NextFlex Announces $6.5 Million in Funding for Flexible Hybrid Electronics Innovations in Extreme Environments and Sustainability
Project Call 8.0 emphasizes projects that address critical hybrid electronics manufacturing challenges, enabling the transition of FHE devices into applications that require superior performance and assured reliability.
- Project Call 8.0 emphasizes projects that address critical hybrid electronics manufacturing challenges, enabling the transition of FHE devices into applications that require superior performance and assured reliability.
- Project Call 8.0 also focuses on using hybrid electronics manufacturing processes and materials to improve environmental sustainability in electronics manufacturing.
- GE Research and Binghamton University for developing and demonstrating the reliability of additively packaged microelectromechanical systems inertia measurements units for harsh environments.
- Iowa State University for validation and technology maturation of real-time process monitoring and control for aerosol jet printed electronics.