Bluetooth Low Energy

u-blox incorporates newest Nordic Semiconductor Bluetooth chips in two new compact modules

Retrieved on: 
Wednesday, April 10, 2024
Socs, Nordic Semiconductor, Communication, Health, Internet of things, Internet, MCU, Bluetooth Low Energy, Life, Radio, PCB, Machine learning, PSA, Printed circuit board

The modules are based on the latest generation nRF54 Series Systems-on-Chip (SoCs) from Nordic Semiconductor.

Key Points: 
  • The modules are based on the latest generation nRF54 Series Systems-on-Chip (SoCs) from Nordic Semiconductor.
  • They both support Bluetooth LE 5.4 and Thread/Matter technologies in a compact, power-efficient, and secure format.
  • With more than twice the processing power of previous Bluetooth LE modules, ALMA-B1 can even replace general-purpose MCUs in a compact solution.
  • u-blox (SIX:UBXN) provides semiconductor chips, modules, and IoT services that reliably locate and connect every thing.

GigaDevice Showcases Cutting-Edge Industry Solutions at Embedded World 2024

Retrieved on: 
Tuesday, April 9, 2024
DFU, GD32, Logic, Azure, GigaDevice, OTA, DSP, SOC, Hall, BLDC, Internet of things, SPI, Embedded, GUI, Voice recognition, MCU, LDO, AI, Bluetooth Low Energy, Power management, PWM, Synaptic, AWS, High-pass filter, Sensory, Flash, Wi-Fi 6, Sensor, Booth, FPU, QT, Octal, Ecosystem, HMI, FPGA, Video game

NUREMBERG, Germany, April 09, 2024 (GLOBE NEWSWIRE) -- GigaDevice , a leading semiconductor company specializing in Flash Memory , 32-bit Microcontrollers (MCUs) , Sensors , and Power Management technologies , is poised to showcase its comprehensive product lineup at the Embedded World 2024 event held in Nuremberg, Germany from April 9th to 11th.

Key Points: 
  • NUREMBERG, Germany, April 09, 2024 (GLOBE NEWSWIRE) -- GigaDevice , a leading semiconductor company specializing in Flash Memory , 32-bit Microcontrollers (MCUs) , Sensors , and Power Management technologies , is poised to showcase its comprehensive product lineup at the Embedded World 2024 event held in Nuremberg, Germany from April 9th to 11th.
  • They offer a comprehensive software and hardware security solution to meet the industrial markets’ demand for high reliability and security applications.
  • We are thrilled to highlight our GD32 collaborative efforts with industry partners, such as QT , Embedded Wizard , and Sensory .
  • Come and visit GigaDevice at Hall 5-129 in person, and join our conference presentations:

VeriSilicon Showcased Its Latest Power-Efficient IP Applications at Embedded World 2024

Retrieved on: 
Tuesday, April 9, 2024
Telecommunications, Electronic Design Automation, Artificial Intelligence, Data Management, Consumer Electronics, Technology, IOT (Internet of Things), Semiconductor, Dai, Consumer electronics, BLE, IPS, Speech, Machine learning, GM, DSP, Bluetooth Low Energy, GPU, Drone, Internet of things, ISP, GUI, Embedded, Internet, Image, Smart camera, Silicon, Embedded system, Electronics, Home automation, Data center, Digital signal, Automotive Electronics Council, IP, NPU, Perception, VPU, Smart device, GPGPU, Central processing unit, Artificial intelligence, Hall, Video game

VeriSilicon (688521.SH) today announced its demonstration at Embedded World 2024 in Nuremberg, Germany, booth numbered Hall 4A-518, where it is showcasing customers’ various leading products leveraging the company’s latest technologies and advanced solutions.

Key Points: 
  • VeriSilicon (688521.SH) today announced its demonstration at Embedded World 2024 in Nuremberg, Germany, booth numbered Hall 4A-518, where it is showcasing customers’ various leading products leveraging the company’s latest technologies and advanced solutions.
  • IoT: VeriSilicon’s LE Audio compliant complete Bluetooth Low Energy IP solution, LE Mesh system solution based on VeriSilicon’s BLE technology.
  • Among the top ten IP companies globally, VeriSilicon’s number of IP categories ranks top two2.
  • “We are thrilled to present our latest and innovative IP solutions at Embedded World 2024.

Identiv Highlights Excellence in Specialty IoT Solutions at RFID Journal LIVE! 2024

Retrieved on: 
Tuesday, April 9, 2024
IOT (Internet of Things), Security, Data Management, Technology, Software, RFID, BLE, GM, Bluetooth Low Energy, EVP, Internet of things, Wiliot, LIVE, Exhibition, RFID Journal, Ecosystem, Data management, Engineering

Identiv, Inc. (NASDAQ: INVE), Internet of Things (IoT) technology leader and innovator, announced that its IoT team will showcase their latest RFID-enabled specialty IoT solutions at RFID Journal LIVE!

