Intel Foundry Expands Support for Ansys Multiphysics Signoff Solutions with Intel 18A Process Technology
PITTSBURGH, Feb. 22, 2024 /PRNewswire/ -- Intel Foundry certified Ansys (NASDAQ: ANSS) multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 18A process technology with new RibbonFET transistor technology and backside power delivery.
- Ansys power integrity and on-chip electromagnetic analysis tools enable semiconductor products for HPC, graphics, and AI applications
Ansys® Redhawk-SC™ , Ansys® Totem™ , Ansys® PathFinder™ , and Ansys® RaptorX™ support power integrity, signal integrity, and reliability signoff requirements for the Intel 18A process technology
PITTSBURGH, Feb. 22, 2024 /PRNewswire/ -- Intel Foundry certified Ansys (NASDAQ: ANSS) multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 18A process technology with new RibbonFET transistor technology and backside power delivery. - Ansys RedHawk-SC and Totem are recognized as industry standards for power integrity signoff of digital and analog designs, respectively.
- "Intel Foundry and Ansys have partnered to ensure our customers have access to accurate analysis solutions for the latest manufacturing innovations in our Intel 18A process technology," said Rahul Goyal, vice president & general manager, product & design ecosystem enablement at Intel.
- "Ansys works with leading foundry partners like Intel Foundry to address complex multiphysics challenges and meet stringent power, performance, and reliability requirements," said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys.