DDR3

Global DRAM (Dynamic Random Access Memory) DIMM (Dual In-Line Memory Module) Industry Research 2023-2033: Market to Grow by Over $30 Billion, Driven by Data Center, Cloud, AI Advancements - ResearchAndMarkets.com

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金曜日, 5月 3, 2024
Technology, Hardware, HPC, Internet of things, Synology, Virtual reality, Personal computer, DRAM, DIMM, Research, Artificial intelligence, Growth, Cloud computing, Engineering, VR, UDIMM, Electronics, Tablet, Renesas Electronics, DDR5, Luigi, Database, Esports, DDR4, DDR3, Health, Computer data storage

Technological advancements and increasing demand for high-performance computing devices drive the DRAM DIMM market to flourish.

Key Points: 
  • Technological advancements and increasing demand for high-performance computing devices drive the DRAM DIMM market to flourish.
  • The development of faster and more energy-efficient DRAM modules fuels demand from various sectors, including data centers, gaming, artificial intelligence, and automotive industries.
  • Some of the strategies adopted by DRAM DIMM manufacturers are new product launches, business expansions, mergers and acquisitions, partnerships, and collaborations.
  • The demand for DRAM DIMM modules in laptops and tablets is influenced by several factors, including technological advancements, consumer preferences, and industry trends.

GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment

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火曜日, 4月 30, 2024
ISO 14001, TSMC, VHDL, IP, TUV, Safety, LVDS, Certification, PCI Express, Verilog, IEC, ISO, ISO 9001, Original equipment manufacturer, MIPI, Environment, SystemVerilog, Field-programmable gate array, Memory, DDR3, Medical device

LONDON and GUANGZHOU, China, April 30, 2024 /PRNewswire/ -- GOWIN Semiconductor Corporation, the world's fastest-growing FPGA manufacturer, today announced that its GOWIN EDA FPGA design environment has been certified compliant with the ISO 26262 and IEC 61508 functional safety standards by the TUV testing laboratory.

Key Points: 
  • Certification of the FPGA design tool provides strong assurance to automotive OEMs that module designs featuring a GOWIN Arora-V (mid-density), Arora-II (low-/mid-density) or LittleBee (low-density) FPGA can meet the requirements for system-level functional safety specified in the ISO 26262 and IEC 61508 standards.
  • Existing quality and reliability certificates applicable to the GOWIN product range include IATF16949, ISO 9001, ISO 14001 and ISO/IEC 17025.
  • The GOWIN EDA FPGA design environment includes an FPGA design tool, IP cores and reference designs.
  • GOWIN's automotive-qualified FPGA product range and the GOWIN EDA development environment can be viewed at its stand 3A.340 at Embedded World (Nuremberg, Germany, 9-11 April 2024).

GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment

Retrieved on: 
火曜日, 4月 30, 2024
ISO 14001, TSMC, VHDL, IP, TUV, Safety, LVDS, Certification, PCI Express, Verilog, IEC, ISO, ISO 9001, Original equipment manufacturer, MIPI, Environment, SystemVerilog, Field-programmable gate array, Memory, DDR3, Medical device

LONDON and GUANGZHOU, China, April 30, 2024 /PRNewswire/ -- GOWIN Semiconductor Corporation, the world's fastest-growing FPGA manufacturer, today announced that its GOWIN EDA FPGA design environment has been certified compliant with the ISO 26262 and IEC 61508 functional safety standards by the TUV testing laboratory.

Key Points: 
  • Certification of the FPGA design tool provides strong assurance to automotive OEMs that module designs featuring a GOWIN Arora-V (mid-density), Arora-II (low-/mid-density) or LittleBee (low-density) FPGA can meet the requirements for system-level functional safety specified in the ISO 26262 and IEC 61508 standards.
  • Existing quality and reliability certificates applicable to the GOWIN product range include IATF16949, ISO 9001, ISO 14001 and ISO/IEC 17025.
  • The GOWIN EDA FPGA design environment includes an FPGA design tool, IP cores and reference designs.
  • GOWIN's automotive-qualified FPGA product range and the GOWIN EDA development environment can be viewed at its stand 3A.340 at Embedded World (Nuremberg, Germany, 9-11 April 2024).

Etron@CES 2024: The Future of AI-Powered Intelligence, Autonomy, Connectivity & Confidentiality

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水曜日, 12月 20, 2023
Confidentiality, VR, Long, GDPR, Central Hall, Consumer Electronics Show, Research, Robotics, Endoscopy, Electronics, USB, DDR3, Certification, Privacy, LAS, Data-rate units, Observation, LVCC, ISP, Diagnosis, CES, DRAM, Medical device

LAS VEGAS and TAIPEI, Dec. 20, 2023 /PRNewswire/ -- Etron Technology, Inc. (TPEx: 5351), the world's leading IC design company, is announcing its cutting-edge solutions that it will showcase at CES 2024 ‒ electronics with AI capabilities. With the parallel themes of Intelligence, Autonomy, Connectivity, and Confidentiality, the brand is demonstrating its relentless commitment to developing innovative products that enrich lives while advancing its vision of 'Shaping Tomorrow Today'. To experience Etron's demos and engage with in-house experts, visit CES Booth #15459, Central Hall at the LVCC, during January 9-12, CES 2024 period.

