Democratizing Access to Capital: Bond Expands Into Embedded Credit
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Thursday, October 21, 2021
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SAN FRANCISCO, Oct. 21, 2021 /PRNewswire/ -- Bond Financial Technologies, Inc. , the leading enterprise-grade platform for embedded finance, announces the availability of its latest product, Bond Embedded Credit.
Key Points:
- SAN FRANCISCO, Oct. 21, 2021 /PRNewswire/ -- Bond Financial Technologies, Inc. , the leading enterprise-grade platform for embedded finance, announces the availability of its latest product, Bond Embedded Credit.
- Embedded Credit, coupled with other Bond products such as Embedded Accounts, Embedded Cards, and Embedded Money Movement, creates the foundational building blocks that support a wide range of financial use cases.
- "The demand for embedded credit is incredibly strong," said Roy Andrew Ng, CEO and Co-founder of Bond.
- In addition, Bond currently has many companies on a waitlist looking to build and launch embedded credit solutions for their users.