Flash memory

SK hynix Develops Next-Generation Mobile NAND Solution ZUFS 4.0

Retrieved on: 
星期四, 五月 9, 2024
HBM, DRAM, AI, ICT, Zoning, Partnership, Collection, Smartphone, JEDEC, Data management, Memory, Flash memory, UFS, Medical device

Performance degradation over time improved, while lifetime increased by 40%

Key Points: 
  • Performance degradation over time improved, while lifetime increased by 40%
    SEOUL, South Korea, May 8, 2024 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com ) announced today that it has developed the Zoned UFS, or ZUFS* 4.0, a mobile NAND solution product for on-device** AI applications.
  • SK hynix said that the ZUFS 4.0, optimized for on-device AI from mobile devices such as smartphones, is the industry's best of its kind.
  • Following provision of the prototypes of ZUFS, SK hynix and the customer jointly developed the 4.0 product that qualifies the specifications by the Joint Electron Device Engineering Council, or JEDEC.
  • SK hynix will commence mass production of the ZUFS 4.0 in the third quarter with an aim to provide to various on-device AI smartphones by global companies.

SK hynix Announces 1Q24 Financial Results

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星期四, 四月 25, 2024
Landing slot, HBM, Investment, DRAM, PCI Express, QLC, Record, DDR5, Flash memory, Computer data storage

SK hynix forecasts the overall memory market to be on a steady growth path in coming months as demand for AI memory continues to rise, while the market for the conventional DRAM also starts to recover from the second half.

Key Points: 
  • SK hynix forecasts the overall memory market to be on a steady growth path in coming months as demand for AI memory continues to rise, while the market for the conventional DRAM also starts to recover from the second half.
  • For the NAND business, SK hynix will seek product optimization to sustain the trend of earnings recovery.
  • SK hynix will aggressively increase the sales of both high-performance 16-channel eSSD, an area where the company has a technological edge, and QLC-based high-capacity eSSD by its U.S. subsidiary Solidigm.
  • "We will continue to work towards improving our financial results by providing the industry's best performing products at a right time and maintaining the profitability-first commitment."

KLEVV UNVEILS THE CRAS C925 GEN4 M.2 SSD PACKED WITH ADVANCED STORAGE TECHNOLOGY

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星期二, 四月 16, 2024
ECC, PS5, SLIM, SRAM, M.2 SSD, United, HMB, AES, PCI, Amazon, IOPS, SSD, Temperature, TB, Flash memory, Longevity, LDPC, IDEAL, Video game

HONG KONG, April 15, 2024 /PRNewswire/ -- KLEVV, the premier consumer memory and storage brand of Essencore, is thrilled to introduce the brand-new CRAS C925 Gen4 M.2 SSD, a superior storage solution for gaming and content creation.

Key Points: 
  • The CRAS C925 M.2 SSD leverages the cutting-edge PCI Express® Gen4 x4 interface and NVMe™ 1.4 protocol to deliver astonishing data transfer speeds, significantly reducing load times and enhancing the overall computing experience.
  • Featuring an optional add-on aluminum heatsink for free installation, the CRAS C925 offers up to 12% temperature reduction, providing optimal performance and longevity.
  • Available in 500GB, 1TB, and 2TB capacities, the CRAS C925 utilizes strictly-selected 3D NAND Flash, offering ample storage for all your games, applications, and media.
  • Advanced SLC caching and HMB technology enhance endurance and performance, making it a robust solution for extensive data storage needs.

KLEVV UNVEILS THE CRAS C925 GEN4 M.2 SSD PACKED WITH ADVANCED STORAGE TECHNOLOGY

Retrieved on: 
星期二, 四月 16, 2024
ECC, PS5, SLIM, SRAM, M.2 SSD, United, HMB, AES, PCI, Amazon, IOPS, SSD, Temperature, TB, Flash memory, Longevity, LDPC, IDEAL, Video game

HONG KONG, April 15, 2024 /PRNewswire/ -- KLEVV, the premier consumer memory and storage brand of Essencore, is thrilled to introduce the brand-new CRAS C925 Gen4 M.2 SSD, a superior storage solution for gaming and content creation.

Key Points: 
  • The CRAS C925 M.2 SSD leverages the cutting-edge PCI Express® Gen4 x4 interface and NVMe™ 1.4 protocol to deliver astonishing data transfer speeds, significantly reducing load times and enhancing the overall computing experience.
  • Featuring an optional add-on aluminum heatsink for free installation, the CRAS C925 offers up to 12% temperature reduction, providing optimal performance and longevity.
  • Available in 500GB, 1TB, and 2TB capacities, the CRAS C925 utilizes strictly-selected 3D NAND Flash, offering ample storage for all your games, applications, and media.
  • Advanced SLC caching and HMB technology enhance endurance and performance, making it a robust solution for extensive data storage needs.

Kingston Digital Adds i-Temp SSDs to High-Quality Industrial Line

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星期一, 三月 25, 2024
Telecommunications, Networks, Internet, Hardware, Consumer Electronics, Technology, Semiconductor, Mobile, Wireless, Temperature, Flash memory, HDD, Digital, SSD, Agriculture, Trust, SATA, Sale, Memory, Flash, TB, Solid-state drive, Multimedia, Engineering, Computer data storage

These SSDs are designed for devices such as self-serve kiosks, digital signage, robots, point of sale, and military and agriculture applications among others.

