LPDDR4 | Jotup

SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product

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木曜日, 3月 28, 2024

SEOUL, South Korea , March 27, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the mass production of its 14nm AI Inference SoC Platform in collaboration with its lead partner Mobilint, an AI hardware and software solution startup based in South Korea. This marks SEMIFIVE's third commercialization of its SoC Platform solutions built on Samsung Foundry's mass production proven FinFET process technologies.

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SEOUL, South Korea , March 27, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the mass production of its 14nm AI Inference SoC Platform in collaboration with its lead partner Mobilint, an AI hardware and software solution startup based in South Korea.
This marks SEMIFIVE's third commercialization of its SoC Platform solutions built on Samsung Foundry's mass production proven FinFET process technologies.
Pre-verified and integrated, SEMIFIVE's 14nm AI Inference SoC Platform includes a quad-core high performance 64-bit CPU, 8 lanes of PCIe Gen4 and 4-channel LPDDR4 interfaces.
"We are proud to have collaborated with Mobilint, contributing to the rapid commercialization of AI semiconductors—a testament to the value of our AI SoC Platform.

Global Automotive Memory Chip and Storage Industry Report 2024: Evolution of Automotive DRAM - In the Era of Transformer Model, GDDR6 and HBM Develop Rapidly, and Storage Cost Shoots Up

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金曜日, 3月 15, 2024

Cloud, UFS, Micrometre, Intel, HBM, Flash memory, SOC, GPU, LPDDR4, SSD, Universal Flash Storage, BGA, SerDes, NVM Express, Research, CXL, AI, PCI Express, JEDEC, Memory, Samsung, PCB, GDDR6, FSD, UFS 4.0, PHY, Compute Express Link, Cloud computing, European, CPU, FPGA, SK Hynix, IPS, Rambus, Video game

DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

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DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
It is conceivable that by 2025, UFS 4.0 will become one of automotive storage standards, and will be applicable to different automotive EEAs.
Evolution of automotive DRAM: In the era of Transformer model, GDDR6 and HBM develop rapidly, and storage cost shoots up.
4.2 Memory Chip Application Scenario: Autonomous Driving
4.3 Memory Chip Application Scenario: Cockpit
4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
4.5 Memory Chip Application Scenario: Driving Data Recording
4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Lattice Continues Rapid Product Portfolio Expansion Enabling the Next Era of Innovation

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火曜日, 12月 5, 2023

Today at the Lattice Developers Conference , Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, continued its rapid product portfolio expansion with the launch of multiple new hardware and software solutions.

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Today at the Lattice Developers Conference , Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, continued its rapid product portfolio expansion with the launch of multiple new hardware and software solutions.
Lattice introduced two new innovative mid-range FPGA device families built on the award-winning mid-range Lattice Avant™ platform – Lattice Avant™-G and Lattice Avant™-X, designed for general purpose and advanced connectivity, respectively.
Lattice Avant-G and Avant-X FPGAs are sampling today and are supported by the latest releases of Lattice Propel™ and Lattice Radiant™ design software.
Lattice today announced four solution stack updates in AI with Lattice sensAI™, embedded vision with Lattice mVision™, security with Lattice Sentry™, and factory automation with Lattice Automate™.

The Octavo Systems OSDZU3 System-in-Package and OSDZU3-REF Development Platform Are in Production

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火曜日, 10月 31, 2023

Power management system, Linux, LPDDR4, Memory, Avnet, EEPROM, AMD, DisplayPort, Programmable logic device, Multiprocessor system on a chip, GPU, SATA, Integration, SIP, Video game, Computer data storage, Ethernet

The OSDZU3 System-in-Package, designed around the AMD Zynq® UltraScale+™ MPSoC, pushes the limits of what is possible with SiP integration.

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The OSDZU3 System-in-Package, designed around the AMD Zynq® UltraScale+™ MPSoC, pushes the limits of what is possible with SiP integration.
To accompany the OSDZU3 SiP and help customers to get started, Octavo Systems has also released the OSDZU3-REF development platform.
The OSDZU3-REF is an open-source development platform that comes with an OSDZU3 installed and as a 4-layer design.
Harley Walsh, President of Octavo Systems, expressed his enthusiasm, stating, "Getting the OSDZU3 into production is the culmination of relentless effort and dedication by our exceptional team.

