Designability

Transphorm’s SuperGaN at PCIM 2024: Surpassing SiC and e-mode GaN Capabilities in High Power Systems

Retrieved on: 
Montag, Mai 20, 2024
Semiconductor, Technology, Manufacturing, Batteries, Other Manufacturing, Hardware, Gallium nitride, FET, FIT, Designability, Silicon, Renewable energy, CRPS, PSU, Industry Standard, Electric motor

Transphorm, Inc. (Nasdaq: TGAN), the global leader in robust GaN power semiconductors, announced today that its PCIM 2024 showcase will underscore its ability to outperform competitive wide bandgap technologies in higher power systems.

Key Points: 
  • Transphorm, Inc. (Nasdaq: TGAN), the global leader in robust GaN power semiconductors, announced today that its PCIM 2024 showcase will underscore its ability to outperform competitive wide bandgap technologies in higher power systems.
  • To learn more, visit Transphorm during PCIM in Hall 7, Stall 108 during June 11 to 13, 2024.
  • Transphorm SuperGaN FETs are in production in a wide range of customer products crossing the power spectrum from low 45 W power adapters to higher power 7.5 kW PSUs.
  • Learn more about how Transphorm’s GaN solutions outperform competitive technologies and enable cross-industry innovations during the Bodo’s Power Systems session.

Transphorm at APEC 2024: SuperGaN Innovation for Low to High Power Applications

Retrieved on: 
Dienstag, Februar 6, 2024
Apps, Applications, Mobile, Wireless, Technology, Security, Software, Networks, Internet, Hardware, Data Management, Artificial Intelligence, Designability, Silicon carbide, Physics, Microchip Technology, Booth, AEC, APEC, Transphorm, Gallium nitride, FIT, Shodan (website), Technical, MOSFET, Silicon, FET, FAE, JEDEC, Electric motor

Silver Partner Transphorm, Inc. (Nasdaq: TGAN)—a global leader in robust GaN power semiconductors—announced today that its APEC 2024 showcase will underscore the company’s continued leadership in broad spectrum (low to high power) GaN power conversion.

Key Points: 
  • Silver Partner Transphorm, Inc. (Nasdaq: TGAN)—a global leader in robust GaN power semiconductors—announced today that its APEC 2024 showcase will underscore the company’s continued leadership in broad spectrum (low to high power) GaN power conversion.
  • This year, Transphorm will highlight major innovation milestones to include the industry’s first 1200 V GaN-on-Sapphire device model and leading short circuit robustness .
  • Reliability: Still leading the industry with a current FIT rate of
  • Transphorm today supports the largest range of power conversion requirements (45 W to 10+ kW) across the widest range of power applications.

Transphorm at PCIM 2023: Superior GaN Solutions Powering Electric Vehicle Systems to Adapters

Retrieved on: 
Mittwoch, April 19, 2023
Semiconductor, Engineering, Automotive Manufacturing, Technology, Manufacturing, Hardware, EPI, Renewable resource, PD, FIT, SIP, APEC, Design for manufacturability, Industry Standard, Hall, TSMC, DSC, AEC, Silicon, FET, Gallium nitride, Video game, Transphorm, Designability

Devices on display will demonstrate Transphorm’s ability to support low to high power systems with GaN power conversion solutions offering unparalleled Manufacturability, Designability, Drivability, and Reliability.

Key Points: 
  • Devices on display will demonstrate Transphorm’s ability to support low to high power systems with GaN power conversion solutions offering unparalleled Manufacturability, Designability, Drivability, and Reliability.
  • And, at PCIM, Transphorm will again achieve a critical milestone by unveiling design resources for the 1200 V GaN device first demonstrated a year ago .
  • This device will complement the company’s already strong 650 V solutions enabling various electric vehicle applications.
  • Learn more about how Transphorm’s GaN platform impacts power systems across all power levels during the Bodo’s Power Systems session.

Transphorm at APEC 2023: New Technology, Trusted Performance in Action

Retrieved on: 
Donnerstag, März 2, 2023
Mobile, Wireless, Networks, Internet, Hardware, Electronic Design Automation, Data Management, Consumer Electronics, IOT (Internet of Things), Technology, Semiconductor, 5G, Other Technology, Telecommunications, Leyland Royal Tiger PSU, EPI, Microchip Technology, Designability, Transphorm, BOM, Shodan (website), HP, Gallium nitride, Booth, APEC, JEDEC, Silicon, FET, FIT, AEC, Electronics, Video game, Electric motor

Attendees can visit Transphorm at Booth 853 during the event on March 19 – 23.

Key Points: 
  • Attendees can visit Transphorm at Booth 853 during the event on March 19 – 23.
  • This year, Transphorm will showcase the recently announced WT7162RHUG24A device , the new SuperGaN® SiP developed with Weltrend Semiconductor designed to round out its already comprehensive, flexible FET portfolio.
  • APEC attendees will also learn about drop-in and replacement solutions for existing GaN power applications.
  • Finally, the company will raffle off a consumer product currently leveraging Transphorm’s GaN technology to deliver game-changing performance.