Key Points: 
  • These SSDs are designed for devices such as self-serve kiosks, digital signage, robots, point of sale, and military and agriculture applications among others.
  • View the full release here: https://www.businesswire.com/news/home/20240325002828/en/
    Kingston adds line of Industrial Temp solid-state drives for applications that require a wider operating temperature range for extreme environments.
  • (Photo: Business Wire)
    With support for SATA interfaces, these industrial SSDs will be available in 128GB through 1TB capacities in industrial operating temperature range (-40°C to 85°C) to address climate-controlled and non-climate-controlled environments.
  • “When you work with Kingston, you’re provided quality products and access to our dedicated team of experts for industry-leading technical support,” said Ariel Perez, SSD business manager, Kingston.

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

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星期二, 三月 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Global Automotive Memory Chip and Storage Industry Report 2024: Evolution of Automotive DRAM - In the Era of Transformer Model, GDDR6 and HBM Develop Rapidly, and Storage Cost Shoots Up

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星期五, 三月 15, 2024
Cloud, UFS, Micrometre, Intel, HBM, Flash memory, SOC, GPU, LPDDR4, SSD, Universal Flash Storage, BGA, SerDes, NVM Express, Research, CXL, AI, PCI Express, JEDEC, Memory, Samsung, PCB, GDDR6, FSD, UFS 4.0, PHY, Compute Express Link, Cloud computing, European, CPU, FPGA, SK Hynix, IPS, Rambus, Video game

DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • It is conceivable that by 2025, UFS 4.0 will become one of automotive storage standards, and will be applicable to different automotive EEAs.
  • Evolution of automotive DRAM: In the era of Transformer model, GDDR6 and HBM develop rapidly, and storage cost shoots up.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Era of High-Resolution Recording Arrives: Phison Launches Specialized SSDs for Video and Surveillance Systems

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星期二, 二月 6, 2024
Technology, Semiconductor, Engineering, Security, Manufacturing, Audio, Video, Hardware, Data Management, Consumer Electronics, Nature, Multimedia, MIPI, Blog, Knowledge, PLP, Solid-state drive, Research, HDD, Noise, Flash memory, Automotive industry, MultiMediaCard, UFS, SDA, Electronics, CCTV, Temperature, SSD, USB, JEDEC, UFSA, ONFI, PCI-SIG, IP, IEEE-SA, NVM Express, TB, Computer data storage

View the full release here: https://www.businesswire.com/news/home/20240206502918/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20240206502918/en/
    High-Resolution Recording Era is Here: Phison Introduces Specialized SSD Solutions for Video and Surveillance Systems (Graphic: Phison)
    According to market research data, the global shipment volume of video and surveillance systems is approximately 35 million units annually.
  • While traditional mechanical hard drives (HDDs) have a price advantage, their speed performance has gradually become insufficient to meet the demands of high-resolution video recording.
  • As a result, the demand for SSDs in high-resolution video and surveillance systems is steadily increasing.
  • For more information on Phison's specialized SSD products for video and surveillance, please refer to this link here .

Phison Launches Full Range of UFS Storage Solutions for Unparalleled Mobile Storage Performance

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星期二, 一月 30, 2024
Hardware, Data Management, Consumer Electronics, Technology, Semiconductor, Mobile, Wireless, Other Technology, Security, ECC, Nature, Multimedia, MIPI, Blog, Knowledge, LDPC, History, Research, Flash memory, Universal Flash Storage, UFS, MultiMediaCard, SDA, Automotive industry, Electronics, SSD, USB, JEDEC, UFSA, Smartphone, ONFI, PCI-SIG, UFS 3.1, IP, IEEE-SA, Tablet, NVM Express, TB, Video game

Phison’s new UFS solutions support entry-level, middle, premium and flagship smartphone devices to achieve maximum performance in mobile storage and enhance user experiences.

Key Points: 
  • Phison’s new UFS solutions support entry-level, middle, premium and flagship smartphone devices to achieve maximum performance in mobile storage and enhance user experiences.
  • View the full release here: https://www.businesswire.com/news/home/20240130214428/en/
    Phison Launches Full Range of UFS Storage Solutions for Unparalleled Mobile Storage Performance (Image: Phison)
    As smartphone devices require higher performance, the storage devices of many entry-level 5G models have transitioned from eMMC to UFS 2.2 storage, and even flagship models of 4G phones have begun adopting the UFS 2.2 specification.
  • In response to the evolving storage requirements of smartphones, Phison has introduced the cost-effective UFS 2.2 controller PS8327 , offering the highest performance-to-cost ratio in history to meet the growing demand for high-speed mobile storage.
  • Phison’s comprehensive suite of UFS storage solutions provides many advantages, including cost-effectiveness, performance, and low power consumption for mobile devices.

Advantest Targets NAND Flash/NVM Market with New Group of Memory Test Products

Retrieved on: 
星期四, 十二月 7, 2023
Advantest, Flash memory, NVM, Head, PCI Express, Engineering, WLBI, Growth, BGA, Solid-state drive

TOKYO, Dec. 07, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced three new additions to its suite of memory test products.

Key Points: 
  • TOKYO, Dec. 07, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced three new additions to its suite of memory test products.
  • The new products include the T5230 memory wafer test solution; the STM32G third-generation protocol NAND system-level test module for the T5851 memory tester; and the T5835 high-speed wafer-sort interface option.
  • The T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST).
  • Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell.