Electronic engineering

Altium Launches Altium Designer 19 Enabling Easy, Powerful Design for Complex Projects

Retrieved on: 
Tuesday, December 18, 2018
Electronic engineering, Electromagnetism, Electrical engineering, Altium Designer, Altium, Mentor Graphics, Printed circuit board, CircuitMaker

Altium Designer 19 introduces new features that make designing complex, high-quality projects easier, faster, and more accurate from concept to production.

Key Points: 
  • Altium Designer 19 introduces new features that make designing complex, high-quality projects easier, faster, and more accurate from concept to production.
  • Altium Designer 19 expands on Altium Designer 18 with new and powerful design technologies that simplify the process of creating even the most complex designs and bring unparalleled unification to the schematic, layout, and post-design processes.
  • "Altium Designer 19 builds on the consistent performance and reliability improvements of previous versions with modern PCB design tools that are powerful, easy, and modern," said Sergey Kostinsky, Chief Technology Officer at Altium.
  • "Altium Designer 19 users will also be able to access a convenient and connected design experience that keeps everyone in sync through seamless connectivity with Altium 365."

Dana Earns Automotive Innovation Technology Award for Hybrid and Electric Vehicle Thermal-Management Technology

Retrieved on: 
Tuesday, December 18, 2018
Electrical engineering, Power electronics, Dana Incorporated, Semiconductor devices, Electromagnetism, Electronic engineering, Bipolar, Transistor, PACE Award, Insulated-gate bipolar transistor

MAUMEE, Ohio, Dec. 18, 2018 /PRNewswire/ --Dana Incorporated (NYSE: DAN) received an Automotive Innovation Technology Award for its LongThermaTEK insulated-gate bipolar transistor (IGBT) cooling solutions during the 11th International Automotive Congress in Shanghai, China.

Key Points: 
  • MAUMEE, Ohio, Dec. 18, 2018 /PRNewswire/ --Dana Incorporated (NYSE: DAN) received an Automotive Innovation Technology Award for its LongThermaTEK insulated-gate bipolar transistor (IGBT) cooling solutions during the 11th International Automotive Congress in Shanghai, China.
  • The award recognizes Dana's achievement of high standards in creating and promoting advanced technologies that improve the performance of automotive applications.
  • "Earning this award is a testament to our superior thermal-management expertise and strong focus on supplying cutting-edge technologies for electric and hybrid vehicles," said Dwayne Matthews, president of Dana Power Technologies.
  • Dana's two-sided chip cooling technology also was recognized in 2016 as an Automotive News PACE Award finalist.

Automotive Integrated Circuit Market by Type and Application - Global Opportunity Analysis and Industry Forecast, 2018-2025

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Monday, December 17, 2018
Electromagnetism, Electronic engineering, Electronics, Electronic circuits, Hybrid integrated circuit, Integrated circuit, Printed electronic circuit

Automotive Integrated Circuit (ICs) Market by Type (Monolithic Integrated Circuits and Hybrid Integrated Circuits) and Application (Advance Driver Assistance System, In-vehicle Networking, Engine Management, Transmission Control System, and Others) - Global Opportunity Analysis and Industry Forecast, 2018-2025

Key Points: 
  • Automotive Integrated Circuit (ICs) Market by Type (Monolithic Integrated Circuits and Hybrid Integrated Circuits) and Application (Advance Driver Assistance System, In-vehicle Networking, Engine Management, Transmission Control System, and Others) - Global Opportunity Analysis and Industry Forecast, 2018-2025
    Integrated circuit (IC) is a semiconductor device, which contains resistors, capacitors, and transistors.
  • The global automotive IC market registered a significant growth corresponding to the increase in vehicle production globally.
  • Depending on type, the market is fragmented into monolithic integrated circuits and hybrid or multichip integrated circuits.
  • Porter's five forces analysis illustrates the potency of the buyers and suppliers in the global industry.

