Flash memory

Pliops Joins Industry Leaders at FMS to Deliver Game-Changing Insights for Data Infrastructure Optimization, Modern Workload Acceleration and Flash Investments

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星期三, 八月 2, 2023
Cloud, NVM Express, Database, Flash memory, Expert, High-performance Integrated Virtual Environment, XDP, SSD, Meta Data Services, Investment, SAN, AI, FMS, TCO, Solid-state drive, Computer data storage, Medical device, NoSQL

Running on the Pliops Extreme Data Processor (XDP), the portfolio of XDP Data Services includes XDP-RAIDplus, XDP-AccelDB and XDP-AccelKV.

Key Points: 
  • Running on the Pliops Extreme Data Processor (XDP), the portfolio of XDP Data Services includes XDP-RAIDplus, XDP-AccelDB and XDP-AccelKV.
  • These Data Services are designed to maximize data center infrastructure investments by exponentially increasing application performance, data reliability, storage capacity, and overall stack efficiency.
  • “FMS attendees seeking to maximize data center infrastructure investments should be sure to attend our multiple technical sessions,” said Ido Bukspan, Pliops CEO.
  • At FMS, Pliops will deliver three compelling technical presentations that demonstrate its dedication to shaping the future of data infrastructure optimization and workload acceleration.

Advantest to Showcase Latest Memory and SSD System-Level Test Solutions at Flash Memory Summit 2023

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星期三, 八月 2, 2023
NVM Express, CXL, DRAM, NAND, Flash memory, Advantest, PCI Express, Gen 5 Fibre Channel, ETC, Santa Clara Convention Center, DDR5, SSD, Gold, GDDR6, QA, Compute Express Link, ITC, Solid-state drive, Independent, TSE, Computer data storage

TOKYO, Aug. 02, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will showcase its latest storage and memory test solutions at Flash Memory Summit 2023 on Aug. 8-10 at the Santa Clara Convention Center in Santa Clara, California.

Key Points: 
  • TOKYO, Aug. 02, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will showcase its latest storage and memory test solutions at Flash Memory Summit 2023 on Aug. 8-10 at the Santa Clara Convention Center in Santa Clara, California.
  • Additionally, Advantest will display its inteXcell , the first-ever fully integrated and unified test infrastructure to combine broad test coverage with high-throughput handling.
  • The platform integrates the T5835 tester with minimal-footprint test cells for high-speed, parallel final test of up to 1,536 advanced memory ICs.
  • For the latest updates, visit the Advantest Facebook and LinkedIn page or follow @Advantest_ATE on Twitter for live tweets during events.

Teledyne LeCroy enables Validation Testing of Solid-State Storage Power and Sideband Capabilities

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星期二, 八月 1, 2023
Flash memory, API, Teledyne Technologies, Hyperscale computing, SSD, PCI, Module, EDSFF, CEM, Powerplus supercharger, Computer data storage, Video game

LOOMIS, Calif., Aug. 1, 2023 /PRNewswire/ -- Teledyne LeCroy, the worldwide leader in protocol test and measurement solutions, is pleased to announce availability of the OakGate R350-G5-PowerPlus™ 3U Rackmount Appliance for PCI Express® 5.0, with solid state drive (SSD) power and sideband test capabilities.

Key Points: 
  • Data centers and Hyperscaler's are measured on their power sustainability and power usage goals and require SSD vendors to test SSD performance during normal system shutdown, abnormal system shutdown, power surges, low and/or idle power states, and voltage fluctuations.
  • SSD vendors would ideally like these test results to highlight competitive product differentiators, often citing lower active power consumption, better power efficiencies and/or reduced cooling efficiencies.
  • For additional information, contact Teledyne LeCroy at 1-800-5LeCroy (1-800-553-2769) or visit Teledyne LeCroy's SSD Validation and Test Appliance landing page at OakGate SSD Validation Solutions .
  • You can also visit Teledyne LeCroy at the Flash Memory Summit 2023 in booth #919 from Aug 8-10 in Santa Clara, California to experience our line of OakGate PCIe Gen5 SSD Test Solutions!

NEO Semiconductor to Present Its Ground-Breaking 3D NAND and 3D DRAM Architectures in Keynote Address at Flash Memory Summit 2023

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星期三, 七月 26, 2023
PCM, DRAM, NAND, Flash memory, 3D, MRAM, RRAM, Locale (computer hardware), Local, SAN, RAM, AI, 3D NAND, Memory, NEO, Computer data storage

SAN JOSE, Calif., July 26, 2023 /PRNewswire/ -- NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced its participation at Flash Memory Summit 2023, taking place in person in Santa Clara, California, on August 8-10. CEO, Andy Hsu, will deliver a keynote address titled "New Architectures which will Drive Future 3D NAND and 3D DRAM Solutions" on August 9th at 11:40 a.m. Pacific Time. 

Key Points: 
  • CEO, Andy Hsu, will deliver a keynote address titled "New Architectures which will Drive Future 3D NAND and 3D DRAM Solutions" on August 9th at 11:40 a.m. Pacific Time.
  • 3D X-DRAM™ can be manufactured using the existing 3D NAND flash memory process with minor changes, significantly reducing the time and cost spent developing a new 3D process.
  • Also, Neo Semiconductor will show other new memory structures derived from 3D X-DRAM™ for 3D NOR flash memory, 3D Ferroelectric RAM (FFRAM), 3D Resistive RAM (RRAM), 3D Magnetoresistive RAM (MRAM), and 3D Phase Change Memory (PCM).
  • DRAM and NAND flash memory are two of the most important types of memory in computer and electronic systems.

NEO Semiconductor to Present Its Ground-Breaking 3D NAND and 3D DRAM Architectures in Keynote Address at Flash Memory Summit 2023

Retrieved on: 
星期三, 七月 26, 2023
PCM, DRAM, NAND, Flash memory, 3D, MRAM, RRAM, Locale (computer hardware), Local, SAN, RAM, AI, 3D NAND, Memory, NEO, Computer data storage

SAN JOSE, Calif., July 26, 2023 /PRNewswire/ -- NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced its participation at Flash Memory Summit 2023, taking place in person in Santa Clara, California, on August 8-10. CEO, Andy Hsu, will deliver a keynote address titled "New Architectures which will Drive Future 3D NAND and 3D DRAM Solutions" on August 9th at 11:40 a.m. Pacific Time. 

Key Points: 
  • CEO, Andy Hsu, will deliver a keynote address titled "New Architectures which will Drive Future 3D NAND and 3D DRAM Solutions" on August 9th at 11:40 a.m. Pacific Time.
  • 3D X-DRAM™ can be manufactured using the existing 3D NAND flash memory process with minor changes, significantly reducing the time and cost spent developing a new 3D process.
  • Also, Neo Semiconductor will show other new memory structures derived from 3D X-DRAM™ for 3D NOR flash memory, 3D Ferroelectric RAM (FFRAM), 3D Resistive RAM (RRAM), 3D Magnetoresistive RAM (MRAM), and 3D Phase Change Memory (PCM).
  • DRAM and NAND flash memory are two of the most important types of memory in computer and electronic systems.

Phison Launches Proprietary AI Service Solutions Expanding NAND Storages in the AI Applications

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星期二, 七月 18, 2023
Technology, Semiconductor, Automotive, General Automotive, Security, Software, Hardware, Data Management, Artificial Intelligence, Graphics processing unit, Instability, USB, Microsoft, Blog, Personal computer, Flash memory, Artificial intelligence, JEDEC, 3D NAND, Solid-state drive, Memory, Data science, SDA, National Yang Ming Chiao Tung University, ADLINK, AOI, SMT, Certification, MultiMediaCard, UFS, Car, Machine learning, Artificiality, IEEE-SA, Knowledge, Growth, Ben Goertzel, NVM Express, MIPI, DRAM, ONFI, ChatGPT, Electronics, Multimedia, IP, Assistant, UFSA, Algorithm, Fourth Industrial Revolution, PCI-SIG, NX, Research report, College, AMD, Intelligence, SSD, Nature, Science and technology in Asia, Architecture, AI, SD, GPU, Medical device, Video game, Computer data storage, Phison, Pacific Time Zone

Phison Electronics (8299 TT) , a global leader in NAND controllers and storage solutions, announced today the expansion of its IMAGIN+ service to include AI computational models and AI services solutions.

Key Points: 
  • Phison Electronics (8299 TT) , a global leader in NAND controllers and storage solutions, announced today the expansion of its IMAGIN+ service to include AI computational models and AI services solutions.
  • Phison’s aiDAPTIV+ utilizes Phison's innovative integration of SSDs into the AI computing framework and expands NAND storage solutions in the AI application market.
  • View the full release here: https://www.businesswire.com/news/home/20230717828347/en/
    Expanding NAND Storages in the AI Applications (Image: Phison)
    Phison has been a global leader deeply engaged in NAND controller innovations for more than 23 years.
  • In other words, the current hardware architecture for AI computing may already be insufficient to meet the future demands of AI applications.

World Non Volatile Memory Vendor Share Analysis Report 2023: Will the Oversupply Shift to a Rejuvenation of Demand by Late 2023 or 2024? - ResearchAndMarkets.com

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星期四, 六月 29, 2023
Technology, Data Management, Read-only memory, PCM, ASP, NOR, ASPS, Real-time clock, EPROM, NAND, Electronics, DRAM, RTC, Samsung, ICS, Winbond, MRAM, RRAM, NRAM, NvSRAM, OTP, NVSRAM, STMicroelectronics, SLC, Flash memory, Cypress, NVM, Non-volatile memory, 3D XPoint, NVRAM, Memory, Computer data storage, Video game, EEPROM, Flash, Infineon Technologies

The "Non Volatile Memory Market Shares by Vendor Report" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Non Volatile Memory Market Shares by Vendor Report" report has been added to ResearchAndMarkets.com's offering.
  • In addition, the NVSRAM market shares are broken out by vendor for Real Time Clocks (RTC) and NVSRAM from 2017-2022.
  • 2022 was a year of high inflation and downturn for Flash, DRAM and some Non Volatile Memory.
  • This report is vital for the seasoned memory professional as well as the casual market observer.

