GPGPU

Think Silicon and Edge Impulse Democratize ML on NEOX® for Wearables and AIoT

Retrieved on: 
Tuesday, April 9, 2024
Health, Algorithm, GPU, Sport, Artificial intelligence of things, SAN, AI, Silicon, Machine learning, SDK, Collection, GPGPU, Hall, Medical device

ATHENS, Greece and SAN JOSE, Calif., April 08, 2024 (GLOBE NEWSWIRE) -- Think Silicon, the leading provider of ultra-low-power GPU and AI IP for embedded systems, and Edge Impulse, the leading platform for edge AI, announced a collaboration that integrates Think Silicon’s NEOX® AI SDK into the Edge Impulse platform.

Key Points: 
  • ATHENS, Greece and SAN JOSE, Calif., April 08, 2024 (GLOBE NEWSWIRE) -- Think Silicon, the leading provider of ultra-low-power GPU and AI IP for embedded systems, and Edge Impulse, the leading platform for edge AI, announced a collaboration that integrates Think Silicon’s NEOX® AI SDK into the Edge Impulse platform.
  • This enables machine learning (ML) developers to utilize the NEOX® | GA100 RISC-V GPGPU for sports, wellness, audio, gesture and vision-based AI applications on wearable and AIoT devices.
  • George Sidiropoulos, Managing Director at Think Silicon, said, “We are thrilled to be collaborating with Edge Impulse on enabling the ML community to deploy their algorithms on our newly launched NEOX® | GA100.
  • Think Silicon at Hall 4, Booth 476
    Edge Impulse at Hall 2, Booth 2-338

Think Silicon to Showcase its Latest Ultra-Low-Power 3D Graphics and AI in One IP Architecture at Embedded World 2024

Retrieved on: 
Wednesday, April 3, 2024
SOC, GPU, Sport, Rotation, Artificial intelligence of things, Memory, Library, Embedded, SAN, MCU, 3D, AI, Linux, Silicon, Architecture, Animation, VG, Lighting, SDK, Collection, GPGPU, TensorFlow, Video game

ATHENS, Greece and SAN JOSE, Calif., April 02, 2024 (GLOBE NEWSWIRE) -- Think Silicon, the leading provider of ultra-low-power GPU and AI IP for embedded systems, will showcase its latest graphics and AI solutions for edge computing devices in Hall 4, Booth 476 at Embedded World 2024 taking place in Nuremberg, Germany from April 9-11.

Key Points: 
  • ATHENS, Greece and SAN JOSE, Calif., April 02, 2024 (GLOBE NEWSWIRE) -- Think Silicon, the leading provider of ultra-low-power GPU and AI IP for embedded systems, will showcase its latest graphics and AI solutions for edge computing devices in Hall 4, Booth 476 at Embedded World 2024 taking place in Nuremberg, Germany from April 9-11.
  • Think Silicon’s NEOX® | GA100 is a GPGPU solution for the MCU market based on RISC-V, offering the unique combination of performing both 3D graphics and ΑΙ in one IP architecture.
  • The processor can be programmed using graphics and AI libraries independently or together.
  • Think Silicon’s experts will be available for meetings and demonstrations of the NEMA® and NEOX® product series at Embedded World.

VeriSilicon Showcased Its Latest Power-Efficient IP Applications at Embedded World 2024

Retrieved on: 
Tuesday, April 9, 2024
Telecommunications, Electronic Design Automation, Artificial Intelligence, Data Management, Consumer Electronics, Technology, IOT (Internet of Things), Semiconductor, Dai, Consumer electronics, BLE, IPS, Speech, Machine learning, GM, DSP, Bluetooth Low Energy, GPU, Drone, Internet of things, ISP, GUI, Embedded, Internet, Image, Smart camera, Silicon, Embedded system, Electronics, Home automation, Data center, Digital signal, Automotive Electronics Council, IP, NPU, Perception, VPU, Smart device, GPGPU, Central processing unit, Artificial intelligence, Hall, Video game

VeriSilicon (688521.SH) today announced its demonstration at Embedded World 2024 in Nuremberg, Germany, booth numbered Hall 4A-518, where it is showcasing customers’ various leading products leveraging the company’s latest technologies and advanced solutions.