Semiconductor Intellectual Property (IP) Market Worth $ 6.5 Billion by 2024 - Exclusive Report by MarketsandMarkets™

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Monday, December 17, 2018
Electronic engineering, Digital electronics, Technology, Microprocessors, Electronic design automation, Logic design, Semiconductor device fabrication, Semiconductor intellectual property core, Multi-core processor, Microcontroller, EnSilica, Communications Processor Module

According to the new market research report " Semiconductor Intellectual Property (IP) Market by Design IP (Processor IP, Interface IP, Memory IP), IP Source (Royalty & Licensing), Vertical (Consumer Electronics, Telecom, Industrial, Automotive, Commercial), and Region - Global Forecast to 2024", published by MarketsandMarkets, the market is expected to grow from USD 4.9 billion in 2018 to USD 6.5 billion by 2024, at a CAGR of 4.78%.

Key Points: 
  • According to the new market research report " Semiconductor Intellectual Property (IP) Market by Design IP (Processor IP, Interface IP, Memory IP), IP Source (Royalty & Licensing), Vertical (Consumer Electronics, Telecom, Industrial, Automotive, Commercial), and Region - Global Forecast to 2024", published by MarketsandMarkets, the market is expected to grow from USD 4.9 billion in 2018 to USD 6.5 billion by 2024, at a CAGR of 4.78%.
  • Major factors driving the semiconductor IP market include advancement in multicore technology for consumer electronics sector and increasing demand for modern SoC designs.
  • The semiconductor IP market has been segmented on the basis of design into 3 categories: Processor IP, Interface IP, and Memory IP.
  • Among all IP designs, processor IP holds the largest size of the semiconductor IP market; processor IPs include microprocessor unit (MPU), microcontroller unit (MCU), and digital signal processor (DSP).

MagnaChip Launches Low Noise, Low Power Consumption, Fast Transient LDO Regulator for BGA SSD Used in Mobile Devices

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Monday, December 17, 2018
Computer data storage, Electronic engineering, Computing, Non-volatile memory, Computer memory, Computer storage devices, Solid-state drive, Integrated circuits, ARM architecture, Low-dropout regulator, Ball grid array, Ice

A BGA SSD refers to an SSD that integrates an SSD controller anda memory chip, such as DRAM and NAND flash, into a Ball Grid Array package.

Key Points: 
  • A BGA SSD refers to an SSD that integrates an SSD controller anda memory chip, such as DRAM and NAND flash, into a Ball Grid Array package.
  • It is about 60 percent smaller than a non-BGA SSD in size and, therefore, mainly used in mobile devices such as notebookPCs, tabletsPCs and smartphones.
  • "We are pleased to launch our new LDO regulator with low noise, low power consumption and fast transient response."
  • The introduction of this LDO regulator will further expand our power IC standard product portfolio for mobile devices."

Eltek Sets Earnings Release Date and Conference Call to Report Third Quarter 2018 Results on December 20, 2018

Retrieved on: 
Monday, December 17, 2018
Pollution, Electromagnetism, Electronic engineering, Electronics manufacturing, Monsanto, Polychlorinated biphenyl, Eltek, Printed circuit board, Flex

Eltek - 'Innovation Across the Board', is a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), and is the Israeli leader in this industry.

Key Points: 
  • Eltek - 'Innovation Across the Board', is a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), and is the Israeli leader in this industry.
  • Eltek specializes in the manufacture and supply of complex and high quality PCBs, HDI, multilayered and flex-rigid boards for the high-end market.
  • Its customers include leading companies in the defense, aerospace and medical industries in Israel, the United States, Europe and Asia.
  • Eltek also operates through its subsidiaries in North America and in Europe and by agents and distributors in Europe, India, South Africa and South America.

Global Fan-out Wafer Level Packaging Market to 2023: Market to Register a CAGR of 16% with Amkor Technology, ASE Technology, Samsung Electro-Mechanics, STATS ChipPAC & Taiwan Semiconductor Dominating

Retrieved on: 
Friday, December 14, 2018
Electronics manufacturing, Electronics, Semiconductor device fabrication, Electronic engineering, Microtechnology, Fan-out wafer-level packaging, Wafer-level packaging, Wafer, ASE Group

The fan-out wafer level packaging (FOWLP) market will register a CAGR of almost 16% by 2023.

