UFS

Uncoated Freesheet (UFS) Market in the Americas Insights & Forecast 2024-2028, with International Paper, Suzano, Domtar, Sylvamo, Bio Pappel and Pixelle Specialty Solutions - ResearchAndMarkets.com

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月曜日, 5月 27, 2024
Forest Products, Natural Resources, International Paper, UFS, COVID-19, Health, Education, Growth, School, Urbanization, Communication, North, Domtar

The "Uncoated Freesheet (UFS) Market in Americas (North & Latin America): Insights & Forecast (2024-2028)" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Uncoated Freesheet (UFS) Market in Americas (North & Latin America): Insights & Forecast (2024-2028)" report has been added to ResearchAndMarkets.com's offering.
  • Americas uncoated freesheet market demand and capacity by region can be segmented as follows:
    In 2023, the dominant share of Americas uncoated freesheet market was held by North America, followed by Latin America.
  • In 2023, the dominant share of North America uncoated freesheet market was held by healthcare, followed by finance & insurance.
  • The Latin America uncoated freesheet market by end user can be segmented as follows: education, professional, communication, healthcare and other.

SK hynix Develops Next-Generation Mobile NAND Solution ZUFS 4.0

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木曜日, 5月 9, 2024
HBM, DRAM, AI, ICT, Zoning, Partnership, Collection, Smartphone, JEDEC, Data management, Memory, Flash memory, UFS, Medical device

Performance degradation over time improved, while lifetime increased by 40%

Key Points: 
  • Performance degradation over time improved, while lifetime increased by 40%
    SEOUL, South Korea, May 8, 2024 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com ) announced today that it has developed the Zoned UFS, or ZUFS* 4.0, a mobile NAND solution product for on-device** AI applications.
  • SK hynix said that the ZUFS 4.0, optimized for on-device AI from mobile devices such as smartphones, is the industry's best of its kind.
  • Following provision of the prototypes of ZUFS, SK hynix and the customer jointly developed the 4.0 product that qualifies the specifications by the Joint Electron Device Engineering Council, or JEDEC.
  • SK hynix will commence mass production of the ZUFS 4.0 in the third quarter with an aim to provide to various on-device AI smartphones by global companies.

Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms to Power AI in Vehicles

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水曜日, 4月 10, 2024
Ecosystem, Antirrhinum, SOC, Micrometre, Digital, ADAS, Artificial intelligence, Embedded, Intelligence, Qualcomm, Chassis, LPDDR5, LPDDR5X, UFS 3.1, Memory, SSD, UFS, Longevity, Socs, Computer data storage

This work between Micron and Qualcomm Technologies is aimed at helping the ecosystem build next-generation intelligent vehicles powered by sophisticated AI.

Key Points: 
  • This work between Micron and Qualcomm Technologies is aimed at helping the ecosystem build next-generation intelligent vehicles powered by sophisticated AI.
  • These automotive products are rigorously tested to provide the extreme stability, quality, thermal tolerances, reliability and longevity that the automotive market requires.
  • Micron’s automotive solutions will deliver powerful benefits for Qualcomm Technologies’ automotive customers and the broader ecosystem:
    Micron’s automotive LPDDR5X is the flagship memory solution for applications needing the fastest speeds and lowest power profile.
  • Together, these launches extend Micron’s automotive leadership and better empower the automotive ecosystem to usher vehicles into a new era of intelligence at the edge.

KIOXIA Sampling Latest Generation UFS Ver. 4.0 Embedded Flash Memory Devices

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火曜日, 4月 23, 2024
Electronic Design Automation, Data Management, Semiconductor, Technology, Mobile, Wireless, 5G, Hardware, App Store (iOS/iPadOS), JEDEC, UFS 3.1, BICS, Multimedia, Data-rate units, UFS, TB, UFS 4.0, Engineered wood

KIOXIA America, Inc. today announced that it has begun sampling1 the latest generation of its Universal Flash Storage2 (UFS) Ver.

