecture family, Macs, TCM, OTP, SPOT, PUF, Family, MIP, NVM, Consumer electronics

AUSTIN, Texas, March 26, 2024 (GLOBE NEWSWIRE) -- Ambiq, a technology leader in exceptionally energy-efficient semiconductors for IoT devices, is introducing the new Apollo510, the first member of the Apollo5 SoC family, which is uniquely positioned to kickstart the age of truly ubiquitous, practical, and meaningful AI.

Key Points: 
  • The Apollo510 achieves up to 10x better latency while reducing energy consumption by around 2x, compared to Ambiq's previous power efficiency leader, the Apollo4.
  • With more than 30x energy improvement, the Apollo510 is capable of running a vast majority of today's endpoint AI calculations, including low-power sensor monitoring, always-on voice commands, telco-quality audio enhancement, and more.
  • Apollo510 contains everything needed for driving intelligent systems: ultra-efficient compute, expansive on-chip memories, high-bandwidth interfaces to off-chip memories, and security.
  • IoT endpoint device manufacturers can expect unrivaled power efficiency to develop more capable devices that process AI/ML functions better than before.

Imagination’s New Catapult CPU Is Driving RISC-V Device Adoption

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星期一, 四月 8, 2024
Consumer Electronics, Technology, Professional Services, Venture Capital, Security, Apps, Applications, Software, Artificial Intelligence, Networks, Hardware, Electronic Design Automation, Socs, SOC, GPU, QEMU, Growth, PowerVR, Environment, Partnership, Risk, Knowledge, Artificial intelligence, IDE, AI, Linux, Digital signage, Silicon, Imagination Technologies, Software development kit, Catapult, Visual Studio, Architecture, Computing, Lauterbach, Engineering, IP, Marketplace, CPU, Intellectual property, SDK, PPA, Central processing unit, Android, Video game

“One fifth of all consumer devices will have a RISC-V based CPU by the end of this decade.

Key Points: 
  • “One fifth of all consumer devices will have a RISC-V based CPU by the end of this decade.
  • Imagination is set to be a force in RISC-V with a strategy that prioritises quality and ease of adoption.
  • Now, any Visual Studio user can visit the Marketplace and install the Catapult extension into their regular development environment.
  • Its GPU, CPU, and AI technologies enable outstanding power, performance, and area (PPA), fast time-to-market, and lower total cost of ownership.

Ashling Announces Support for Altera’s Agilex™ 5 FPGA Family in their RiscFree™ SDK and Toolchain

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星期一, 四月 8, 2024
Software, Technology, Semiconductor, Apps, Applications, Cortex, Arm, Intel, Socs, A55, DSP, Linux, Partnership, Nios, ARM Cortex-A53, Quartus, SDK, Family, FPGA, Agilex, Video game

The Agilex 5 FPGA family with its dual-core A55 and dual-core A76 Arm processors, is optimized for high performance with lower power consumption.

Key Points: 
  • The Agilex 5 FPGA family with its dual-core A55 and dual-core A76 Arm processors, is optimized for high performance with lower power consumption.
  • It features enhanced DSP capabilities and an AI Tensor block, positioning it as a mid-range FPGA solution ideal for a wide range of applications.
  • Hugh O’Keeffe, CEO of Ashling, expressed enthusiasm about the ongoing collaboration: "As one of the premier Arm and RISC-V toolchain providers, we are delighted to extend our partnership with Altera by integrating support for the Agilex 5 FPGA family into our RiscFree toolchain.
  • As the embedded tools market continues to evolve, Ashling's RiscFree SDK and Toolchain stand out for their ease of use, broad functionality, and modular architecture.

Ceva Launches Multi-Protocol Wireless Platform IP Family to Accelerate Enhanced Connectivity in MCUs and SOCs for IoT and Smart Edge AI Applications

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星期一, 四月 8, 2024
UWB, Research, Socs, MLO, Original equipment manufacturer, Wi-Fi, Internet of things, Risk, Wireless, CEVA, RF, IEEE, OEM, IP, Ceva, Wi-Fi 6, Radar, Family, IPS, TSMC, Silicon, Consumer electronics

NUREMBERG, Germany, April 8, 2024 /PRNewswire/ -- Embedded World -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, today launched Ceva-Waves™ Links™, a new family of multi-protocol wireless platform IPs. The integrated offering supports the latest wireless standards to address the surging demand for connectivity-rich chips targeting Smart Edge devices in the consumer IoT, Industrial, automotive, and personal computing markets. These industry-leading IPs include Wi-Fi, Bluetooth, Ultra-Wideband (UWB), and IEEE 802.15.4 (for Thread / Zigbee / Matter), to offer a range of qualified, easy-to-integrate, multi-protocol wireless communications subsystems, each featuring optimized co-existence schemes and adapted to various radios and configurations.

Key Points: 
  • The integrated offering supports the latest wireless standards to address the surging demand for connectivity-rich chips targeting Smart Edge devices in the consumer IoT, Industrial, automotive, and personal computing markets.
  • The Links™ family leverages the newly rebranded Ceva-Waves portfolio of wireless connectivity IPs, formerly known as RivieraWaves.
  • The demand for smaller, low-cost, high-performing, innovative devices with versatile connectivity is driving the need to consolidate multiple connectivity protocols in a single chip.
  • "Increasingly, wireless connectivity chips are required to handle multiple standards to meet the evolving needs and diverse use cases of consumer and industrial devices.

Seven Years of Uninterrupted Growth: Andes Technology Achieves Milestone Annual Revenue Exceeding NT$1 Billion

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星期四, 三月 21, 2024
Socs, SOC, Ecosystem, Growth, Artificial intelligence of things, Internet of things, HPC, AI, IPO, Field-programmable gate array, RVI, D23, Safety, OOO, Andes Technology, ISO, CPU, Video game

Andes has invested capital and R&D manpower to accelerate the launch of high-end products to ensure long-term competitiveness and maintain market leadership.

Key Points: 
  • Andes has invested capital and R&D manpower to accelerate the launch of high-end products to ensure long-term competitiveness and maintain market leadership.
  • In 2023, even when the whole industry was still under inventory pressure, Andes surpassed a significant total shipment milestone of 14 billion Andes-Embedded™ SoCs.
  • In 2023, the diverse product portfolio offered by Andes has resonated exceptionally well with the market and enabled its sustained growth.
  • More recently, Andes ventured into the application processor market with the launch of its cutting-edge out-of-order (OOO) processor AX65.