MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
Combining both, MRSI-H3LD demonstrates the highest throughput in industry for the high power diode laser die bonding.
- Combining both, MRSI-H3LD demonstrates the highest throughput in industry for the high power diode laser die bonding.
- It enables our high power diode laser and other photonics customers to scale up their business," said Dr. Yi Qian, Vice President of Product Management of MRSI Systems.
- "MRSI Systems is pleased to offer the new MRSI-H3LD product for fast growing markets using high power diode lasers.
- The precision is achieved without sacrificing high speed or flexibility and helps high power diode laser manufacturing to achieve smaller offset between the front facets of laser diode and the front end surface of the submount.