Key Points: 
  • VeriSilicon (688521.SH) today announced its demonstration at Embedded World 2024 in Nuremberg, Germany, booth numbered Hall 4A-518, where it is showcasing customers’ various leading products leveraging the company’s latest technologies and advanced solutions.
  • IoT: VeriSilicon’s LE Audio compliant complete Bluetooth Low Energy IP solution, LE Mesh system solution based on VeriSilicon’s BLE technology.
  • Among the top ten IP companies globally, VeriSilicon’s number of IP categories ranks top two2.
  • “We are thrilled to present our latest and innovative IP solutions at Embedded World 2024.

DEEPX at MWC 2024: Advances Ultra-Low-Power On-Device AI Chip for Commercializing Generative AI

Retrieved on: 
Thursday, February 8, 2024
Graphics processing unit, Carbon, Telecommunications, Mobile, Algorithm, ChatGPT, AIS, CES, Hall, MWC, Intelligence, GPGPU, LLM, Science, EECP, Medical device

BARCELONA, Spain, Feb. 8, 2024 /PRNewswire/ -- DEEPX (CEO Lokwon, Kim), a frontrunner in AI chip technology, defines the critical technology for commercializing generative AI as the 'Federated Operation of LLM' and is advancing in its technology development. DEEPX is set to revolutionize on-device AI with its cutting-edge ultra-low-power AI chips and making a significant presence at the Mobile World Congress (MWC) 2024, held from February 26 to 29, where it will unveil a comprehensive blueprint for on-device AI and plans to expand partnerships with global collaborators. Currently, DEEPX is forging alliances with domestic and European telecommunications companies and global data center corporations, pushing for compatibility and optimization across network and cloud systems.

Key Points: 
  • - DEEPX, a pioneer in AI chip technology, is forging ahead in the development of next-generation products capable of real-time processing for generative AI and Large Language Models (LLMs), aiming to revolutionize on-device AI through ultra-low-power AI chips by 2025.
  • BARCELONA, Spain, Feb. 8, 2024 /PRNewswire/ -- DEEPX (CEO Lokwon, Kim), a frontrunner in AI chip technology, defines the critical technology for commercializing generative AI as the 'Federated Operation of LLM' and is advancing in its technology development.
  • Experience the future of on-device AI at DEEPX's MWC 2024 booth at Hall 7, 7A62-19
    Prior to MWC 2024, DEEPX achieved a significant milestone at CES by unveiling its first-generation on-device AI chip technology.
  • With these strengths as a foundation, DEEPX is poised to develop 'Federated Operation of LLM' as a decisive technology for commercializing generative AI.

DEEPX at MWC 2024: Advances Ultra-Low-Power On-Device AI Chip for Commercializing Generative AI

Retrieved on: 
Thursday, February 8, 2024
Graphics processing unit, Intelligence, ChatGPT, Science, CES, MWC, Carbon, LLM, Telecommunications, Hall, Mobile, EECP, GPGPU

BARCELONA, Spain, Feb. 8, 2024 /PRNewswire/ -- DEEPX (CEO Lokwon, Kim), a frontrunner in AI chip technology, defines the critical technology for commercializing generative AI as the 'Federated Operation of LLM' and is advancing in its technology development.

Key Points: 
  • BARCELONA, Spain, Feb. 8, 2024 /PRNewswire/ -- DEEPX (CEO Lokwon, Kim), a frontrunner in AI chip technology, defines the critical technology for commercializing generative AI as the 'Federated Operation of LLM' and is advancing in its technology development.
  • Currently, DEEPX is forging alliances with domestic and European telecommunications companies and global data center corporations, pushing for compatibility and optimization across network and cloud systems.
  • DEEPX's technological journey also includes the development of groundbreaking technology that enables the federated operation of server-scale AI and on-device large AI models.
  • DEEPX's visionary CEO, Lokwon Kim, stated, "DEEPX has gained international recognition for possessing global leading-edge core technology in power and cost efficiency for AI operation.

