Retrieved on:
Wednesday, March 20, 2024
Obstruction,
Growth,
IC,
Real-time,
RTK,
Transport,
AI,
Senior,
Robotics,
EFLS,
Artificial intelligence,
Surveying It has crafted chips equipped with centimeter-level high precision RTK (Real Time Kinematic) satellite positioning capabilities that have been widely used in commercial applications.
Key Points:
- It has crafted chips equipped with centimeter-level high precision RTK (Real Time Kinematic) satellite positioning capabilities that have been widely used in commercial applications.
- The AI satellite positioning chip, AG3335A, was the first to be adopted by the global robotics giant Segway two years ago.
- Segway incorporated Airoha Technology's dual-frequency, multi-constellation satellite positioning chips, leveraging the AG3335A's precise AI satellite positioning capabilities.
- Airoha Technology's Senior Vice President, Yang Yuquan, expressed: "Airoha Technology is committed to consistently providing IC chips and services featuring 'AI satellite positioning' to a global clientele across diverse sectors.
Retrieved on:
Tuesday, January 23, 2024
Constellation,
Weather,
MediaTek,
Quasi-Zenith Satellite System,
ISO,
HTS,
Artificial intelligence,
GPS,
Temperature,
Artificial intelligence of things,
QZSS,
Navigation,
The Co-operators,
Risk,
Galileo Galilei,
Safety,
Satellite navigation,
DBm,
Certification,
GNSS,
AEC,
PTC,
Satellite navigation device In the standard declaration process, Airoha Technology's AG3335MA series chips have obtained AEC-Q100 certification conducted by a third-party quality management system with an automotive specification laboratory.
Key Points:
- In the standard declaration process, Airoha Technology's AG3335MA series chips have obtained AEC-Q100 certification conducted by a third-party quality management system with an automotive specification laboratory.
- The AG3335MA series chips have achieved certification at the Grade 2, covering a temperature range from -40 to 105 degrees Celsius for reliability testing.
- This chip series can operate reliably in extreme environments, ranging from -40 to 105 degrees Celsius.
- "Airoha Technology's automotive GNSS chip series not only complies with AEC-Q100 standards but has also been designed-in by several key customers."
Retrieved on:
Tuesday, December 5, 2023
Socs,
Software development kit,
Laptop,
SDK,
Engineering,
Phonation,
Multimedia,
Algorithm,
Intel,
ANC,
Third party,
Active noise control,
ICS,
Consumer electronics,
Music,
Cassette tape,
Video game HSINCHU, Dec. 4, 2023 /PRNewswire/ -- Airoha Technology, one of the world's top 3 designers of Bluetooth® audio ICs, announces that AIROHA's SoCs and Software Development Kit (SDK) for Bluetooth® LE Audio devices have collaborated with Intel's Engineered for Intel® Evo™ laptop accessory program, the first of its kind in the Bluetooth® audio industry.
Key Points:
- Committed to providing a great Bluetooth® audio quality and user experience, AIROHA's collaboration with Intel will help audio devices achieve the highest level of Bluetooth® LE Audio compatibility between headset and laptop.
- This will increase the likelihood that future vendor audio devices can more easily meet Intel's strict experience requirements and gain acceptance into the Engineered for Intel® Evo™ laptop accessory program.
- AIROHA's 20 years of experience in Bluetooth® audio technology innovation accelerates our customers' product time-to-market and reduces maintenance costs.
- The Engineered for Intel® Evo™ laptop accessory program extends the Intel® Evo™ laptop experience to include accessories.
Retrieved on:
Tuesday, October 11, 2022
Adoption,
GPON,
OLT,
DOCSIS,
GM,
IOT,
Technology,
Royal commission,
SOC,
Coaxial,
IC,
Optical line termination,
PON,
Digital subscriber line,
Partnership,
Thread,
Software,
Goal,
Bluetooth,
Tier 1,
Telemetry,
Industry,
Passive optical network,
CPE,
Ecosystem,
Wi-Fi,
EC,
European Commission,
DNS,
Digital,
Solution,
RDK,
Engineering,
MediaTek,
Video game console,
Cable television,
Internet service provider,
Broadband,
Zigbee HSINCHU, Oct. 11, 2022 /PRNewswire/ -- Taiwan's premier IC design house, Airoha Technology, a subsidiary of IC giant MediaTek, announced today that it had started to deliver to its customers a Broadband System-on-Chip (SOC) solution powered by RDK-B, an open-source platform that standardizes key functions of customer premise equipment (CPE).
Key Points:
- AIROHA's RDK-B GPON SoC solution has been adopted by several 1st tier European broadband network operators and has helped them migrate to PON smoothly together with their legacy DOCSIS assets.
- In past decades, Europe's broadband networks have relied heavily on xDSL or Coaxial cables, which are both essentially copper lines with varied technologies.