Key Points: 
  • KIOXIA America, Inc. today announced that it has begun sampling1 the latest generation of its Universal Flash Storage2 (UFS) Ver.
  • 4.0 embedded flash memory devices.
  • 4.0 devices integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC standard package.
  • Maitry Dholakia, vice president, Memory Business Unit, for KIOXIA America, Inc. emphasized the company's ongoing leadership in UFS technology, stating, "The newest generation of our UFS 4.0 devices is a testament to our commitment to continually push performance boundaries – and make an improved user experience a reality."

Kioxia Sampling Latest Generation UFS Ver. 4.0 Embedded Flash Memory Devices

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火曜日, 4月 23, 2024
Semiconductor, Technology, Manufacturing, Mobile, Wireless, Other Manufacturing, Hardware, Sale, MIPI M-PHY, Corporation, Personal computer, Universal Flash Storage, UniPro, Toshiba, MIPI, App Store (iOS/iPadOS), Solid-state drive, JEDEC, Memory, UFS 3.1, BICS, Multimedia, Data-rate units, UFS, TB, UFS 4.0, Computer data storage

Kioxia Corporation , a world leader in memory solutions, today announced that it has begun sampling(1) the latest generation of its Universal Flash Storage(2) (UFS) Ver.

Key Points: 
  • Kioxia Corporation , a world leader in memory solutions, today announced that it has begun sampling(1) the latest generation of its Universal Flash Storage(2) (UFS) Ver.
  • 4.0 embedded flash memory devices (Graphic: Business Wire)
    The enhanced performance of the new UFS products provides optimal utilization of 5G connectivity, resulting in accelerated downloads, minimized latency, and an enhanced user experience.
  • 4.0 devices integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard package.
  • (2) Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification.

Nicolet Bankshares, Inc. Announces First Quarter 2024 Results

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火曜日, 4月 16, 2024
Professional Services, Other Professional Services, Finance, Asset Management, Banking, Personal Finance, Sale, Agriculture, Investment, FHLB, State, NIC, Treasury, Environment, Legislation, UFS, Growth

These non-core items positively impacted earnings per diluted common share $0.10 and $0.17 for first quarter 2024 and fourth quarter 2023, respectively, and negatively impacted earnings per diluted common share $2.06 for first quarter 2023.

Key Points: 
  • These non-core items positively impacted earnings per diluted common share $0.10 and $0.17 for first quarter 2024 and fourth quarter 2023, respectively, and negatively impacted earnings per diluted common share $2.06 for first quarter 2023.
  • Net interest income was $63 million for first quarter 2024, down $1 million from fourth quarter 2023.
  • The net interest margin for first quarter 2024 was 3.26%, down 4 bps from 3.30% for fourth quarter 2023.
  • Noninterest expense of $47 million for first quarter 2024 decreased $3 million from fourth quarter 2023.

Advantech Collaborates with Phison to Develop GenAI Computing Platform for Edge and Industrial Applications

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火曜日, 4月 16, 2024
Data Management, IOT (Internet of Things), Technology, Software, Artificial Intelligence, Internet, Hardware, Education, SDA, Artificial intelligence of things, SATA, AI, Partnership, ONFI, Intelligence, UFSA, NVIDIA, SSD, Graphics processing unit, Knowledge, IP, PCI-SIG, JEDEC, Robotics, Memory, Generative, Blog, Ecosystem, VRAM, Nature, SDK, Automotive industry, MultiMediaCard, Multimedia, NVM Express, UFS, USB, IEEE-SA, Internet of things, Edge, LLM, AMR, MIPI, Synthetic media, Electronics, GPU, Fourth Industrial Revolution, Health, Video game

Recognizing this trend, Advantech (2395TT), a global leader in edge computing, announced today a collaboration with Phison (8299TT), a leading provider of NAND controllers and NAND storage solutions, to jointly produce GenAI computing platforms tailored for edge and industrial applications.