ATP Electronics Launches Industrial 176-Layer PCIe® Gen 4 x4 M.2, U.2 SSDs Offering Excellent R/W Performance, 7.68 TB Highest Capacity

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星期三, 六月 28, 2023
MCU, DRAM, NAND, GT, TB, ATP, S, Electronics, PCI Express, Temperature, Bit, U.2, SSD, ATP Electronics, QOS, PLP, TLC, Investment, WAI, Flash memory, Series, Quality of service, Workload, MP, 3D NAND, Longevity, IOPS, Solid-state drive, GB, Video game, Computer data storage

TAIPEI, Taiwan, June 28, 2023 (GLOBE NEWSWIRE) -- ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest high-speed N600 Series M.2 2280 and U.2 solid state drives (SSDs) sporting the 4th generation PCIe® interface and supporting the NVMe™ protocol. The new ATP PCIe Gen 4 SSDs’ 16 GT/s data rate is double that of the previous generation, translating to a bandwidth of 2 GB/s for every PCIe lane.

Key Points: 
  • The new ATP PCIe Gen 4 SSDs’ 16 GT/s data rate is double that of the previous generation, translating to a bandwidth of 2 GB/s for every PCIe lane.
  • The M.2 2280 SSDs are available in capacities from 240 GB up to 3.84 TB, while the U.2 SSDs are available from 960 GB to 7.68 TB for more cost-effective options for diverse storage requirements.
  • While there are newer iterations of NAND being released in 2XX+layers , these will focus on 1 Tbit and larger density sizes.
  • Depending on project support and customer request, ATP can provide hardware/firmware customization, thermal solutions customization, and engineering joint validation and collaboration.

Phison, the World’s First Independent Controller Supplier, Earns Automotive-SPICE CL3

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星期三, 六月 14, 2023
Technology, EV, Electric Vehicles, Semiconductor, Automotive, Vehicle Technology, Automotive Manufacturing, Manufacturing, Hardware, Autonomous Driving, Vehicles, NVM Express, MIPI, IATF, SDA, ONFI, Capability, ISO, USB, BGA, Electronics, Multimedia, Blog, IP, SSD, MultiMediaCard, UFS, Certification, Development, UFSA, Nature, Flash memory, IEEE-SA, Knowledge, JEDEC, PCI-SIG, ISO 26262, CL3, SD, Safety, Software, Video game, Satellite navigation device, Research, Phison

Phison has become the world’s first independent controller supplier for eMMC controllers to pass this automotive software/firmware development and verification process.

Key Points: 
  • Phison has become the world’s first independent controller supplier for eMMC controllers to pass this automotive software/firmware development and verification process.
  • View the full release here: https://www.businesswire.com/news/home/20230613264667/en/
    Phison, the world's first independent controller supplier, passes Automotive-SPICE CL3 (Image: Phison)
    “Phison has been investing in the development of automotive-grade NAND Controllers for over 10 years and is dedicated to innovating in the automotive storage market,” said C.S.
  • The ASPICE standard, Capability Level 3 (CL3) is currently the highest requirement for ASPICE known by global automakers.
  • In addition to passing the ASPICE CL3, Phison has also passed the ISO 26262 and AEC-Q100.

SK hynix Begins Mass Production of Industry's Highest 238-Layer 4D NAND

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星期四, 六月 8, 2023
Peripheral, PC, PCI Express, SK, Solid-state drive, Transfer (computing), NAND, Flash memory, Smartphone, SK Hynix, Video game, Computer data storage

Secures top-notch competitiveness in price, quality for NAND product

Key Points: 
  • Secures top-notch competitiveness in price, quality for NAND product
    SEOUL, South Korea, June 7, 2023 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com ) announced today that it has started mass production of its 238-layer 4D NAND Flash memory, following the development in August 2022, and that product compatibility test with a global smartphone manufacturer is underway.
  • "SK hynix has developed solution products for smartphones and client SSDs which are used as PC storage devices, adopting the 238-layer NAND technology, and has moved into mass production in May," the company said.
  • "Given that the company secured world-class competitiveness in price, performance and quality for both 238-layer NAND and the previous generation 176-layer NAND, we expect these products to drive earnings improvement in the second half of the year."
  • The 238-layer product – the smallest NAND in size – has a 34% higher manufacturing efficiency compared to the previous generation of 176-layer, resulting in a significant improvement in cost competitiveness.