- Although the latest versions of DOCSIS standards include support for PON, the coaxial cable, due to its physical constraints, cannot match the speed of fiber connections.
- AIROHA has helped several Tier 1 cable operators in Western Europe deploy RDK-B powered chipsets to upgrade to fiber quickly and smoothly.
Federal,
Digital subscriber line,
Maintenance,
FCC,
Solution,
IOT,
Face,
SOC,
Software,
Technology,
Compliance,
Engineering,
Lists of currently active military equipment by country,
COVID-19,
IC,
Federal Communications Commission,
AR,
GPON,
PON,
Federation,
VR,
Data-rate units,
WFH,
CPE,
Internet service provider,
Video game console,
Mobile phone,
Metaverse,
MediaTek,
Speedtest.net,
Work,
Broadband The most critical and difficult part about the U.S. 8 Gbps XGS-PON deployments is to achieve low latency under 3ms as tested against Speedtest standards.
Key Points:
- The most critical and difficult part about the U.S. 8 Gbps XGS-PON deployments is to achieve low latency under 3ms as tested against Speedtest standards.
- AIROHA is able to provide the compatibility and interoperability needed for broadband services with supports for various exiting devices from different vendors.
- AIROHA fully understands the pain points telecom operators and network operators would face in PON transformation.
- AIROHA has a broad customer base including most notable brands in the aforesaid market areas.
Algorithm,
R,
LE,
MediaTek,
Imagination,
Ethernet,
DSP,
Multimedia,
Software development kit,
Technology,
LC3,
Bluetooth Low Energy,
SDK,
TWS,
Engineering,
AI,
SBC,
Mobile phone,
Bluetooth,
Broadband HSINCHU, July 26, 2022 /PRNewswire/ -- Airoha Technology today announced that its new series of Bluetooth audio chips have successfully completed the latest Bluetooth® Low Energy Audio Qualification Process. This is one of the most important R&D achievements of its Bluetooth audio R&D team consisted of hundreds of engineers, who continues to revolutionize the wireless audio end device market. The "flagship" and "professional" series of chipsets support LE audio and Bluetooth 5.3 for multiple applications such as True Wireless Stereo (TWS) earbuds, Bluetooth smart speakers, assistive listening devices, and Bluetooth transmitters. The products are currently being tested by many brand customers and are expected to be available worldwide in the first half of 2023.
Key Points:
- HSINCHU, July 26, 2022 /PRNewswire/ -- Airoha Technology today announced that its new series of Bluetooth audio chips have successfully completed the latest Bluetooth Low Energy Audio Qualification Process.
- The "flagship" and "professional" series of chipsets support LE audio and Bluetooth 5.3 for multiple applications such as True Wireless Stereo (TWS) earbuds, Bluetoothsmart speakers, assistive listening devices, and Bluetooth transmitters.
- After 10 Years of technology investment, Airoha Revolutionizes the Global Bluetooth Audio Market
"The LE Audio specifications are the most important milestone reached in the Bluetooth audio industry in the past decade.
- According to the Bluetooth SIG, the LC3 codec introduced by LE Audio can transmit audio at half the bitrate of traditional SBC without compromising sound quality.
Algorithm,
R,
LE,
MediaTek,
Imagination,
Ethernet,
DSP,
Software development kit,
Technology,
LC3,
Bluetooth Low Energy,
SDK,
TWS,
Engineering,
AI,
SBC,
Mobile phone,
Bluetooth,
Broadband HSINCHU, Taiwan, July 26, 2022 /PRNewswire/ -- Airoha Technology today announced that its new series of Bluetooth audio chips have successfully completed the latest Bluetooth® Low Energy Audio Qualification Process. This is one of the most important R&D achievements of its Bluetooth audio R&D team consisted of hundreds of engineers, who continues to revolutionize the wireless audio end device market. The "flagship" and "professional" series of chipsets support LE audio and Bluetooth 5.3 for multiple applications such as True Wireless Stereo (TWS) earbuds, Bluetooth smart speakers, assistive listening devices, and Bluetooth transmitters. The products are currently being tested by many brand customers and are expected to be available worldwide in the first half of 2023.
Key Points:
- HSINCHU, Taiwan, July 26, 2022 /PRNewswire/ -- Airoha Technology today announced that its new series of Bluetooth audio chips have successfully completed the latest Bluetooth Low Energy Audio Qualification Process.
- The "flagship" and "professional" series of chipsets support LE audio and Bluetooth 5.3 for multiple applications such as True Wireless Stereo (TWS) earbuds, Bluetoothsmart speakers, assistive listening devices, and Bluetooth transmitters.
- After 10 Years of technology investment, Airoha Revolutionizes the Global Bluetooth Audio Market
"The LE Audio specifications are the most important milestone reached in the Bluetooth audio industry in the past decade.
- According to the Bluetooth SIG, the LC3 codec introduced by LE Audio can transmit audio at half the bitrate of traditional SBC without compromising sound quality.