Key Points: 
  • Identiv, Inc. (NASDAQ: INVE), Internet of Things (IoT) technology leader and innovator, announced that its IoT team will showcase their latest RFID-enabled specialty IoT solutions at RFID Journal LIVE!
  • Identiv continues to drive innovation, deliver excellence, and shape the future of IoT.
  • The Identiv IoT team is excited to invite customers, partners, and investors to RFID Journal LIVE!
  • “We are privileged to continue innovating best in class specialty IoT solutions and excited to have the opportunity to showcase them at this year’s RFID Journal LIVE!,” said Amir Khoshniyati, EVP/GM of Identiv IoT.

Alif Semiconductor Announces World's First BLE and Matter Wireless Microcontroller to Feature Neural Co-Processor for AI/ML Workloads

Retrieved on: 
Tuesday, April 9, 2024
Cortex, Arm, LPA, BLE, Machine learning, Logic, LC3, Algorithm, DSP, HPA, WLCSP, Acceleration, Memory, Business, ARM Cortex-M, MCU, AI accelerator, Bluetooth Low Energy, Spacecraft, Senior, TWS, Architecture, Radio, DAC, NPU, TCM, GOPS, Family, MVE, Artificial intelligence, EEMBC, Lethargy, Video game

PLEASANTON, Calif., April 9, 2024 /PRNewswire/ -- Alif Semiconductor®, a leading global supplier of secure, connected, power efficient Artificial Intelligence and Machine Learning (AI/ML) microcontrollers (MCUs) and fusion processors, today announced the launch of the BallettoTM family, the world's first Bluetooth® Low Energy (BLE) wireless microcontroller to feature hardware optimization for AI/ML workloads.

Key Points: 
  • The Balletto family offers particularly strong performance in audio and sensor functions thanks to its excellent DSP and AI/ML capabilities and large on-die memory.
  • Neural network processing performance is up to 15x better than a Cortex-M4 processor can achieve.
  • Balletto includes the state-of-the-art multi-layered security fabric first introduced in Alif Semiconductors' Ensemble family of MCUs and fusion processors.
  • "Alif Semiconductor's Balletto family is targeting BLE challenges faced by the wireless audio and smart home industry today with a platform adapted to high bit-rate audio and the Matter ecosystem," said Reza Kazerounian, President and Co-Founder of Alif Semiconductor.

Alif Semiconductor Announces World's First BLE and Matter Wireless Microcontroller to Feature Neural Co-Processor for AI/ML Workloads

Retrieved on: 
Tuesday, April 9, 2024
Cortex, Arm, LPA, BLE, Machine learning, Logic, LC3, Algorithm, DSP, HPA, WLCSP, Acceleration, Memory, Business, ARM Cortex-M, MCU, AI accelerator, Bluetooth Low Energy, Spacecraft, Senior, TWS, Architecture, Radio, DAC, NPU, TCM, GOPS, Family, MVE, Artificial intelligence, EEMBC, Lethargy, Video game

PLEASANTON, Calif., April 9, 2024 /PRNewswire/ -- Alif Semiconductor®, a leading global supplier of secure, connected, power efficient Artificial Intelligence and Machine Learning (AI/ML) microcontrollers (MCUs) and fusion processors, today announced the launch of the BallettoTM family, the world's first Bluetooth® Low Energy (BLE) wireless microcontroller to feature hardware optimization for AI/ML workloads.

Key Points: 
  • The Balletto family offers particularly strong performance in audio and sensor functions thanks to its excellent DSP and AI/ML capabilities and large on-die memory.
  • Neural network processing performance is up to 15x better than a Cortex-M4 processor can achieve.
  • Balletto includes the state-of-the-art multi-layered security fabric first introduced in Alif Semiconductors' Ensemble family of MCUs and fusion processors.
  • "Alif Semiconductor's Balletto family is targeting BLE challenges faced by the wireless audio and smart home industry today with a platform adapted to high bit-rate audio and the Matter ecosystem," said Reza Kazerounian, President and Co-Founder of Alif Semiconductor.

Revolutionizing Connectivity: Ezurio introduces wide portfolio of new Wireless and System on Modules product ranges in collaboration with Texas Instruments

Retrieved on: 
Tuesday, April 9, 2024
TI, SDIO, Original equipment manufacturer, Wi-Fi, Internet of things, UART, Software, Bluetooth Low Energy, Texas Instruments, SMT, Semiconductor, SOM, Silicon, Mobile phone

AKRON, Ohio, April 9, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces new product portfolios leveraging embedded processing products from Texas Instruments (TI), the global semiconductor leader known for its design, manufacture and test of analog and embedded semiconductors that are the essential building blocks of electronic systems.