AMD Accelerates Innovation at the Edge with Kria K24 SOM and Starter Kit for Industrial and Commercial Applications

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火曜日, 9月 19, 2023

ECC, K24, EV, Bed, AMD, DSP, Connector, LPDDR4, Temperature, SOM, MRI, Running, Ubuntu, K26, Robotics, STEM, Advanced Info Service, Python, Ecosystem, Silicon, SOM (missile), Environment, Integration, FPGA, Software, Video game, Rail transport, Kria, Docker

SANTA CLARA, Calif., Sept. 19, 2023 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today announced AMD Kria™ K24 System-on-Module (SOM) and KD240 Drives Starter Kit, the latest additions to the Kria portfolio of adaptive SOMs and developer kits. AMD Kria K24 SOM offers power-efficient compute in a small form factor and targets cost-sensitive industrial and commercial edge applications. Advanced InFO (Integrated Fan-Out) packaging makes the K24 half the size of a credit card while using half the power1 of the larger, connector-compatible Kria K26 SOM.

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AMD Kria K24 SOM offers power-efficient compute in a small form factor and targets cost-sensitive industrial and commercial edge applications.
Coupled with the KD240 Drives Starter Kit, an out-of-the-box-ready motor control-based development platform, the products offer a seamless path to production deployment with the K24 SOM.
With the launch of Kria™ K26 SOM, AMD introduced the first App Store for edge applications.
The K24 SOM (commercial and industrial versions) and KD240 Drives Starter Kit are available to order now via direct order and worldwide channel distributors.

WINSYSTEMS Announces Industrial COM Express® Type 6 Compact CPU Module Built on 11th Gen Intel® Core™ i3/i5/i7 Processors with RAM-Down Design

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木曜日, 8月 24, 2023

TPM, Internet of things, EDP, Vibration, USB, Compact, Shock, LPDDR4, PCI Express, LVDS, BIOS, LCD, HDMI, COM Express, SATA, COM, DisplayPort, RAM, Transport, Robotics, DVI, Mobile phone, Online shopping

GRAND PRAIRIE, Texas, Aug. 24, 2023 /PRNewswire/ -- American embedded computing leader WINSYSTEMS today debuted the latest entry in its well-received computer-on-module product line: the COMeT6-1100 COM Express® Type 6 Compact CPU module. Leveraging the 11th Gen Intel® Core™ i3/i5/i7 processors for industrial, IoT and embedded systems, this module offers up to four cores of high-performance processing in a low-power platform. And, with RAM soldered down, it ably handles applications running in environments subject to shock, vibration and extended temperatures.

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Leveraging the 11th Gen Intel® Core™ i3/i5/i7 processors for industrial, IoT and embedded systems, this module offers up to four cores of high-performance processing in a low-power platform.
The USA-made COMeT6-1100 module is fully compatible with any carrier board conforming to the PICMG® COM Express Type 6 standards.
Orders for the new COMeT6-1100 module with 11th Gen Intel® Core™ i7 embedded processor (UP3-class) are being accepted now.
By relying on WINSYSTEMS' expertise in embedded industrial computing systems, customers can be confident their applications are built using the optimal computer solution.

Alliance Memory 2Gb, 4Gb, 8Gb, and 16Gb LPDDR4X SDRAMs Combine Low-Voltage Operation of 0.6V With Fast Clock Speeds to 1.86GHz

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月曜日, 7月 17, 2023

ECC, Internet of things, AEC, AI, ADAS, LPDDR4X, LPDDR4, DDR SDRAM, FBGA, Life, Temperature, Electronics, CMOS, Video game

Offering an extension to the company’s fourth-generation LPDDR4 SDRAMs, the 2Gb AS4C128M16MD4V-062BAN, 4Gb AS4C256M16MD4V-062BAN, 8Gb AS4C512M16MD4V-053BIN, and 16Gb AS4C512M32MD4V-053BIN deliver ~50% lower power ratings in the 200-ball FBGA package for higher power efficiency.

