ACM Research Significantly Improves Copper Plating Rate and Uniformity for Advanced Packaging Applications with New High-Speed Plating Technology
The new high-speed plating technology supports the Cu plating chamber with stronger mass transfer during the plating process.
- The new high-speed plating technology supports the Cu plating chamber with stronger mass transfer during the plating process.
- According to Mordor Intelligence, the fan-out packaging market is expected to witness a compound annual growth rate (CAGR) of 18% during the forecasted period (2021 - 2026).
- Wafers processed using this technology achieve wafer-level uniformity below 3%, an improvement over other approaches performance at the same plating rate.
- Contact ACM to learn more about its ECP ap tool and high-speed plating technology.