CHIP (programming language)

NextFlex Announces $6.5 Million in Funding for Flexible Hybrid Electronics Innovations in Extreme Environments and Sustainability

Retrieved on: 
Mardi, novembre 14, 2023

Project Call 8.0 emphasizes projects that address critical hybrid electronics manufacturing challenges, enabling the transition of FHE devices into applications that require superior performance and assured reliability.

Key Points: 
  • Project Call 8.0 emphasizes projects that address critical hybrid electronics manufacturing challenges, enabling the transition of FHE devices into applications that require superior performance and assured reliability.
  • Project Call 8.0 also focuses on using hybrid electronics manufacturing processes and materials to improve environmental sustainability in electronics manufacturing.
  • GE Research and Binghamton University for developing and demonstrating the reliability of additively packaged microelectromechanical systems inertia measurements units for harsh environments.
  • Iowa State University for validation and technology maturation of real-time process monitoring and control for aerosol jet printed electronics.

GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding

Retrieved on: 
Lundi, septembre 25, 2023

MALTA, N.Y., Sept. 25, 2023 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) announced today it has applied for U.S. CHIPS and Science Act Funding, with two full applications submitted to the CHIPS Program Office of the U.S. Department of Commerce.

Key Points: 
  • MALTA, N.Y., Sept. 25, 2023 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) announced today it has applied for U.S. CHIPS and Science Act Funding, with two full applications submitted to the CHIPS Program Office of the U.S. Department of Commerce.
  • The submitted applications are for capacity expansion and modernization of GF’s U.S. manufacturing facilities.
  • “As the leading manufacturer of essential semiconductors for the U.S. government, and a vital supplier to the automotive, aerospace and defense, IoT and other markets, GF has submitted our applications to the CHIPS Program Office to participate in the federal grants and investment tax credits enabled by the U.S. CHIPS and Science Act,” said Steven Grasso, senior director of global government affairs at GF.
  • GF-made essential chips are driving innovation, increasing power efficiency, and minimizing the total cost of ownership for products in high-growth markets including automotive, data center, IoT, aerospace and defense, and smart mobile.

EverGlade Consulting CHIPS Funding Alert: CHIPS Program Begins Accepting Pre-Applications for Large Supply Chain Projects

Retrieved on: 
Jeudi, septembre 7, 2023

CHARLESTON, S.C., Sept. 7, 2023 /PRNewswire/ -- In a move to secure America's leadership in the semiconductor sector, the U.S. Department of Commerce (DoC) announced on Friday, the start of its rolling pre-application process for large-scale supply chain projects and wafer manufacturing facilities. The projects that qualify must have capital investments exceeding $300 million. This initiative is part of the Comprehensive Highly-Integrated Program for Semiconductors (CHIPS) and aims to fortify the U.S. supply chain, advance technological innovation, and bolster national security.

Key Points: 
  • This initiative is part of the Comprehensive Highly-Integrated Program for Semiconductors (CHIPS) and aims to fortify the U.S. supply chain, advance technological innovation, and bolster national security.
  • Through the CHIPS Program, we are laying down the foundation for an invincible, state-of-the-art supply chain that ensures our national security.
  • "By opening the door to both large and small-scale projects, we're turbocharging America's supply chain and semiconductor innovation.
  • If your company has considered applying for CHIPS funding, EverGlade Consulting is the right partner to help make that application a reality.

Tusk Strategies Establishes CHIPS and Science Act Practice, Led by Biden Administration Alum Bernadette Carrillo

Retrieved on: 
Lundi, juillet 17, 2023

The practice group will be led by Managing Director Bernadette Carrillo , who joined the firm earlier this year after most recently serving as Director of Intergovernmental Affairs to Secretary Raimondo in the U.S. Department of Commerce.

Key Points: 
  • The practice group will be led by Managing Director Bernadette Carrillo , who joined the firm earlier this year after most recently serving as Director of Intergovernmental Affairs to Secretary Raimondo in the U.S. Department of Commerce.
  • In that role, Carrillo helped build the CHIPS program by advancing legislation on the Hill and through engagement with governors and with respect to how state and local incentives would factor into CHIPS implementation and funding applications.
  • Prior to her service in that role, Carrillo served as Director of Strategic Partnerships to Assistant Secretary of Economic Development Alejandra Castillo at the Economic Development Administration, a U.S. Department of Commerce bureau.
  • The firm was founded by venture capitalist, philanthropist and political strategist Bradley Tusk .

onsemi Commemorates Transfer of Ownership of East Fishkill, New York Facility from GlobalFoundries with Ribbon Cutting Ceremony

Retrieved on: 
Vendredi, février 10, 2023

The transaction added more than 1,000 world-class technologists and engineers to the onsemi team.

Key Points: 
  • The transaction added more than 1,000 world-class technologists and engineers to the onsemi team.
  • View the full release here: https://www.businesswire.com/news/home/20230210005319/en/
    Senate Majority Leader Chuck Schumer, alongside onsemi CEO Hassane El-Khoury and J.D.
  • Grom, Senior Advisor to the Secretary of Commerce, cut the ribbon at onsemi's inauguration celebration for their newly acquired East Fishkill site.
  • “onsemi appreciates Senate Majority Leader Schumer’s unwavering commitment to ensure American leadership in semiconductors and chip manufacturing investments in New York,” said Hassane El-Khoury, president and chief executive officer, onsemi.

DediProg Champions Universal ALL-IN-ONE, UFS-Ready Programming Solution

Retrieved on: 
Jeudi, avril 21, 2022

Industry norms usually nudge engineers towards collaboratively developing a "Universal Programmer"a single, universal IC-programmer that programs a wide range of IC devices.

Key Points: 
  • Industry norms usually nudge engineers towards collaboratively developing a "Universal Programmer"a single, universal IC-programmer that programs a wide range of IC devices.
  • DediProg has long noticed this cumbersome bottleneck and has therefore pioneered the NuProgPlus series.
  • It aims at unpicking the inflexibility of those cumbrous Dedicated Programmers, with the goal of making them flexibly universal, and prompt.
  • There are currently two main UFS programming architectures on the market: the highly scalable FPGA core architecture, and that aforementioned ASIC-device-to-UFS-chip configuration.