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Offering an extension to the company’s fourth-generation LPDDR4 SDRAMs, the 2Gb AS4C128M16MD4V-062BAN, 4Gb AS4C256M16MD4V-062BAN, 8Gb AS4C512M16MD4V-053BIN, and 16Gb AS4C512M32MD4V-053BIN deliver ~50% lower power ratings in the 200-ball FBGA package for higher power efficiency.
Providing increased efficiency for advanced audio and ultra-high-resolution video in embedded applications, the LPDDR4X SDRAMs deliver fast clock speeds up to 1.86GHz for extremely high transfer rates of 3.7Gbps.
All four components provide fully synchronous operation; programmable read and write burst lengths of 16, 32, and on the fly; and selectable output drive strength.
Alliance Memory’s LPDDR4X SDRAMs provide reliable drop-in, pin-for-pin-compatible replacements for numerous similar solutions in high-bandwidth, high-performance memory system applications, eliminating the need for costly redesigns and part requalification.

Alliance Memory Signs Rep Agreement With Electra Sales to Support Customers in Upstate New York

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木曜日, 7月 13, 2023

SPI, Partnership, LPDDR2, SDR, NOR, MSDR, DDR, DRAM, Upstate New York, DDR3, ICS, Micron Technology, MultiMediaCard, SRAM Corporation, DDR2, DDR3L, SRAM, CMOS, EOL, Memory, Computer data storage, Video game, LPDDR4, DDR4, LPDDR

Under the agreement, the company is now offering Alliance Memory’s entire lineup of SRAM, DRAM, embedded multi-media card (eMMC), and flash memory ICs to its customers throughout Upstate New York.

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Under the agreement, the company is now offering Alliance Memory’s entire lineup of SRAM, DRAM, embedded multi-media card (eMMC), and flash memory ICs to its customers throughout Upstate New York.
Electra Sales has been providing consultative sales services for the Upstate New York market since 1972, with a territory that consists of all counties north of, and including, Orange and Putnam.
"In the dynamic and demanding marketplace of Upstate New York, Electra Sales has been a reliable source of customer-centric service for more than four decades," said Tom Gargan, director of sales for Canada, the Eastern U.S., and Brazil at Alliance Memory.
"At Electra Sales, we take pride in partnering with industry-leading manufacturers, and Alliance Memory undoubtedly fits that mold," said Mark Rogers, president and technical sales engineer at Electra Sales.

Renesas Introduces R-Car S4 Starter Kit That Enables Rapid Software Development for Automotive Gateway Systems

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火曜日, 7月 11, 2023

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a new development board for automotive gateway systems.

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Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a new development board for automotive gateway systems.
The R-Car S4 Starter Kit is a low-cost, readily available development board for building software using the Renesas R-Car S4 system on chip (SoC).
The new starter kit is a less-expensive and readily available option compared to the existing R-Car S4 Reference Board , which provides a full-scale development environment including an evaluation board and software.
Furthermore, Renesas provides the R-Car S4 Whitebox SDK, an open-source automotive development environment for the R-Car S4, which can be combined with the R-Car S4 Starter Kit.

Variscite Previews a i.MX 91 based System on Module at COMPUTEX

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火曜日, 5月 30, 2023

Variscite , a leading worldwide System on Module (SoM) designer, developer and manufacturer, today presented a working demonstration of the new VAR-SOM-MX91 at COMPUTEX 2023 conference in simultaneity with NXP ’s announcement of the i.MX 91 SoC.

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Variscite , a leading worldwide System on Module (SoM) designer, developer and manufacturer, today presented a working demonstration of the new VAR-SOM-MX91 at COMPUTEX 2023 conference in simultaneity with NXP ’s announcement of the i.MX 91 SoC.
The VAR-SOM-MX91 offers a cost-optimized solution for embedded designs in various applications such as IoT, smart home, connected sensors, industrial controllers, and metering.
“Variscite is pleased to leverage its early access to NXP's application processors by launching a SoM solution simultaneously with NXP’s release of the i.MX 91 processor.
We continue to set market benchmarks in terms of reliability, scalability and price,” said Ofer Austerlitz, VP Business Development and Sales of Variscite.