TYAN Upgrades HPC, AI and Data Center Solutions with the Power of 5th Gen Intel® Xeon® Scalable Processors

Retrieved on: 
Thursday, December 14, 2023
Emerald, GPU, M.2, OCP, Gen, GPGPU, DDR5, UPI, Tempest, PCI Express, LAN, Scalability, 2U, FH, DIMM, Thunder, Intel, EEB, MiTAC, SATA, IOPS, NVM Express, HPC, TCO, Memory, Xeon, Gigabit Ethernet, AI, TB, Video game, Computer data storage

Growing and excelling with workload-optimized performance, 5th Gen Intel Xeon delivers more compute power and faster memory within the same power envelope as the previous generation.

Key Points: 
  • Growing and excelling with workload-optimized performance, 5th Gen Intel Xeon delivers more compute power and faster memory within the same power envelope as the previous generation.
  • "By harnessing the capabilities of Intel's new Xeon CPUs, TYAN's 5th-Gen Intel Xeon-supported solutions are designed to handle the intense demands of HPC, data centers, and AI workloads.
  • In addition, TYAN offers Thunder HX FT65T-B7130 , the other deskside HPC platform providing balanced CPU/GPU computing architecture with dual 5th Generation Intel Xeon Scalable processor support.
  • In addition to server systems, TYAN provides upgraded motherboard solutions based on the latest 5th Gen Intel Xeon Scalable processor.

TYAN Upgrades HPC, AI and Data Center Solutions with the Power of 5th Gen Intel® Xeon® Scalable Processors

Retrieved on: 
Thursday, December 14, 2023
Emerald, GPU, M.2, OCP, Gen, GPGPU, DDR5, UPI, Tempest, PCI Express, LAN, Scalability, 2U, FH, DIMM, Thunder, Intel, EEB, MiTAC, SATA, IOPS, NVM Express, HPC, TCO, Memory, Xeon, Gigabit Ethernet, AI, TB, Video game, Computer data storage

Growing and excelling with workload-optimized performance, 5th Gen Intel Xeon delivers more compute power and faster memory within the same power envelope as the previous generation.

Key Points: 
  • Growing and excelling with workload-optimized performance, 5th Gen Intel Xeon delivers more compute power and faster memory within the same power envelope as the previous generation.
  • "By harnessing the capabilities of Intel's new Xeon CPUs, TYAN's 5th-Gen Intel Xeon-supported solutions are designed to handle the intense demands of HPC, data centers, and AI workloads.
  • In addition, TYAN offers Thunder HX FT65T-B7130 , the other deskside HPC platform providing balanced CPU/GPU computing architecture with dual 5th Generation Intel Xeon Scalable processor support.
  • In addition to server systems, TYAN provides upgraded motherboard solutions based on the latest 5th Gen Intel Xeon Scalable processor.

General Micro Systems (GMS) X9 Spider Mission Computer Powers Palm-Sized Handheld EW/SIGINT, RF-Enabled Cyber Products from Research Innovations, Inc.

Retrieved on: 
Monday, October 9, 2023
Networks, Other Defense, Hardware, Technology, Defense, Other Manufacturing, Homeland Security, Engineering, Audio, Video, Aerospace, Manufacturing, Public Policy, Government, VPX, M.2, Mitre, NVIDIA, Rain, Acquisition, Vibration, RII, Apple, AI, GMS, Mobile, Aircraft, CONUS, UAS, United States Department of Defense, COTS, Memory, GPGPU, RF, Artificial intelligence, Ministry of Research, Innovation and Science, CUDA, DDR4, EW, SIGINT, MTB, ATR, VME, USB4, War, Xeon W, Hand, Copper, SDR, Noise, Mitre Corporation, Thunderbolt (interface), Video game, Television, Printed circuit board, Tensor, Photon, Spider

RII has ordered the X9 Spider Mission Computer fully equipped with I/O and an NVIDIA® A4500 GPU.

Key Points: 
  • RII has ordered the X9 Spider Mission Computer fully equipped with I/O and an NVIDIA® A4500 GPU.
  • RII’s initial plans for the X9 Spider Mission Computer are for on-the-battlefield mobile, portable and vehicle-mounted use in classified EW / SIGINT applications.
  • The X9 Spider Mission Computer is about 2 x 4.75 x 6 inches, and literally fits in the palm of the hand.
  • X9 Spider Mission Computer now blows open the possibilities for EW / SIGINT RF cyber processing in previously unavailable ways.

General Micro Systems (GMS) Demonstrates X9 Spider Manpack Mobile, Rugged Tablet, X9 Artificial Intelligence Computer and Mission Computer at AUSA 2023

Retrieved on: 
Monday, October 9, 2023
Wearables, Mobile Technology, Aerospace, Government Technology, Manufacturing, Defense, Audio, Video, Other Technology, Other Defense, Artificial Intelligence, Networks, Hardware, Homeland Security, Data Management, Technology, Mobile, Wireless, Public Policy, Government, Military, Engineering, MP, Algorithm, Camera, Housing, USB, LAN, Human, SATCOM, AI, GAMER Manpack, Facial recognition, GMS, TB, Aluminium, Los Alamos National Laboratory, Blue force tracking, CoaXPress, Heart, CONUS, Carbon, HMD, Spider, GPGPU, GPS, RF, AUSA, NVIS, RMC, Artificial intelligence, EW, PCI Express, DCA, Thunderbolt (interface), Satellite navigation device, Video game, Instrumentation, Thunderbolt

At AUSA 2023 today (booth 8307), General Micro Systems unveiled multiple live demonstrations of its X9 Spider open distributed computing architecture (DCA) products, including the X9 Manpack, the X9 Thunderbolt Rugged Display, the X9 AI (artificial intelligence), and the X9 Mission Computer.

Key Points: 
  • At AUSA 2023 today (booth 8307), General Micro Systems unveiled multiple live demonstrations of its X9 Spider open distributed computing architecture (DCA) products, including the X9 Manpack, the X9 Thunderbolt Rugged Display, the X9 AI (artificial intelligence), and the X9 Mission Computer.
  • “Combining our X9 Spider Mission Computer with a manpack housing creates our X9 Spider Manpack computer,” said Ben Sharfi, CEO and Chief Architect of GMS.
  • The heart of the X9 Manpack and every host-based X9 Spider system, the X9 Spider Mission Computer offers nearly 400Gbits/s of maximum throughput I/O.
  • The AUSA 2023 demonstration shows the X9’s open distributed computing architecture (DCA) connected via LightBolt or Ethernet to several X9 peripherals, including X9 Workstation I/O, X9 Storage and X9 Switch.

Tachyum Unveils Path to Sustainable Green Datacenters

Retrieved on: 
Tuesday, July 25, 2023
Environment, Technology, Semiconductor, Alternative Energy, Green Technology, Energy, Internet, Hardware, Data Management, Artificial Intelligence, Graphics processing unit, IEA, Data, International Energy Agency, GPGPU, Nvidia, Central processing unit, TPU, Cloud computing, CAPEX, CPU, HPC, Reading, Intel, OPEX, AI, Universal, Economics, GPU, Cryptocurrency, Video game, Prodigy

A report by the International Energy Agency (IEA) indicates that 3% of global electricity use comes from data centers and data transmission networks.

Key Points: 
  • A report by the International Energy Agency (IEA) indicates that 3% of global electricity use comes from data centers and data transmission networks.
  • Data centers are expected to consume 20% of the world's energy supply by 2025 as the demand for digital services continues to grow.
  • “Keeping pace with the energy demands of today’s hyperscale data centers is simply not attainable,” said Dr. Radoslav Danilak, founder and CEO of Tachyum.
  • As a Universal Processor offering utility for all workloads, Prodigy-powered data center servers can seamlessly and dynamically switch between computational domains.