Key Points: 
  • The fan-out wafer level packaging (FOWLP) market will register a CAGR of almost 16% by 2023.
  • The introduction of panel level packaging has reduced the overall cost of wafer level packaging.
  • The increasing demand for electronics across different industries will further drive the demand for panel level packaging and thereby boost fan-out wafer level packaging market growth.
  • Factors such as the growing demand for compactly designed electronics, will provide considerable growth opportunities to fan-out wafer level packaging (FOWLP) companies.

Global Market Report From IDTechEx Research on Stretchable and Conformal Electronics 2019-2029

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Thursday, December 13, 2018
Electronics manufacturing, Electronic engineering, Electromagnetism, Electrical engineering, Stretchable electronics, Emerging technologies, E-textiles, Printed circuit board

BOSTON, Dec. 13, 2018 /PRNewswire/ --The IDTechEx Research report ' Stretchable and Conformal Electronics 2019-2029 ' provides you with everything that you need to know about stretchable electronics.

Key Points: 
  • BOSTON, Dec. 13, 2018 /PRNewswire/ --The IDTechEx Research report ' Stretchable and Conformal Electronics 2019-2029 ' provides you with everything that you need to know about stretchable electronics.
  • Prominent options today include stretchable sensors and stretchable connectors (including conductive inks, yarns/cabling, stretchable PCBs and more).
  • Stretchable and Conformal Electronics 2019-2029 ' is the result of years of global primary research on stretchable electronics itself, but also on its constituent elements and target applications.
  • For example, IDTechEx analysts have covered topics such as conductive inks, in-mold electronics, electronic textiles, flexible/stretchable printed circuit boards, wearable technologies, stretchable sensors, stretchable transparent conductive films, structural electronics and more.

Wave Computing selects the Mentor Veloce Strato platform for verification and validation of artificial intelligence SoC designs

Retrieved on: 
Thursday, December 13, 2018
Verification, Emulation, Mentor Graphics, Emulator, Software verification, Electronic engineering, Design, Computer engineering

The Veloce Strato platform is a third-generation, data center-friendly emulation platform, and the only emulation solution available that enabled Wave Computing to tackle the verification of high-capacity AI designs from a hardware/software standpoint.

Key Points: 
  • The Veloce Strato platform is a third-generation, data center-friendly emulation platform, and the only emulation solution available that enabled Wave Computing to tackle the verification of high-capacity AI designs from a hardware/software standpoint.
  • After an extensive evaluation of multiple emulation solutions, Wave Computing selected the Veloce Strato platform for its capacity and scaling advantages, breadth of virtual use models, outstanding reliability, and determinism, or repeatability, of verification results.
  • "Wave Computing is revolutionizing artificial intelligence and deep learning with our dataflow technology-based solutions, which are pushing the boundaries of AI system design.
  • The Veloce Stratoroadmap not only addresses growing capacity needs, but it also maps to the diverse and expanding challenges of hardware/software verification and validation," said Darren Jones, vice president of Engineering, Wave Computing.

MarketsandMarkets forecasts the global GPU database market size to grow from USD 178 million in 2018 to USD 455 million by 2023, at a Compound Annual Growth Rate (CAGR) of 20.7% during 2018-2023

Retrieved on: 
Wednesday, December 12, 2018
Computer architecture, Economy, Graphics hardware, Electronic engineering, Coprocessors, GPGPU, Graphics processing unit, Virtual reality, BFSI, Compound annual growth rate, Retail

MarketsandMarkets forecasts the global GPU database market size to grow from USD 178 million in 2018 to USD 455 million by 2023, at a Compound Annual Growth Rate (CAGR) of 20.7% during 20182023.

Key Points: 
  • MarketsandMarkets forecasts the global GPU database market size to grow from USD 178 million in 2018 to USD 455 million by 2023, at a Compound Annual Growth Rate (CAGR) of 20.7% during 20182023.
  • Key driving factors for the market include massive data generation across BFSI, retail, and media and entertainment industry verticals.
  • However, the lack of understanding of the advantages of GPU database would limit the growth of the market.
  • The study includes in-depth competitive analysis of these key players in the GPU database market with their company profiles, recent developments, and key market strategies.