Key Points: 
  • With the parallel themes of Intelligence, Autonomy, Connectivity, and Confidentiality, the brand is demonstrating its relentless commitment to developing innovative products that enrich lives while advancing its vision of 'Shaping Tomorrow Today'.
  • DeCloak Intelligences, an Etron company, has been honored with the CES Innovation Awards for two consecutive years.
  • This year's recognition is attributed to its innovative privacy-centric facial recognition and monitoring solution - DeCloakVision.
  • Designed to operate on both cloud and edge computing platforms, it offers flexibility and scalability to meet diverse monitoring needs.

GOWIN Semiconductor Corporation Expands its Arora V FPGA Family with Advanced Features

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水曜日, 11月 1, 2023
Single, SRAM, MIPI, FPGA, DDR3, SSPI, MSPI, Arora, Growth, SerDes, CPU, SEU, JTAG, IP, CDR, PCI Express, SAN, Mobile phone, Computer data storage

SAN JOSE, Calif. and GUANGZHOU, China, Nov. 01, 2023 (GLOBE NEWSWIRE) -- GOWIN Semiconductor Corporation, recognized as the world's fastest-growing FPGA company, is excited to announce an expansion of its Arora V high-performance FPGA family.

Key Points: 
  • SAN JOSE, Calif. and GUANGZHOU, China, Nov. 01, 2023 (GLOBE NEWSWIRE) -- GOWIN Semiconductor Corporation, recognized as the world's fastest-growing FPGA company, is excited to announce an expansion of its Arora V high-performance FPGA family.
  • The new Arora V family not only complements the previous Arora family but also offers a significant performance boost with lower power consumption.
  • Specifically, the Arora V devices exhibit 30% higher performance and a remarkable 60% reduction in power consumption compared to the Arora GW2A family.
  • The new Arora V family also incorporates an advanced I/O structure capable of recovering received serial data containing an embedded clock using built-in CDR technology at each differential I/O pair.

Dynamic Random Access Memory (DRAM) Market to grow by USD 163.03 billion from 2022 to 2027, Growth Driven by Growth of smart cities- Technavio

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日曜日, 9月 24, 2023
Dynamic random-access memory, Graphics processing unit, Micron Technology, Fujitsu, STT, SK, DRAM, ISO, Internet of things, DDR3, Infineon Technologies, Intel, Electronics, Magneto, Central processing unit, MRAM, Computer, DDR5, Certification, DDR2, Personal computer, ICT, Analysis, RAM, Growth, City, Field-programmable gate array, Robotics, Texas Instruments, Geography, Video game, Computer data storage, Application-specific integrated circuit, DDR4

The potential growth difference for the dram market from 2022 to 2027 is USD 163.03 billion.

Key Points: 
  • The potential growth difference for the dram market from 2022 to 2027 is USD 163.03 billion.
  • The growth of smart cities is one of the key drivers supporting the growth of the dynamic random access memory market.
  • Get deeper insights into the market size, current market scenario, future growth opportunities, major growth driving factors, the latest trends, and more.
  • Buy the full report here
    Various upcoming and improved technologies that offer price benefits are one of the significant challenges restricting market growth.

Alliance Memory Signs Rep Agreement With Electra Sales to Support Customers in Upstate New York

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木曜日, 7月 13, 2023
SPI, Partnership, LPDDR2, SDR, NOR, MSDR, DDR, DRAM, Upstate New York, DDR3, ICS, Micron Technology, MultiMediaCard, SRAM Corporation, DDR2, DDR3L, SRAM, CMOS, EOL, Memory, Computer data storage, Video game, LPDDR4, DDR4, LPDDR

Under the agreement, the company is now offering Alliance Memory’s entire lineup of SRAM, DRAM, embedded multi-media card (eMMC), and flash memory ICs to its customers throughout Upstate New York.

Key Points: 
  • Under the agreement, the company is now offering Alliance Memory’s entire lineup of SRAM, DRAM, embedded multi-media card (eMMC), and flash memory ICs to its customers throughout Upstate New York.
  • Electra Sales has been providing consultative sales services for the Upstate New York market since 1972, with a territory that consists of all counties north of, and including, Orange and Putnam.
  • "In the dynamic and demanding marketplace of Upstate New York, Electra Sales has been a reliable source of customer-centric service for more than four decades," said Tom Gargan, director of sales for Canada, the Eastern U.S., and Brazil at Alliance Memory.
  • "At Electra Sales, we take pride in partnering with industry-leading manufacturers, and Alliance Memory undoubtedly fits that mold," said Mark Rogers, president and technical sales engineer at Electra Sales.