Key Points: 
  • Ezurio will introduce its first new TI based product range the Sona™ TI351 family, which is a Wi-Fi 6 & Bluetooth 5.4 wireless module offering based on TI's SimpleLink™ CC33x1 Wi-Fi portfolio.
  • This solution becomes a key wireless enabler to Ezurio's next portfolio of System-on-Modules (SOM) – the Carbon series.
  • Additionally, this SOM line incorporates TI analog and power components, showcasing a synergy of Ezurio design and development capabilities and TI Semiconductors resources.
  • The close collaboration with TI will offer next-generation solutions that not only enhance connectivity and performance but also significantly simplify the development process for OEMs and product innovators.

Silicon Labs xG26 Sets New Standard in Multiprotocol Wireless Device Performance

Retrieved on: 
Tuesday, April 9, 2024
Silicon Labs, Attention, SOC, Algorithm, Bluetooth Low Energy, GPIO, Bluetooth mesh networking, Acceleration, Intelligence, Internet of things, Network layer, Wireless, Internet, Sleep, ARM, Running, RAM, Silicon, Home, ARM architecture family, Radio, MG26, CCTV, CPU, Machine learning, Family, Matter, Code, Bluetooth, Video game

AUSTIN, Texas, April 9, 2024 /PRNewswire/ -- Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, today announced their new xG26 family of Wireless SoCs and MCUs, the IoT industry leader's highest performance device family to date. The new family consists of the multiprotocol MG26 SoC, the Bluetooth LE BG26 SoC, and the PG26 MCU. All three are designed to future-proof the IoT against some of the most demanding emerging applications, like Matter, with double the Flash and RAM of other Silicon Labs multiprotocol devices.

Key Points: 
  • All three are designed to future-proof the IoT against some of the most demanding emerging applications, like Matter , with double the Flash and RAM of other Silicon Labs multiprotocol devices.
  • That's Matter's interoperability and security promise, which is why Silicon Labs designed the MG26 to be the most advanced SoC for the Matter standard.
  • Pin compatibility between select xG26 and xG24 devices and shared hardware and software development tools like Silicon Labs Simplicity Studios allows for easy development and seamless migration from other Silicon Labs Series 2 devices.
  • Learn more about how to begin developing cutting-edge IoT devices using Silicon Labs, be sure to :

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

Retrieved on: 
Thursday, March 28, 2024
Hardware, IOT (Internet of Things), Semiconductor, Electronic Design Automation, Security, Consumer Electronics, Technology, Audio, Video, Apps, Applications, Wearables, Mobile Technology, Other Technology, Telecommunications, Networks, VoIP, Internet, Mobile, Wireless, Cortex, Arm, BLE, Certification, LC3, DSP, Bluetooth Low Energy, Internet of things, RF, Senior, DSPS, TWS, IP, ARM Cortex-M, Bluetooth Special Interest Group, CPU, IPS, Digital signal, Consumer electronics

VeriSilicon (688521.SH) today announced its complete Bluetooth Low Energy (BLE) IP solution has achieved full compliance with LE Audio specification, including certifications for the LE Audio protocol stack and Low Complexity Communications Codec (LC3).

Key Points: 
  • VeriSilicon (688521.SH) today announced its complete Bluetooth Low Energy (BLE) IP solution has achieved full compliance with LE Audio specification, including certifications for the LE Audio protocol stack and Low Complexity Communications Codec (LC3).
  • LE Audio is the new Bluetooth audio technology standard introduced by Bluetooth SIG based on Bluetooth 5.2 and above specifications, aiming to deliver a higher quality audio experience.
  • VeriSilicon’s complete BLE IP solution includes RF IP, baseband IP, software protocol stack, and has already passed the Bluetooth 5.3 certification.
  • Moreover, the solution also supports innovative Bluetooth capabilities of LE Audio such as Auracast™ broadcast audio and Multi-Stream Audio.

Hyundai Reveals Smarter, More Capable 2025 Tucson SUV at New York International Auto Show

Retrieved on: 
Wednesday, March 27, 2024
XRT, Temperature, Friends, EV, Ultra-wideband, OTA, Bluetooth Low Energy, International Auto Show, Humanity, Digital, SUV, Peter Hancock (professor), LTE, Snow, Gasoline, Acceleration, Hyundai Motor America, Humidity, Hyundai Motor Company, AWD, Wi-Fi, N Line, ECU, HVAC, AC, Radio, Safety, Torque, FAW, Pet, Multimedia, Family, HUD, Android, PHEV, Weather

Innovative new convenience and safety features, including Baby Mode

Key Points: 
  • Innovative new convenience and safety features, including Baby Mode
    NEW YORK, March 27, 2024 /PRNewswire/ -- Hyundai today unveiled its thoroughly refreshed 2025 Tucson SUV in a North American reveal at the New York International Auto Show.
  • 2025 Tucson 2.5L models will arrive at U.S. dealerships in June, while 1.6L turbo hybrid and plug-in hybrid models will be available late summer.
  • The 2025 Tucson presents an evocative, bold appearance with 'Parametric Dynamics' design language and kinetic, jewel-like surface detailing that ensures its distinct identity in today's crowded SUV marketplace.
  • For 2025, Wireless Android Auto™ and Apple CarPlay® integration are now standard on all Tucson models.