Fibocom Launches the Industry-first SC151-GL at MWC Shanghai 2023, Accelerating the Global 5G AIoT Commercialization with One Highly Integrated Smart Module

SHANGHAI, June 30, 2023 /PRNewswire/ -- Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the availability of SC151-GL at MWC Shanghai 2023. Based on the Qualcomm® QCM4490 Processor, Fibocom SC151-GL is the industry-first 5G smart module that supports mainstream frequency bands under 5G network architecture worldwide, which is crucial for customers that require global roaming on their devices to deploy the smart wireless solution faster, more efficient compared to the regional versions.