Global Automotive Memory Chip Market to 2027: Chinese Storage Suppliers Accelerate Deployment in the Promising Automotive Storage Market

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火曜日, 3月 28, 2023
Cloud, Communication, Counterpoint, DDR3, Original equipment manufacturer, L5, Temperature, Lidar, Continental, MMC, Memory, Flash memory, App, Powe, XPeng P7, Software, Integrated circuit, GigaDevice, GPS, QSPI, EEPROM, OBC, LPDDR5, Electronics, ISO, GDDR, TB, Ingenic Semiconductor, SK Hynix, PCI Express, MultiMediaCard, UFS, LPDDR, Car, Growth, Cloud computing, GB, Intellectual property, DDR, DRAM, LPDDR3, IVI, Micron Technology, SOC, WD, DDR2, VCU, Radar, CPU, GDDR6, RAM, L4, Samsung, Micrometre, Qualcomm, Flash, SSD, FOTA, SRAM, Reading, AI, EB, IDMS, Cryptocurrency, Electric battery, Computer data storage, Video game, Satellite navigation device, Lexar, L3, LPDDR4, ADAS

The global smart phone storage market size hit US$46 billion in 2021 when the global automotive storage market size reached about US$4.5 billion, which is only equivalent to 1/10 of the former.

Key Points: 
  • The global smart phone storage market size hit US$46 billion in 2021 when the global automotive storage market size reached about US$4.5 billion, which is only equivalent to 1/10 of the former.
  • By 2027, global automotive storage market size will exceed US$12.5 billion, with a CAGR of 18.6% from 2021 to 2027.
  • High-level autonomous vehicles have posed enormous demand for automotive memory capacity, density and bandwidth
    At present, main storage applications in automotive market include DRAM(DDR, LPDDR) and NAND (e.MMC and UFS, etc.).
  • 3.1 Memory Chip Application Scenario: Cockpit
    3.2 Memory Chip Application Scenario: Autonomous Driving
    3.3 Memory Chip Application Scenario: Driving Data Recording
    3.4 Memory Chip Application Scenarios: Cloud Computing and Storage

Global Automotive Memory Chip Industry Research Report 2022: Featuring Samsung, SK Hynix, Micron, Kioxia and Fujitsu Among Others - ResearchAndMarkets.com

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金曜日, 3月 24, 2023
Technology, Hardware, Integrated circuit, Communication, QSPI, DDR, DRAM, LPDDR5, LPDDR3, Electronics, ISO, GDDR, Software, TB, DDR3, IVI, SK Hynix, PCI Express, Samsung, Micrometre, L5, Qualcomm, Micron Technology, SOC, Flash, Lidar, SSD, MultiMediaCard, UFS, DDR2, MMC, FOTA, LPDDR, GDDR6, Flash memory, RAM, Reading, Growth, L4, GB, Computer data storage, Video game, L3, LPDDR4, ADAS

High-level autonomous vehicles have posed enormous demand for automotive memory capacity, density and bandwidth

Key Points: 
  • High-level autonomous vehicles have posed enormous demand for automotive memory capacity, density and bandwidth
    At present, main storage applications in automotive market include DRAM(DDR, LPDDR) and NAND (e.MMC and UFS, etc.).
  • Low-power LPDDR and NAND will be main growth engines, and the demand for NOR Flash, used for chip startup, will continue to increase.
  • Overseas storage vendors such as Micron, Samsung, SK Hynix and Microchip still dominate the development of the automotive storage industry as monopolists.
  • In 2021, Micron launched its industry-leading automotive LPDDR5 certified by ISO 26262 ASIL-D, with the maximum capacity of 128GB.

Winbond and STMicroelectronics partner to combine high-performance memory with STM32 devices in smart industrial and consumer applications

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水曜日, 3月 15, 2023
Cortex, STMicroelectronics, Electronics, Microprocessor, NYSE, Memory, MPU-401, MCU, Ecosystem, Partnership, RAM, DDR4, DRAM, Random-access memory, General-purpose, MPU, PCB, STM, Atari ST, SDR, DDR3, DDR, Family, STM32, Video game, Computer data storage, Winbond

The partnership formalizes collaboration between the two companies to optimize integration and performance and assure long-term availability of Winbond and ST devices, to meet the needs of customers serving industrial markets.

Key Points: 
  • The partnership formalizes collaboration between the two companies to optimize integration and performance and assure long-term availability of Winbond and ST devices, to meet the needs of customers serving industrial markets.
  • "This partnership means product developers can confidently integrate our memory with STM32 devices," said Tetsu Ho, Winbond DRAM Technology Manager.
  • The STM32 family is the market leader in MCUs and MPUs built on industry-standard Arm® Cortex 32-bit cores.
  • Winbond's DDR3 supports the MPU's memory buffer to enhance performance in applications such as industrial gateways, data concentrators, smart meters, barcode readers, smart-home devices, and numerous applications that require both high performance and state-of-the-art security.