MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family
This configuration is targeted at AOC or similar die-to-printed circuit board (PCB) applications, gold-box packaging, and CoC in fixture.
- This configuration is targeted at AOC or similar die-to-printed circuit board (PCB) applications, gold-box packaging, and CoC in fixture.
- "This is another demonstration of MRSI's commitment to provide critical solutions promptly in response to our customers' needs," concluded Mr. Michael Chalsen, President of MRSI Systems.
- The MRSI-HVM3 product family delivers industry-leading speed, future-proof high precision (
- Dr. Yi Qian Vice President of Product Management, MRSI Systems
Tobias Blow Director IR & Corporate Communications, Mycronic
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