Key Points: 
  • Recognizing this trend, Advantech (2395TT), a global leader in edge computing, announced today a collaboration with Phison (8299TT), a leading provider of NAND controllers and NAND storage solutions, to jointly produce GenAI computing platforms tailored for edge and industrial applications.
  • View the full release here: https://www.businesswire.com/news/home/20240416272737/en/
    Phison and Advantech develop GenAI computing platform for edge and industrial applications (Graphic: Phison)
    Leveraging Phison's exclusive patented aiDAPTIV+ technology and seamlessly integrating it with Advantech's Edge AI Solutions, our innovative GenAI computing platform empowers customers in the edge and industrial sectors to construct secure, reliable, and cost-effective computing devices for refining GenAI models.
  • Additionally, to meet the rising industrial Edge AI computing needs, we engage closely with various hardware, software, and application partners.
  • [About Advantech Edge AI Solutions] Advantech's Edge AI Solutions provide a range of platforms, offering scalable computing power and software toolkits for AI analytics at the edge.

Data I/O Announces Major Milestone with 500th PSV System Sale Ahead of IPC APEX Expo

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月曜日, 4月 8, 2024
Automotive Manufacturing, Semiconductor, Security, IOT (Internet of Things), Manufacturing, Vehicle Technology, Automotive, Other Technology, Medical Devices, Internet, Consumer Electronics, Technology, Mobile, Wireless, Other Manufacturing, Health, General Automotive, Engineering, Health Technology, UFS, ICS, Data I/O, Connex, Original equipment manufacturer, Partnership, Internet of things, 500th, Electronics, Sale, PSV, GitHub, Graph, Data-rate units, GraphQL, Family, IPC, Silicon, MQTT, Anaheim Convention Center, Video game

Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for microcontrollers, security ICs and memory devices, announced the Company has achieved a major milestone with the sale of the 500th PSV automated programming system.

Key Points: 
  • Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for microcontrollers, security ICs and memory devices, announced the Company has achieved a major milestone with the sale of the 500th PSV automated programming system.
  • Demonstrations of the PSV family will be available in Data I/O’s booth #3107 at the upcoming IPC APEX Expo in Anaheim, California from April 9th – 11th at the Anaheim Convention Center.
  • The PSV family helps them address these challenges,” said Anthony Ambrose, President and CEO at Data I/O Corporation.
  • Customers attending the IPC APEX Expo in Anaheim, California can visit Data I/O’s booth in booth #3107 to see these live product demonstrations.

Phison Collaborates with MediaTek to Propel Generative AI Computing and Services

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火曜日, 3月 26, 2024
Software, Hardware, Data Management, Consumer Electronics, Technology, Artificial Intelligence, Semiconductor, Security, Engineering, Automotive Manufacturing, Aerospace, Manufacturing, AOI, UFS, ONFI, Synthetic media, GPU, MediaTek, Assistant, Professor, SSD, MIPI, GAISF, SDA, DRAM, NVM Express, Knowledge, Blog, Carbon footprint, MultiMediaCard, AI, IEEE-SA, PCI-SIG, Life, JEDEC, Nature, Electronics, Architecture, USB, IP, Ecosystem, UFSA, Solid-state drive, Leonardo da Vinci, Multimedia, Media, Automotive industry, Generative, Medical device

Under the collaboration, Phison's cutting-edge AI computing service, aiDAPTIV+ , will pair with MediaTek's premier generative AI service platform, MediaTek DaVinci, heralding a new epoch for AI computing and application services and accelerating the adoption of generative AI in everyday life.

Key Points: 
  • Under the collaboration, Phison's cutting-edge AI computing service, aiDAPTIV+ , will pair with MediaTek's premier generative AI service platform, MediaTek DaVinci, heralding a new epoch for AI computing and application services and accelerating the adoption of generative AI in everyday life.
  • (Graphic: Phison)
    MediaTek DaVinci is an advanced, open platform for generative AI services, built on the Generative AI Service Framework (GAISF).
  • Phison's aiDAPTIV+ features a pioneering SSD-integrated AI computing architecture that breaks down large AI models for concurrent operation with SSDs.
  • "aiDAPTIV+ is set to revolutionize AI model fine-tuning, and MediaTek DaVinci has already made significant strides in AI services,” said Dr. Wei Lin, CTO, Phison.

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

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火曜日, 3月 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage